West Haven, Connecticut
United States
105
2019-01-03
75
2019-03-05
These are the the leading inventors for applications assigned to ENTHONE INC.:
ENTHONE INC. based in West Haven, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Copper filling of through silicon vias
#2 | 2016-05-05 ✅ Patent 9,657,402 granted on 2017-05-23Cyanide-free electrolyte composition and method for the deposition of silver or silver alloy layers on substrates
#3 | 2016-04-21 ✅ Patent 9,834,689 granted on 2017-12-05Aqueous stripping composition for metal surfaces
#4 | 2016-03-17 ✅ Patent 10,294,574 granted on 2019-05-21Levelers for copper deposition in microelectronics
#5 | 2016-02-04ELECTRODEPOSITION OF SILVER WITH FLUOROPOLYMER NANOPARTICLES
#6 | 2016-01-28 ✅ Patent 9,752,074 granted on 2017-09-05Chromium-free pickle for plastic surfaces
#7 | 2015-09-10 ✅ Patent 9,730,321 granted on 2017-08-08Silver plating in electronics manufacture
#8 | 2015-06-18 ✅ Patent 9,249,513 granted on 2016-02-02Beta-amino acid comprising plating formulation
#9 | 2014-10-30 ✅ Patent 9,613,858 granted on 2017-04-04Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
#10 | 2014-09-11 ✅ Patent 9,538,665 granted on 2017-01-03Process for electroless copper deposition on laser-direct structured substrates
#11 | 2014-06-12APPARATUS FOR ELECTROCHEMICAL DEPOSITION OF A METAL
#12 | 2014-06-05AQUEOUS SOLUTION AND METHOD FOR THE FORMATION OF A PASSIVATION LAYER
#13 | 2014-05-22 ✅ Patent 10,021,782 granted on 2018-07-10Composition and method for the deposition of conductive polymers on dielectric substrates
#14 | 2014-05-01 ✅ Patent 10,541,140 granted on 2020-01-21Process for filling vias in the microelectronics
#15 | 2014-04-17 ✅ Patent 9,493,884 granted on 2016-11-15Copper electrodeposition in microelectronics
#16 | 2014-01-30 ✅ Patent 9,338,896 granted on 2016-05-10Adhesion promotion in printed circuit boards
#17 | 2013-11-28 ✅ Patent 9,617,644 granted on 2017-04-11Method for direct metallization of non-conductive substrates
#18 | 2013-09-19 ✅ Patent 8,771,495 granted on 2014-07-08Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
#19 | 2013-08-08 ✅ Patent 10,221,496 granted on 2019-03-05COPPER FILLING OF THROUGH SILICON VIAS
#20 | 2013-07-18 ✅ Patent 8,986,434 granted on 2015-03-24Silver plating in electronics manufacture
#21 | 2013-05-23CORROSION-PROTECTIVE WAX COMPOSITION CONTAINING POLYANILINE IN A DOPED FORM AND A LIQUID PARAFFIN
#22 | 2013-03-28 ✅ Patent 9,040,117 granted on 2015-05-26Adhesion promotion in printed circuit boards
#23 | 2012-11-29ELECTROLYTE AND PROCESS FOR DEPOSITING A MATT METAL LAYER
#24 | 2012-11-15 ✅ Patent 8,906,217 granted on 2014-12-09Composite coatings for whisker reduction
#25 | 2012-11-01 ✅ Patent 8,323,741 granted on 2012-12-04Self assembled molecules on immersion silver coatings
#26 | 2012-07-12 ✅ Patent 8,703,243 granted on 2014-04-22Anti-tarnish coatings
#27 | 2012-07-05ADHESION PROMOTION OF METAL TO LAMINATE WITH MULTI-FUNCTIONAL MOLECULAR SYSTEM
#28 | 2012-06-21 ✅ Patent 8,962,070 granted on 2015-02-24Method for the deposition of a metal layer comprising a beta-amino acid
#29 | 2012-03-01 ✅ Patent 9,072,203 granted on 2015-06-30Solderability enhancement by silver immersion printed circuit board manufacture
#30 | 2012-02-23 ✅ Patent 8,608,933 granted on 2013-12-17Copper electrodeposition in microelectronics
#31 | 2011-11-17SOLDERABILITY ENHANCEMENT BY SILVER IMMERSION PRINTED CIRCUIT BOARD MANUFACTURE
#32 | 2011-11-10 ✅ Patent 9,222,189 granted on 2015-12-29Method for the post-treatment of metal layers
#33 | 2011-09-29ELECTROLYTE AND METHOD FOR DEPOSITION OF MATTE METAL LAYER
