Fremont, California
United States
14
2013-10-08
11
2013-10-08
These are the the leading inventors for applications assigned to LAM RESEARCH:
LAM RESEARCH based in Fremont, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Methods and solutions for preventing the formation of metal particulate defect matter upon a substrate after a plating process
#2 | 2011-06-23 ✅ Patent 8,921,296 granted on 2014-12-30Post deposition wafer cleaning formulation
#3 | 2011-05-19 ✅ Patent 8,502,381 granted on 2013-08-06Barrier layer configurations and methods for processing microelectronic topographies having barrier layers
#4 | 2010-07-22Methods for Preventing Precipitation of Etch Byproducts During an Etch Process and/or Subsequent Rinse Process
#5 | 2010-06-24 ✅ Patent 7,897,507 granted on 2011-03-01Barrier layer configurations and methods for processing microelectronic topographies having barrier layers
#6 | 2010-03-25 ✅ Patent 8,153,533 granted on 2012-04-10Methods and systems for preventing feature collapse during microelectronic topography fabrication
#7 | 2010-03-11Methods and Solutions for Preventing the Formation of Metal Particulate Defect Matter Upon a Substrate After a Plating Process
#8 | 2010-03-04 ✅ Patent 7,884,033 granted on 2011-02-08Method of depositing fluids within a microelectric topography processing chamber
#9 | 2010-01-14 ✅ Patent 7,995,323 granted on 2011-08-09Method and apparatus for securely dechucking wafers
#10 | 2008-11-06 ✅ Patent 8,465,620 granted on 2013-06-18Hollow anode plasma reactor and method
#11 | 2008-06-26PROXIMITY HEAD WITH CONFIGURABLE DELIVERY
#12 | 2006-02-09 ✅ Patent 7,714,441 granted on 2010-05-11Barrier layer configurations and methods for processing microelectronic topographies having barrier layers
#13 | 2006-02-09 ✅ Patent 7,779,782 granted on 2010-08-24Systems and methods affecting profiles of solutions dispensed across microelectronic topographies during electroless plating processes
#14 | 2005-04-12 ✅ Patent 6,878,301 granted on 2005-04-12Methods and apparatuses for trench depth detection and control
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