Waterbury, Connecticut
United States
40
2025-06-26
39
2026-02-03
These are the the leading inventors for applications assigned to MacDermid Enthone Inc.:
MacDermid Enthone Inc. based in Waterbury, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
METHOD FOR IMPROVING ADHESION BETWEEN METALLIZATION LAYERS AND OZONE-ETCHED PLASTICS
#2 | 2025-04-03 ✅ Patent 12,553,134 granted on 2026-02-17Bendable Nickel Plating on Flexible Substrates
#3 | 2024-08-15 ✅ Patent 12,325,927 granted on 2025-06-10COMPLEX WAVEFORM FOR ELECTROLYTIC PLATING
#4 | 2024-07-04 ✅ Patent 12,635,082 granted on 2026-05-19Single Step Electrolytic Method of Filling Through-Holes in Printed Circuit Boards and Other Substrates
#5 | 2023-12-21 ✅ Patent 12,157,944 granted on 2024-12-03Method and wet chemical compositions for diffusion barrier formation
#6 | 2022-09-22 ✅ Patent 11,873,568 granted on 2024-01-16Compositions and methods for the electrodeposition of nanotwinned copper
#7 | 2022-08-18 ✅ Patent 11,846,018 granted on 2023-12-19Method and wet chemical compositions for diffusion barrier formation
#8 | 2022-06-02 ✅ Patent 11,643,742 granted on 2023-05-09Silver/tin electroplating bath and method of using the same
#9 | 2022-05-05 ✅ Patent 11,807,951 granted on 2023-11-07Cobalt chemistry for smooth topology
#10 | 2022-03-03 ✅ Patent 11,384,446 granted on 2022-07-12Compositions and methods for the electrodeposition of nanotwinned copper
#11 | 2022-03-03 ✅ Patent 12,270,121 granted on 2025-04-08Composition and method for fabrication of nickel interconnects
#12 | 2021-12-16 ✅ Patent 11,697,884 granted on 2023-07-11Copper deposition in wafer level packaging of integrated circuits
#13 | 2021-12-09 ✅ Patent 11,280,014 granted on 2022-03-22Silver/tin electroplating bath and method of using the same
#14 | 2021-10-28 ✅ Patent 11,401,618 granted on 2022-08-02Cobalt filling of interconnects
#15 | 2021-10-07 ✅ Patent 12,398,480 granted on 2025-08-26Leveler Compositions for use in Copper Deposition in Manufacture of Microelectronics
#16 | 2021-07-22 ✅ Patent 11,434,578 granted on 2022-09-06Cobalt filling of interconnects in microelectronics
#17 | 2021-06-17 ✅ Patent 11,230,778 granted on 2022-01-25Cobalt chemistry for smooth topology
#18 | 2021-05-06 ✅ Patent 11,746,433 granted on 2023-09-05Single step electrolytic method of filling through holes in printed circuit boards and other substrates
#19 | 2020-05-28 ✅ Patent 11,015,255 granted on 2021-05-25Selective plating of three dimensional surfaces to produce decorative and functional effects
#20 | 2020-05-07 ✅ Patent 10,988,854 granted on 2021-04-27Flexible color adjustment for dark Cr(III) platings
#21 | 2020-02-27 ✅ Patent 11,168,406 granted on 2021-11-09Leveler compositions for use in copper deposition in manufacture of microelectronics
#22 | 2020-02-06 ✅ Patent 10,995,417 granted on 2021-05-04Cobalt filling of interconnects in microelectronics
#23 | 2019-12-05 ✅ Patent 11,124,888 granted on 2021-09-21Copper deposition in wafer level packaging of integrated circuits
#24 | 2019-11-14 ✅ Patent 10,986,738 granted on 2021-04-20Carbon-based direct plating process
#25 | 2019-11-14 ✅ Patent 10,941,496 granted on 2021-03-09Near neutral pH pickle on multi-metals
#26 | 2019-10-15 ✅ Patent 10,443,135 granted on 2019-10-15Near neutral pH pickle on multi-metals
#27 | 2019-06-13 ✅ Patent 10,508,207 granted on 2019-12-17Compositions including a high molecular weight acid suitable for conductive polymer formation on dielectric substrate
#28 | 2019-03-28 ✅ Patent 10,828,668 granted on 2020-11-10Textured hardcoat films
#29 | 2019-03-21WATER SOLUBLE AND AIR STABLE PHOSPHAADAMANTANES AS STABILIZERS FOR ELECTROLESS METAL DEPOSITION
#30 | 2019-01-10 ✅ Patent 11,035,048 granted on 2021-06-15Cobalt filling of interconnects
#31 | 2019-01-03 ✅ Patent 10,221,496 granted on 2019-03-05Copper filling of through silicon vias
#32 | 2018-12-06 ✅ Patent 10,774,425 granted on 2020-09-15Elimination of H2S in immersion tin plating solution
#33 | 2018-09-20 ✅ Patent 10,544,516 granted on 2020-01-28Flexible color adjustment for dark Cr(III) platings
#34 | 2018-01-04 ✅ Patent 10,508,207 granted on 2019-12-17Compositions including a high molecular weight acid suitable for conductive polymer formation on dielectric substrate
#35 | 2017-08-17 ✅ Patent 10,519,557 granted on 2019-12-31Leveler compositions for use in copper deposition in manufacture of microelectronics
#36 | 2016-09-01 ✅ Patent 10,103,029 granted on 2018-10-16Process for filling vias in the microelectronics
#37 | 2016-08-04 ✅ Patent 10,081,876 granted on 2018-09-25Aqueous electrolyte composition having a reduced airborne emission, method and use of this composition
#38 | 2016-03-17 ✅ Patent 10,294,574 granted on 2019-05-21Levelers for copper deposition in microelectronics
#39 | 2014-05-01 ✅ Patent 10,541,140 granted on 2020-01-21Process for filling vias in the microelectronics
#40 | 2013-08-08 ✅ Patent 10,221,496 granted on 2019-03-05COPPER FILLING OF THROUGH SILICON VIAS
Also check out MacDermid Enthone Inc.'s (Waterbury, United States) applicant profile with 46 patent applications submitted.
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