#34 | 2011-08-18METHOD FOR DEPOSITION OF HARD CHROME LAYERS
#35 | 2011-08-11SILVER IMMERSION PLATED PRINTED CIRCUIT BOARD
#36 | 2011-07-28 ✅ Patent 8,808,525 granted on 2014-08-19Cyanide free electrolyte composition for the galvanic deposition of a copper layer
#37 | 2011-06-16 ✅ Patent 9,023,228 granted on 2015-05-05Chromium-free pickle for plastic surfaces
#38 | 2011-04-28 ✅ Patent 9,175,400 granted on 2015-11-03Immersion tin silver plating in electronics manufacture
#39 | 2010-12-23CORROSION PROTECTION OF BRONZES
#40 | 2010-12-07 ✅ Patent 7,846,503 granted on 2010-12-07Process and electrolytes for deposition of metal layers
#41 | 2010-11-25 ✅ Patent 9,217,205 granted on 2015-12-22Electrolytic deposition of metal-based composite coatings comprising nano-particles
#42 | 2010-11-18 ✅ Patent 7,972,655 granted on 2011-07-05Anti-tarnish coatings
#43 | 2010-11-11 ✅ Patent 7,968,455 granted on 2011-06-28Copper deposition for filling features in manufacture of microelectronic devices
#44 | 2010-06-17 ✅ Patent 8,741,390 granted on 2014-06-03Metallic surface enhancement
#45 | 2010-05-27 ✅ Patent 8,388,824 granted on 2013-03-05Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
#46 | 2010-05-13 ✅ Patent 8,282,806 granted on 2012-10-09Galvanic bath and process for depositing zinc-based layers
#47 | 2010-03-25 ✅ Patent 7,998,859 granted on 2011-08-16Surface preparation process for damascene copper deposition
#48 | 2010-02-25 ✅ Patent 9,212,427 granted on 2015-12-15Cyanide-free electrolyte composition, and method for the deposition of silver or silver alloy layers on substrates
#49 | 2010-01-21 ✅ Patent 8,366,901 granted on 2013-02-05Deposition of conductive polymer and metallization of non-conductive substrates
#50 | 2009-12-31METHOD AND DEVICE FOR COATING SUBSTRATE SURFACES
#51 | 2009-06-18METROLOGY IN ELECTROLESS COBALT PLATING
#52 | 2009-06-11 ✅ Patent 8,226,807 granted on 2012-07-24Composite coatings for whisker reduction
#53 | 2009-06-11COMPOSITE COATINGS FOR WHISKER REDUCTION
#54 | 2009-05-14 ✅ Patent 8,216,645 granted on 2012-07-10Self assembled molecules on immersion silver coatings
#55 | 2009-02-05 ✅ Patent 7,670,950 granted on 2010-03-02Copper metallization of through silicon via
#56 | 2008-12-25 ✅ Patent 10,017,863 granted on 2018-07-10Corrosion protection of bronzes
#57 | 2008-12-11 ✅ Patent 8,192,607 granted on 2012-06-05Electrolyte and process for depositing a matt metal layer
#58 | 2008-10-23 ✅ Patent 7,883,738 granted on 2011-02-08Metallic surface enhancement
#59 | 2008-10-16SELF-INITIATED ALKALINE METAL ION FREE ELECTROLESS DEPOSITION COMPOSITION FOR THIN CO-BASED AND NI-BASED ALLOYS
#60 | 2008-10-02COBALT CAPPING SURFACE PREPARATION IN MICROELECTRONICS MANUFACTURE
#61 | 2008-07-10 ✅ Patent 7,794,531 granted on 2010-09-14Organic solderability preservative comprising high boiling temperature alcohol
#62 | 2008-05-29 ✅ Patent 9,222,188 granted on 2015-12-29Defect reduction in electrodeposited copper for semiconductor applications
#63 | 2008-05-22METHOD AND COMPOSITION FOR DIRECT METALLIZATION OF NON-CONDUCTIVE SUBSTRATES
#64 | 2008-05-15 ✅ Patent 8,435,398 granted on 2013-05-07Electrolyte composition and method for the deposition of a zinc-nickel alloy layer on a cast iron or steel substrate
#65 | 2008-04-17 ✅ Patent 7,704,306 granted on 2010-04-27Manufacture of electroless cobalt deposition compositions for microelectronics applications
#66 | 2008-01-08 ✅ Patent 7,316,772 granted on 2008-01-08Defect reduction in electrodeposited copper for semiconductor applications
