St. Florian
Austria
11
2015-04-09
11
2015-11-17
These are the the leading inventors for applications assigned to EV GROUP GMBH:
EV GROUP GMBH based in St. Florian, AT has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Method for stripping a product substrate from a carrier substrate
#2 | 2015-03-19 ✅ Patent 9,381,732 granted on 2016-07-05Device for stripping a product substrate from a carrier substrate
#3 | 2013-12-26 ✅ Patent 8,986,496 granted on 2015-03-24Device and method for stripping a product substrate from a carrier substrate
#4 | 2013-12-12 ✅ Patent 8,905,111 granted on 2014-12-09Device for releasing an interconnect layer that provides connection between a carrier and a wafer
#5 | 2013-10-24 ✅ Patent 9,381,729 granted on 2016-07-05Device for detaching a product substrate off a carrier substrate
#6 | 2013-07-04 ✅ Patent 9,138,978 granted on 2015-09-22Device for separating a substrate from a carrier substrate
#7 | 2013-06-06 ✅ Patent 8,603,294 granted on 2013-12-10Method for stripping a wafer from a carrier
#8 | 2012-09-27 ✅ Patent 8,449,716 granted on 2013-05-28Device and method for separating a substrate from a carrier substrate
#9 | 2012-01-05 ✅ Patent 8,443,864 granted on 2013-05-21Device for stripping a wafer from a carrier
#10 | 2011-11-03 ✅ Patent 8,828,147 granted on 2014-09-09Device and method for loosening a polymer layer from a surface of a substrate
#11 | 2011-01-27 ✅ Patent 8,597,980 granted on 2013-12-03Method for bonding of chips on wafers
Also check out EV Group GmbH's (St. Florian, Austria) applicant profile with 8 patent applications submitted.
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