Inventor profile of:

Erich Thallner

City:

St. Florian

Country:

Austria

Published Applications:

46

Last publication date:

2018-09-20

Top Assignees for applications by Erich Thallner

The entities that hold a legal rights for patent applications filed by inventor Thallner Erich:

Recent patent applications by Thallner Erich

Erich Thallner from St. Florian, AT has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-09-20
US20180269096A1
Electricity

DEVICE AND METHOD FOR ALIGNING SUBSTRATES

#2 | 2018-08-16
US20180229458A1
Performing operations; transporting

Method for producing a microlens

#3 | 2018-07-05
US20180190536A1
Electricity

Receptacle device, device and method for handling substrate stacks

#4 | 2017-08-10
US20170229336A1
Electricity

Receptacle device, device and method for handling substrate stacks

#5 | 2017-05-11
US20170133243A1
Electricity

Sample holder, device and method for detaching of a first substrate

#6 | 2016-05-26
US20160148826A1
Electricity

Device and method for aligning substrates

#7 | 2016-01-21
US20160020136A1
Electricity

Receptacle device, device and method for handling substrate stacks

#8 | 2015-08-20
US20150231840A1
Performing operations; transporting

METHOD AND DEVICE FOR PRODUCING A MICROLENS

#9 | 2015-07-23
US20150202851A1
Performing operations; transporting

Substrate composite, method and device for bonding of substrates

#10 | 2015-06-18
US20150170953A1
Electricity

Substrate-product substrate combination and device and method for producing a substrate-product substrate combination

#11 | 2015-06-18
US20150170950A1
Electricity

Device and method for aligning substrates

#12 | 2014-07-17
US20140196846A1
Electricity

Method and device for bonding two wafers

#13 | 2013-12-12
US20130327485A1
Performing operations; transporting

Device for releasing an interconnect layer that provides connection between a carrier and a wafer

#14 | 2013-11-21
US20130309840A1
Electricity

Combination of a substrate and a wafer

#15 | 2013-11-21
US20130306242A1
Performing operations; transporting

Device and method for the application of a sheet-like jointing means onto a contact area of a wafer

#16 | 2013-11-07
US20130295746A1
Electricity

Combination of a substrate and a wafer

#17 | 2013-06-06
US20130139972A1
Performing operations; transporting

Method for stripping a wafer from a carrier

#18 | 2013-02-14
US20130037975A1
Performing operations; transporting

Method and device for producing a microlens

#19 | 2012-10-04
US20120247640A1
Electricity

Combination of a substrate and a wafer

#20 | 2012-08-30
US20120216959A1
Electricity

Combination of a substrate and a wafer

#21 | 2012-05-31
US20120135143A1
Electricity

Device and method for coating a micro- and/or nano-structured structural substrate and coated structural substrate

#22 | 2012-02-23
US20120045575A1
Physics

Method and device for producing a nanopatterned disc

#23 | 2012-01-05
US20120000613A1
Performing operations; transporting

Device for stripping a wafer from a carrier

#24 | 2011-11-03
US20110265822A1
Electricity

Device and method for loosening a polymer layer from a surface of a substrate

#25 | 2011-06-09
US20110133500A1
Electricity

Handling device and handling method for wafers

#26 | 2011-06-02
US20110127785A1
Electricity

Handling device and handling method for wafers

#27 | 2011-02-24
US20110045240A1
Electricity

Combination of a substrate and a wafer

#28 | 2011-02-24
US20110042010A1
Electricity

Combination of a substrate and a wafer

#29 | 2009-12-03
US20090298207A1
Electricity

Method for bonding wafers

#30 | 2009-11-05
US20090274872A1
Electricity

Device and Method for Coating a Micro-and/or Nano-Structured Structural Substrate and Coated Structural Substrate

#31 | 2009-10-15
US20090258583A1
Electricity

Device and process for applying and/or detaching a wafer to/from a carrier

#32 | 2009-06-25
US20090158947A1
Performing operations; transporting

Stamp Comprising a Nanostamping Structure, Device and Method for the Production Thereof

#33 | 2008-11-20
US20080284999A1
Physics

Device for transferring structures which are provided in a mask onto a substrate

#34 | 2008-10-30
US20080267743A1
Physics

Apparatus for imprinting and/or embossing substrates

#35 | 2008-09-25
US20080233331A1
Physics

Method and device for producing a nanopatterned disc

#36 | 2008-06-26
US20080153258A1
Electricity

Process and device for bonding wafers

#37 | 2008-01-10
US20080008565A1
Electricity

Handling device and handling method for wafers

#38 | 2007-12-20
US20070292248A1
Electricity

Method for holding wafers and device for fixing two parallel arranged wafers relative to one another

#39 | 2007-10-11
US20070237897A1
Electricity

Device and method for coating a microstructured and/or nanostructured structural substrate

#40 | 2007-07-05
US20070155129A1
Electricity

Combination of a substrate and a wafer

#41 | 2007-04-19
US20070087527A1
Electricity

Method and device for bonding wafers

#42 | 2005-11-24
US20050258851A1
Electricity

Adjusting device and arrangement for adjusting a wafer

#43 | 2005-09-15
US20050199330A1
Performing operations; transporting

Device and method for the application of a sheet-like jointing means onto a contact area of a wafer

#44 | 2005-08-18
US20050181579A1
Electricity

Device and method for bonding wafers

#45 | 2005-07-07
US20050146169A1
Physics

Alignment device

#46 | 2005-03-24
US20050064680A1
Electricity

Device and method for bonding wafers

InventorID:

85399 ⎘