Tachikawa
Japan
35
2015-11-05
The entities that hold a legal rights for patent applications filed by inventor Mihara Ichiro:
Ichiro Mihara from Tachikawa, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor device having low dielectric insulating film and manufacturing method of the same
#2 | 2015-01-08Semiconductor device having low dielectric insulating film and manufacturing method of the same
#3 | 2014-03-13Semiconductor device having low dielectric insulating film and manufacturing method of the same
#4 | 2011-12-01Imaging apparatus having a photosensor provided on a lower surface of a semiconductor substrate and a lens unit provided on an upper surface of the semiconductor substrate, and manufacturing method of the same
#5 | 2010-09-30Semiconductor device and manufacturing method thereof
#6 | 2010-07-15Semiconductor device having a plurality of semiconductor constructs
#7 | 2010-01-28Method of forming wiring on a plurality of semiconductor devices from a single metal plate, and a semiconductor construction assembly formed by the method
#8 | 2009-08-13Semiconductor device and method of manufacturing the same
#9 | 2009-03-26Semiconductor device having low dielectric insulating film and manufacturing method of the same
#10 | 2008-11-20Semiconductor device packaged into chip size and manufacturing method thereof
#11 | 2008-08-14Semiconductor device comprising electromigration prevention film and manufacturing method thereof
#12 | 2008-02-21Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#13 | 2008-01-10Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#14 | 2007-11-13Semiconductor device and method of manufacturing the same
#15 | 2007-10-04Grounding structure of semiconductor device including a conductive paste
#16 | 2007-06-28Circuit board, semiconductor device, and manufacturing method of circuit board
#17 | 2007-06-07Semiconductor device and method of manufacturing the same
#18 | 2007-06-07Semiconductor device and method of manufacturing the same
#19 | 2007-05-03Semiconductor device and method of manufacturing the same
#20 | 2007-03-29Semiconductor device comprising a plurality of semiconductor constructs
#21 | 2007-02-22Semiconductor device and method of manufacturing the same
#22 | 2006-12-07Semiconductor device having reduced number of external pad portions
#23 | 2006-11-02Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member
#24 | 2006-08-24Semiconductor device and manufacturing method thereof
#25 | 2006-06-15Semiconductor device and manufacturing method thereof
#26 | 2006-06-15Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof
#27 | 2006-03-23Semiconductor device packaged into chip size and manufacturing method thereof
#28 | 2005-07-28Semiconductor device
#29 | 2005-07-28Method of fabricating a semiconductor package utilizing a thermosetting resin base member
#30 | 2005-07-28Optical sensor module with semiconductor device for drive
#31 | 2005-06-30Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#32 | 2005-05-12Semiconductor device and method of manufacturing the same
#33 | 2005-03-22Semiconductor device having a thin-film circuit element provided above an integrated circuit
#34 | 2005-03-10Semiconductor device and method of manufacturing the same
#35 | 2005-01-25Semiconductor device
6085646 ⎘