ADVANCED INTERCONNECT MATERIALS, LLC

City:

Sendai-shi

Country:

Japan

Published Applications:

Last publication date:

2014-03-13

Patent Grants:

Last grant date:

2015-09-01

Top Inventors for applications by ADVANCED INTERCONNECT MATERIALS, LLC

These are the the leading inventors for applications assigned to ADVANCED INTERCONNECT MATERIALS, LLC:

Junichi Koike 7 Sendai, Japan
Hideaki Kawakami 3 Chiba, Japan
Junichi KOIKE 3 Miyagi, Japan
Junichi KOIKE 3 Sendai-shi, Japan

Akihiro SHIBATOMI 2 Miyagi, Japan
Hideaki KAWAKAMI 2 Chiba-shi, Japan
Akihiro Shibatomi 2 Sendai, Japan
Yuji Sutou 1 Miyagi, Japan

Pilsang YUN 1 Sendai-shi, South Korea
Hideaki Kawakami 1 Chiba-city, Japan
Junichi KOIKE 1 Sendai-shi, Miyagi, Japan
Pilsang Yun 1 Sendai-shi, Japan

Junichi Koike 1 Sendai-City, Japan
Mayumi NAITO 1 Sendai-shi, Japan
Kunhwa Jung 1 Miyagi, Japan
Pilsang Yun 1 Sendai, Japan

Mayumi Naito 1 Sendai, Japan

Recent patent applications by ADVANCED INTERCONNECT MATERIALS, LLC

ADVANCED INTERCONNECT MATERIALS, LLC based in Sendai-shi, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2014-03-13 ✅ Patent 9,123,821 granted on 2015-09-01

US20140070207A1

Electricity

Electrode for oxide semiconductor, method of forming the same, and oxide semiconductor device provided with the electrode

#2 | 2013-05-09 ✅ Patent 8,866,140 granted on 2014-10-21

US20130112972A1

Electricity

Thin-film transistor

#3 | 2012-11-22 ✅ Patent 8,420,535 granted on 2013-04-16

US20120295438A1

Electricity

Copper interconnection, method for forming copper interconnection structure, and semiconductor device

#4 | 2011-09-29

US20110233560A1

Electricity

Electrode for silicon carbide, silicon carbide semiconductor element, silicon carbide semiconductor device and method for forming electrode for silicon carbide

#5 | 2011-02-10 ✅ Patent 7,940,361 granted on 2011-05-10