Burghausen
Germany
28
2024-07-11
The entities that hold a legal rights for patent applications filed by inventor Pietsch Georg:
Georg Pietsch from Burghausen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICONDUCTOR MATERIAL
#2 | 2024-04-25METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICONDUCTOR MATERIAL
#3 | 2023-10-05Method and apparatus for simultaneously slicing a multiplicity of slices from a workpiece
#4 | 2023-02-16METHOD FOR SEPARATING MULTIPLE SLICES OF WORKPIECES BY MEANS OF A WIRE SAW DURING A SEQUENCE OF SEPARATION PROCESSES
#5 | 2022-07-28METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES DURING A NUMBER OF SEPARATING PROCESSES BY MEANS OF A WIRE SAW, AND SEMICONDUCTOR WAFER MADE OF MONOCRYSTALLINE SILICON
#6 | 2020-01-16Wire saw, wire guide roll and method for simultaneously cutting a multiplicity of wafers from an ingot
#7 | 2015-11-05Method for simultaneously cutting a multiplicity of slices of particularly uniform thickness from a workpiece
#8 | 2015-03-26Method for simultaneously cutting a multiplicity of wafers from a workpiece
#9 | 2014-06-19Method and apparatus for trimming the working layers of a double-side grinding apparatus
#10 | 2014-06-19Method for trimming the working layers of a double-side grinding apparatus
#11 | 2013-08-15Apparatus and method for simultaneously slicing a multiplicity of slices from a workpiece
#12 | 2013-03-21Method for the simultaneous double-side material-removing processing of at least three workpieces
#13 | 2013-01-10Device and method for buffer-storing a multiplicity of wafer-type workpieces
#14 | 2012-07-26Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafers
#15 | 2012-07-26Method for providing a respective flat working layer on each of the two working disks of a double-side processing apparatus
#16 | 2012-06-21Method for the simultaneous material-removing processing of both sides of at least three semiconductor wafers
#17 | 2012-02-02Method for trimming the working layers of a double-side grinding apparatus
#18 | 2011-06-09METHOD FOR PRODUCING A SEMICONDUCTOR WAFER
#19 | 2011-04-28Method for producing a semiconductor wafer
#20 | 2010-12-23Methods for producing and processing semiconductor wafers
#21 | 2010-04-22Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers
#22 | 2009-08-13Semiconductor wafer, apparatus and process for producing the semiconductor wafer
#23 | 2009-04-23Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers
#24 | 2009-01-29Method for polishing a substrate composed of semiconductor material
#25 | 2008-10-30Methods for the single-sided polishing of semiconductor wafers and semiconductor wafer having a relaxed Si1-x GEx Layer
#26 | 2008-09-25Method for the simultaneous grinding of a plurality of semiconductor wafers
#27 | 2008-01-17Method for the simultaneous double-side grinding of a plurality of semiconductor wafers
#28 | 2005-08-11Semiconductor wafer, apparatus and process for producing the semiconductor wafer
26550 ⎘