Inventor profile of:

Mitsutoshi YAHAGI

City:

Tokyo

Country:

Japan

Published Applications:

16

Last publication date:

2025-01-30

Top Assignees for applications by Mitsutoshi YAHAGI

The entities that hold a legal rights for patent applications filed by inventor YAHAGI Mitsutoshi:

Recent patent applications by YAHAGI Mitsutoshi

Mitsutoshi YAHAGI from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-01-30
US20250038014A1
Electricity

PRE-WET MODULE

#2 | 2024-02-15
US20240050992A1
Performing operations; transporting

Pre-wet module, deaerated liquid circulation system, and pre-wet method

#3 | 2022-12-01
US20220379352A1
Performing operations; transporting

Pre-wet module, deaerated liquid circulation system, and pre-wet method

#4 | 2021-07-01
US20210198800A1
Chemistry; metallurgy

LEAK CHECKING METHOD, LEAK CHECKING APPARATUS, ELECTROPLATING METHOD, AND ELECTROPLATING APPARATUS

#5 | 2020-01-09
US20200010972A1
Chemistry; metallurgy

Leak checking method, leak checking apparatus, electroplating method, and electroplating apparatus

#6 | 2019-08-15
US20190249326A1
Chemistry; metallurgy

Plating apparatus, plating method, and substrate holder

#7 | 2019-07-18
US20190219627A1
Physics

Current measuring module using inspection substrate and inspection substrate

#8 | 2018-05-17
US20180135198A1
Chemistry; metallurgy

Leak checking method, leak checking apparatus, electroplating method, and electroplating apparatus

#9 | 2017-03-02
US20170058423A1
Chemistry; metallurgy

Plating apparatus, plating method, and substrate holder

#10 | 2016-12-22
US20160369421A1
Chemistry; metallurgy

Anode holder and plating apparatus

#11 | 2016-09-08
US20160258080A1
Chemistry; metallurgy

Plating apparatus

#12 | 2016-04-21
US20160108539A1
Chemistry; metallurgy

Substrate holder and plating apparatus

#13 | 2015-10-01
US20150275390A1
Chemistry; metallurgy

Anode unit and plating apparatus having such anode unit

#14 | 2015-09-03
US20150247253A1
Chemistry; metallurgy

Substrate holder, plating apparatus, and plating method

#15 | 2014-12-11
US20140360865A1
Chemistry; metallurgy

COPPER ELECTROPLATING APPARATUS

#16 | 2009-02-26
US20090050473A1
Chemistry; metallurgy

Conducting belt for use with anode holder and anode holder

InventorID:

996266 ⎘