#67 | 2007-12-27 ✅ Patent 7,393,781 granted on 2008-07-01Capping of metal interconnects in integrated circuit electronic devices
#68 | 2007-12-27 ✅ Patent 7,815,785 granted on 2010-10-19Direct metallization of electrically non-conductive polyimide substrate surfaces
#69 | 2007-12-20 ✅ Patent 7,815,786 granted on 2010-10-19Copper electrodeposition in microelectronics
#70 | 2007-10-04 ✅ Patent 7,682,432 granted on 2010-03-23Adhesion promotion in printed circuit boards
#71 | 2007-10-04 ✅ Patent 8,142,840 granted on 2012-03-27Adhesion promotion in printed circuit boards
#72 | 2007-08-02Copper electrodeposition in microelectronics
#73 | 2007-06-14PROCESS FOR DEPOSITION OF CRACK-FREE AND CORROSION-RESISTANT HARD CHROMIUM AND CHROMIUM ALLOY LAYERS
#74 | 2007-05-31 ✅ Patent 8,202,431 granted on 2012-06-19Method for removing impurities from a metal deposition process solution
#75 | 2007-05-03 ✅ Patent 7,578,947 granted on 2009-08-25Method for etching non-conductive substrate surfaces
#76 | 2007-03-22 ✅ Patent 7,615,491 granted on 2009-11-10Defectivity and process control of electroless deposition in microelectronics applications
#77 | 2007-03-22 ✅ Patent 7,611,987 granted on 2009-11-03Defectivity and process control of electroless deposition in microelectronics applications
#78 | 2007-03-22 ✅ Patent 7,410,899 granted on 2008-08-12Defectivity and process control of electroless deposition in microelectronics applications
#79 | 2007-03-22 ✅ Patent 7,611,988 granted on 2009-11-03Defectivity and process control of electroless deposition in microelectronics applications
#80 | 2007-02-15 ✅ Patent 7,713,859 granted on 2010-05-11Tin-silver solder bumping in electronics manufacture
#81 | 2007-01-18METHOD FOR COATING METAL SURFACES WITH CORROSION INHIBITING POLYMER LAYERS
#82 | 2006-12-14METHOD FOR DIRECT METALLIZATION OF NON-CONDUCTING SUBSTRATES
#83 | 2006-12-14Cobalt electroless plating in microelectronic devices
#84 | 2006-12-07ELECTROPLATING PROCESS AND COMPOSITION
#85 | 2006-11-30 ✅ Patent 7,846,316 granted on 2010-12-07Method for supplying a plating composition with deposition metal ion during a plating operation
#86 | 2006-11-23METHOD FOR COATING METAL SURFACES WITH CORROSION INHIBITING POLYMER LAYERS
#87 | 2006-11-23METHOD FOR ELECTRODEPOSITION OF BRONZES
#88 | 2006-10-12 ✅ Patent 7,666,283 granted on 2010-02-23Insoluble anode
#89 | 2006-08-24Cobalt self-initiated electroless via fill for stacked memory cells
#90 | 2006-06-29 ✅ Patent 7,303,992 granted on 2007-12-04Copper electrodeposition in microelectronics
#91 | 2006-06-29Method for bronze galvanic coating
#92 | 2006-04-20 ✅ Patent 7,332,193 granted on 2008-02-19Cobalt and nickel electroless plating in microelectronic devices
#93 | 2006-03-09Method for the electrolytic deposition of metals
#94 | 2006-02-02 ✅ Patent 8,349,393 granted on 2013-01-08Silver plating in electronics manufacture
#95 | 2005-12-15 ✅ Patent 7,268,074 granted on 2007-09-11Capping of metal interconnects in integrated circuit electronic devices
#96 | 2005-12-01Method for metallizing plastic surfaces
#97 | 2005-12-01Method for electrodeposition of bronzes
#98 | 2005-10-13 ✅ Patent 7,578,888 granted on 2009-08-25Method for treating laser-structured plastic surfaces
#99 | 2005-09-08 ✅ Patent 8,057,678 granted on 2011-11-15Maintenance of metallization baths
#100 | 2005-05-24 ✅ Patent 6,897,152 granted on 2005-05-24Copper bath composition for electroless and/or electrolytic filling of vias and trenches for integrated circuit fabrication
Also check out Enthone Inc.'s (West Haven, United States) applicant profile with 10 patent applications submitted.
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