Assignee profile:

Peter Wolters GmbH

City:

Rendsburg

Country:

Germany

Published Applications:

11

Last publication date:

2012-11-22

Patent Grants:

7

Last grant date:

2015-02-10

Top Inventors for applications by Peter Wolters GmbH

These are the the leading inventors for applications assigned to Peter Wolters GmbH:

Recent patent applications by Peter Wolters GmbH

Peter Wolters GmbH based in Rendsburg, DE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2012-11-22
US20120293811A1
Performing operations; transporting

Device and Method for Determining the Position of a Working Surface of a Working Disc

#2 | 2012-08-30
US20120220197A1
Performing operations; transporting

Device and Method for the Double-Sided Processing of Flat Work Pieces

#3 | 2012-06-28 βœ… Patent 8,951,096 granted on 2015-02-10
US20120164919A1
Performing operations; transporting

Method for machining flat workpieces

#4 | 2012-03-01
US20120052771A1
Performing operations; transporting

Method For the Material-Removing Machining of Very Thin Work Pieces in a Double Sided Grinding Machine

#5 | 2011-12-08 βœ… Patent 9,004,981 granted on 2015-04-14
US20110300785A1
Performing operations; transporting

Apparatus for double-sided, grinding machining of flat workpieces

#6 | 2011-09-15
US20110222071A1
Physics

METHOD FOR MEASURING THE THICKNESS OF A DISCOIDAL WORKPIECE

#7 | 2010-04-22 βœ… Patent 8,512,099 granted on 2013-08-20
US20100099337A1
Performing operations; transporting

Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers

#8 | 2009-04-23 βœ… Patent 9,539,695 granted on 2017-01-10
US20090104852A1
Performing operations; transporting

Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers

#9 | 2008-12-11 βœ… Patent 7,963,823 granted on 2011-06-21
US20080304929A1
Performing operations; transporting

Machining machine with means for acquiring machining parameters

#10 | 2008-09-25 βœ… Patent 8,113,913 granted on 2012-02-14
US20080233840A1
Performing operations; transporting

Method for the simultaneous grinding of a plurality of semiconductor wafers

#11 | 2008-01-17 βœ… Patent 7,815,489 granted on 2010-10-19
US20080014839A1
Performing operations; transporting

Method for the simultaneous double-side grinding of a plurality of semiconductor wafers

AssigneeID:

177533 ⎘