Eric Rouya

City:

Oakland, California

Country:

United States

Published Applications:

Last publication date:

2024-01-18

Top Assignees for applications by Eric Rouya

The entities that hold a legal rights for patent applications filed by inventor Rouya Eric:

Eric Rouya from Oakland, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Copper Electrodeposition in Microelectronics

Cobalt filling of interconnects in microelectronics

Cobalt filling of interconnects in microelectronics

Copper Electrodeposition in Microelectronics

Levelers for copper deposition in microelectronics

InventorID:

1474523 ⎘