Burghausen
Germany
16
2024-11-14
The entities that hold a legal rights for patent applications filed by inventor Kerstan Michael:
Michael Kerstan from Burghausen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD FOR GRINDING SEMICONDUCTOR WAFERS
#2 | 2023-05-25METHOD FOR GRINDING SEMICONDUCTOR WAFERS
#3 | 2014-06-19Method and apparatus for trimming the working layers of a double-side grinding apparatus
#4 | 2014-06-19Method for trimming the working layers of a double-side grinding apparatus
#5 | 2012-07-26Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafers
#6 | 2012-02-02Method for trimming the working layers of a double-side grinding apparatus
#7 | 2011-09-15Method for polishing a semiconductor wafer
#8 | 2011-07-28Method for producing a semiconductor wafer
#9 | 2011-04-28Method for producing a semiconductor wafer
#10 | 2010-04-22Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers
#11 | 2009-08-13Semiconductor wafer, apparatus and process for producing the semiconductor wafer
#12 | 2009-04-23Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers
#13 | 2008-09-25Method for the simultaneous grinding of a plurality of semiconductor wafers
#14 | 2008-01-17Method for the simultaneous double-side grinding of a plurality of semiconductor wafers
#15 | 2006-07-18Semiconductor wafer with improved local flatness, and method for its production
#16 | 2005-08-11Semiconductor wafer, apparatus and process for producing the semiconductor wafer
806260 ⎘