Madison, Connecticut
United States
18
2025-07-31
The entities that hold a legal rights for patent applications filed by inventor Paneccasio Vincent:
Vincent Paneccasio from Madison, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Composition and Method for Fabrication of Nickel Interconnects
#2 | 2016-09-01Process for filling vias in the microelectronics
#3 | 2010-11-11Copper deposition for filling features in manufacture of microelectronic devices
#4 | 2008-10-02COBALT CAPPING SURFACE PREPARATION IN MICROELECTRONICS MANUFACTURE
#5 | 2008-05-29Defect reduction in electrodeposited copper for semiconductor applications
#6 | 2008-04-17Manufacture of electroless cobalt deposition compositions for microelectronics applications
#7 | 2008-01-08Defect reduction in electrodeposited copper for semiconductor applications
#8 | 2007-12-20Copper electrodeposition in microelectronics
#9 | 2007-08-02Copper electrodeposition in microelectronics
#10 | 2007-03-22Defectivity and process control of electroless deposition in microelectronics applications
#11 | 2007-03-22Defectivity and process control of electroless deposition in microelectronics applications
#12 | 2007-03-22Defectivity and process control of electroless deposition in microelectronics applications
#13 | 2007-03-22Defectivity and process control of electroless deposition in microelectronics applications
#14 | 2006-12-14Cobalt electroless plating in microelectronic devices
#15 | 2006-06-29Copper electrodeposition in microelectronics
#16 | 2006-04-20Cobalt and nickel electroless plating in microelectronic devices
#17 | 2005-12-08Corrosion resistance enhancement of tin surfaces
#18 | 2005-03-03Copper electrodeposition in microelectronics
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