Tokyo
Japan
16
2025-01-30
The entities that hold a legal rights for patent applications filed by inventor YAHAGI Mitsutoshi:
Mitsutoshi YAHAGI from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
PRE-WET MODULE
#2 | 2024-02-15Pre-wet module, deaerated liquid circulation system, and pre-wet method
#3 | 2022-12-01Pre-wet module, deaerated liquid circulation system, and pre-wet method
#4 | 2021-07-01LEAK CHECKING METHOD, LEAK CHECKING APPARATUS, ELECTROPLATING METHOD, AND ELECTROPLATING APPARATUS
#5 | 2020-01-09Leak checking method, leak checking apparatus, electroplating method, and electroplating apparatus
#6 | 2019-08-15Plating apparatus, plating method, and substrate holder
#7 | 2019-07-18Current measuring module using inspection substrate and inspection substrate
#8 | 2018-05-17Leak checking method, leak checking apparatus, electroplating method, and electroplating apparatus
#9 | 2017-03-02Plating apparatus, plating method, and substrate holder
#10 | 2016-12-22Anode holder and plating apparatus
#11 | 2016-09-08Plating apparatus
#12 | 2016-04-21Substrate holder and plating apparatus
#13 | 2015-10-01Anode unit and plating apparatus having such anode unit
#14 | 2015-09-03Substrate holder, plating apparatus, and plating method
#15 | 2014-12-11COPPER ELECTROPLATING APPARATUS
#16 | 2009-02-26Conducting belt for use with anode holder and anode holder
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