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Inventor profile of:

Junichi KOIKE

City:

Miyagi

Country:

Japan

Published Applications:

8

Last publication date:

2023-05-18

Top Assignees for applications by Junichi KOIKE

The entities that hold a legal rights for patent applications filed by inventor KOIKE Junichi:

ADVANCED INTERCONNECT MATERIALS, LLC 3 Sendai-shi, Japan
Advanced Interconnect Materials, LLC 2 Miyagi, Japan
MATERIAL CONCEPT, INC. 1 Sendai, Miyagi, Japan
TOHOKU UNIVERSITY 1 Sendai, Japan
Advanced Interconnect Materials, LLC 1 Natori-shi, Japan
NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY 1 Sendai-shi, Japan
TOHOKU UNIVERSITY 1 Sendai-shi, Japan
TOHOKU UNIVERSITY 1 Miyagi, Japan
MATERIAL CONCEPT, INC. 1 Sendai, Japan
TOKYO ELECTRON LIMITED 1 Minato-ku, Japan

Recent patent applications by KOIKE Junichi

Junichi KOIKE from Miyagi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-05-18

US20230154851A1

SEMICONDUCTOR DEVICE

#2 | 2019-12-05

US20190371733A1

Wiring structure and semiconductor device

#3 | 2016-11-10

US20160329444A1

Solar cell and production method therefor

#4 | 2012-11-22

US20120295438A1

Copper interconnection, method for forming copper interconnection structure, and semiconductor device

#5 | 2011-09-29

US20110233560A1

Electrode for silicon carbide, silicon carbide semiconductor element, silicon carbide semiconductor device and method for forming electrode for silicon carbide

#6 | 2011-02-10

US20110032467A1

Chemistry; metallurgy

Copper alloy and liquid-crystal display device

#7 | 2010-09-16

US20100233876A1

FILM FORMING APPARATUS, FILM FORMING METHOD, COMPUTER PROGRAM AND STORAGE MEDIUM

#8 | 2009-08-27

US20090212432A1

Chemistry; metallurgy

Semiconductor device, its manufacturing method, and sputtering target material for use in the method

InventorID:

3048159 ⎘