Phoenix, Arizona
United States
17
2022-07-21
The entities that hold a legal rights for patent applications filed by inventor Sobieski Daniel N.:
Daniel N. Sobieski from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Control of warpage using ABF GC cavity for embedded die package
#2 | 2020-08-06Control of warpage using ABF GC cavity for embedded die package
#3 | 2018-10-18Control of warpage using ABF GC cavity for embedded die package
#4 | 2017-12-21Method of fabricating a microelectronic substrate
#5 | 2017-03-30Hybrid pitch package with ultra high density interconnect capability
#6 | 2017-03-30Hybrid pitch package with ultra high density interconnect capability
#7 | 2016-11-10Integration of embedded thin film capacitors in package substrates
#8 | 2016-06-30Formation of dielectric with smooth surface
#9 | 2016-06-23Microelectronic substrates having copper alloy conductive route structures
#10 | 2016-03-24Method of forming an interference shield on a substrate
#11 | 2016-03-24Integration of embedded thin film capacitors in package substrates
#12 | 2016-03-24Control of warpage using ABF GC cavity for embedded die package
#13 | 2015-11-12Flexible microelectronic systems and methods of fabricating the same
#14 | 2015-10-01Thin film based electromagnetic interference shielding with BBUL/coreless packages
#15 | 2015-03-26Device, system and method for providing MEMS structures of a semiconductor package
#16 | 2014-12-04FORMATION OF DIELECTRIC WITH SMOOTH SURFACE
#17 | 2014-09-18Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer
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