Dublin, California
United States
33
2018-08-02
The entities that hold a legal rights for patent applications filed by inventor Ivanov Igor C.:
Igor C. Ivanov from Dublin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
METHODS FOR FORMING A BARRIER LAYER WITH PERIODIC CONCENTRATIONS OF ELEMENTS AND STRUCTURES RESULTING THEREFROM
#2 | 2018-04-24Methods for forming a barrier layer with periodic concentrations of elements and structures resulting thereform
#3 | 2014-02-06Method for strengthening adhesion between dielectric layers formed adjacent to metal layers
#4 | 2012-11-08Method for strengthening adhesion between dielectric layers formed adjacent to metal layers
#5 | 2012-10-18Methods for Forming a Barrier Layer with Periodic Concentrations of Elements and Structures Resulting Therefrom
#6 | 2012-08-23Apparatus and method for electroless deposition of materials on semiconductor substrates
#7 | 2011-11-10Methods and System for Processing a Microelectronic Topography
#8 | 2011-05-19Barrier layer configurations and methods for processing microelectronic topographies having barrier layers
#9 | 2011-04-28Method for passivating hardware of a microelectronic topography processing chamber
#10 | 2011-02-08Method for strengthening adhesion between dielectric layers formed adjacent to metal layers
#11 | 2011-01-20Method for Strengthening Adhesion Between Dielectric Layers Formed Adjacent to Metal Layers
#12 | 2010-11-04Systems and Methods Affecting Profiles of Solutions Dispensed Across Microelectronic Topographies During Electroless Plating Processes
#13 | 2010-11-04Systems and methods affecting profiles of solutions dispensed across microelectronic topographies during electroless plating processes
#14 | 2010-06-24Barrier layer configurations and methods for processing microelectronic topographies having barrier layers
#15 | 2010-03-04Method of depositing fluids within a microelectric topography processing chamber
#16 | 2007-06-26Method of electroless deposition of thin metal and dielectric films with temperature controlled stages of film growth
#17 | 2007-03-08Spatially-arranged chemical processing station
#18 | 2007-01-18Method of electroless deposition of thin metal and dielectric films with temperature controlled stages of film growth
#19 | 2006-02-09Apparatus configurations for affecting movement of fluids within a microelectric topography processing chamber
#20 | 2006-02-09Barrier layer configurations and methods for processing microelectronic topographies having barrier layers
#21 | 2006-02-09Methods for forming a barrier layer with periodic concentrations of elements and structures resulting therefrom
#22 | 2006-02-09Systems and methods affecting profiles of solutions dispensed across microelectronic topographies during electroless plating processes
#23 | 2005-10-06Apparatus and method for electroless deposition of materials on semiconductor substrates
#24 | 2005-08-30Universal substrate holder for treating objects in fluids
#25 | 2005-08-18Methods and systems for processing a microelectronic topography
#26 | 2005-08-18Methods and systems for processing a microelectronic topography
#27 | 2005-07-28Microelectronic fabrication system components and method for processing a wafer using such components
#28 | 2005-06-28Solution composition and method for electroless deposition of coatings free of alkali metals
#29 | 2005-06-21Temperature-controlled substrate holder for processing in fluids
#30 | 2005-04-19Methods and system for processing a microelectronic topography
#31 | 2005-03-01Microelectronic fabrication system components and method for processing a wafer using such components
#32 | 2005-01-27Multi-staged heating system for fabricating microelectronic devices
#33 | 2005-01-25Method and apparatus for electroless deposition with temperature-controlled chuck
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