Shanghai
China
22
2019-05-23
The entities that hold a legal rights for patent applications filed by inventor Lu Ming-Chen:
Ming-Chen Lu from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
Wafer level chip scale package structure and manufacturing method thereof
#2 | 2018-01-04Wafer level chip scale package structure and manufacturing method thereof
#3 | 2017-06-29Power semiconductor device with small contact footprint and the preparation method
#4 | 2016-12-29Semiconductor package with small gate clip and assembly method
#5 | 2016-10-27Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures
#6 | 2016-04-07Embedded package and method thereof
#7 | 2016-03-31Power semiconductor device and the preparation method
#8 | 2016-03-31Semiconductor package with small gate clip and assembly method
#9 | 2016-01-26Top-exposed semiconductor package and the manufacturing method
#10 | 2015-12-10Power semiconductor device with small contact footprint and the preparation method
#11 | 2015-11-12Embedded package and method thereof
#12 | 2015-10-27Semiconductor package with small gate clip and assembly method
#13 | 2015-10-01Semiconductor device with thick bottom metal and preparation method thereof
#14 | 2015-08-20Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures
#15 | 2015-07-23Flip chip semiconductor device
#16 | 2015-07-02Preparation method of a thin power device
#17 | 2015-06-25Method of making stacked multi-chip packaging structure
#18 | 2015-02-10Stacked multi-chip bottom source semiconductor device and preparation method thereof
#19 | 2015-02-05Stacked multi-chip packaging structure and manufacturing method thereof
#20 | 2015-01-22Thin power device and preparation method thereof
#21 | 2014-12-11Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures
#22 | 2014-09-18Semiconductor device with thick bottom metal and preparation method thereof
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