Ried im innkreis
Austria
59
2026-02-05
The entities that hold a legal rights for patent applications filed by inventor Wimplinger Markus:
Markus Wimplinger from Ried im innkreis, AT has applied for patents for these inventions. The list has both pending applications and granted patents:
DEVICE AND METHOD FOR MEASURING A SUBSTRATE
#2 | 2024-12-19METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
#3 | 2023-09-21DEVICE AND METHOD FOR BONDING SUBSTRATES
#4 | 2023-04-20Device and method for bonding of two substrates
#5 | 2022-12-08DEVICE AND METHOD FOR MEASURING A SUBSTRATE
#6 | 2022-08-18Accommodating device for retaining wafers
#7 | 2022-05-26Method for permanent connection of two metal surfaces
#8 | 2022-05-05Device and method for bonding of two substrates
#9 | 2021-09-23Device and method for bonding substrates
#10 | 2021-06-17Device and method for bonding of two substrates
#11 | 2021-04-08Accommodating device for retaining wafers
#12 | 2019-07-25Device and method for bonding of two substrates
#13 | 2019-07-18Device and method for bonding substrates
#14 | 2019-07-18Device and method for bonding substrates
#15 | 2019-07-11Device and method for bonding substrates
#16 | 2019-07-11Device and method for bonding substrates
#17 | 2019-07-11Device and method for bonding substrates
#18 | 2019-07-04Accomodating device for retaining wafers
#19 | 2019-01-03METHOD FOR PERMANENT BONDING OF WAFERS
#20 | 2018-08-16Method for producing a microlens
#21 | 2017-10-26Die tool, device and method for producing a lens wafer
#22 | 2017-08-10METHOD FOR PERMANENTLY BONDING WAFERS
#23 | 2016-11-03Method for permanent connection of two metal surfaces
#24 | 2016-06-16Measuring device and method for measuring layer thicknesses and defects in a wafer stack
#25 | 2016-04-21Method for permanent bonding of wafers
#26 | 2015-10-15Method for microcontact printing
#27 | 2015-10-15Method and device for producing a lens wafer
#28 | 2015-09-10Method for embossing of substrates
#29 | 2015-08-20METHOD AND DEVICE FOR PRODUCING A MICROLENS
#30 | 2015-08-13Accommodating device for retaining wafers
#31 | 2015-08-13Method for coating and bonding substrates
#32 | 2015-07-30Device and method for bonding substrates
#33 | 2015-06-25Method for bonding substrates
#34 | 2015-06-18METHOD AND DEVICE FOR PERMANENT BONDING OF WAFERS
#35 | 2015-04-16Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements
#36 | 2015-04-09Flexible substrate holder, device and method for detaching a first substrate
#37 | 2014-08-21Nanostructure die, embossing roll, device and method for continuous embossing of nanostructures
#38 | 2014-07-17Method and device for permanent bonding of wafers, as well as cutting tool
#39 | 2014-06-05Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
#40 | 2014-04-17Method and device for determining the pressure distribution for bonding
#41 | 2014-03-13Method for permanently bonding wafers
#42 | 2014-02-20Method for permanently bonding wafers
#43 | 2014-01-16Method for permanently bonding wafers
#44 | 2013-12-12Accommodating device for retaining wafers
#45 | 2013-11-14Method for permanent bonding of wafers
#46 | 2013-10-17RETAINING SYSTEM FOR RETAINING AND HOLDING A WAFER
#47 | 2013-09-05Measuring device and method for measuring layer thicknesses and defects in a wafer stack
#48 | 2013-08-01Method and device for producing a lens wafer
#49 | 2013-07-04Device for separating a substrate from a carrier substrate
#50 | 2013-03-14Method for producing chip stacks, and a carrier for carrying out the method
#51 | 2013-02-14Method for permanent connection of two metal surfaces
#52 | 2013-02-14Method and device for producing a microlens
#53 | 2013-01-10Method for producing a wafer provided with chips
#54 | 2012-10-11Apparatus, device and method for determining alignment errors
#55 | 2012-09-27Device and method for separating a substrate from a carrier substrate
#56 | 2012-07-19Method for bonding of chips on wafers
#57 | 2011-02-24Device for embossing of substrates
#58 | 2011-01-27Method for bonding of chips on wafers
#59 | 2009-06-18System for uniform structuring of substrates
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