Assignee profile:

Blue29, LLC

City:

Sunnyvale, California

Country:

United States

Published Applications:

11

Last publication date:

2009-10-08

Patent Grants:

11

Last grant date:

2011-07-05

Top Inventors for applications by Blue29, LLC

These are the the leading inventors for applications assigned to Blue29, LLC:

Recent patent applications by Blue29, LLC

Blue29, LLC based in Sunnyvale, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2009-10-08 ✅ Patent 7,972,652 granted on 2011-07-05
US20090253262A1
Chemistry; metallurgy

Electroless plating system

#2 | 2007-06-26 ✅ Patent 7,235,483 granted on 2007-06-26
US10299070
-

Method of electroless deposition of thin metal and dielectric films with temperature controlled stages of film growth

#3 | 2005-09-06 ✅ Patent 6,939,403 granted on 2005-09-06
US10299069
-

Spatially-arranged chemical processing station

#4 | 2005-08-30 ✅ Patent 6,935,638 granted on 2005-08-30
US10369878
-

Universal substrate holder for treating objects in fluids

#5 | 2005-07-05 ✅ Patent 6,913,651 granted on 2005-07-05
US10103015
-

Apparatus and method for electroless deposition of materials on semiconductor substrates

#6 | 2005-06-28 ✅ Patent 6,911,067 granted on 2005-06-28
US10339260
-

Solution composition and method for electroless deposition of coatings free of alkali metals

#7 | 2005-06-21 ✅ Patent 6,908,512 granted on 2005-06-21
US10247895
-

Temperature-controlled substrate holder for processing in fluids

#8 | 2005-06-07 ✅ Patent 6,902,605 granted on 2005-06-07
US10379692
-

Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper

#9 | 2005-04-19 ✅ Patent 6,881,437 granted on 2005-04-19
US10462167
-

Methods and system for processing a microelectronic topography

#10 | 2005-03-01 ✅ Patent 6,860,944 granted on 2005-03-01
US10462180
-

Microelectronic fabrication system components and method for processing a wafer using such components

#11 | 2005-01-25 ✅ Patent 6,846,519 granted on 2005-01-25
US10242331
-

Method and apparatus for electroless deposition with temperature-controlled chuck

AssigneeID:

254826 ⎘