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Assignee profile:

Deca Technologies USA, Inc.

City:

Tempe, Arizona

Country:

United States

Published Applications:

28

Last publication date:

2026-01-08

Patent Grants:

28

Last grant date:

2026-04-28

Top Inventors for applications by Deca Technologies USA, Inc.

These are the the leading inventors for applications assigned to Deca Technologies USA, Inc.:

Recent patent applications by Deca Technologies USA, Inc.

Deca Technologies USA, Inc. based in Tempe, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-01-08 ✅ Patent 12,616,038 granted on 2026-04-28
US20260011574A1
Electricity

INTERCONNECT SUBSTRATE AND METHOD OF MAKING

 #2 | 2025-12-18 ✅ Patent 12,593,703 granted on 2026-03-31
US20250385186A1
Electricity

MOLDED BRIDGE WITH VERTICAL INTERCONNECTS AND METHOD OF MAKING THE SAME

 #3 | 2025-09-04 ✅ Patent 12,500,198 granted on 2025-12-16
US20250279382A1
Electricity

QUAD FLAT NO-LEAD (QFN) PACKAGE WITH TIE BARS AND DIRECT CONTACT INTERCONNECT BUILD-UP STRUCTURE AND METHOD FOR MAKING THE SAME

 #4 | 2025-05-29 ✅ Patent 12,469,776 granted on 2025-11-11
US20250174542A1
Electricity

SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING THE SAME

 #5 | 2025-05-22 ✅ Patent 12,424,450 granted on 2025-09-23
US20250167003A1
Electricity

EMBEDDED COMPONENT INTERPOSER OR SUBSTRATE COMPRISING DISPLACEMENT COMPENSATION TRACES (DCTs) AND METHOD OF MAKING THE SAME

 #6 | 2024-12-26 ✅ Patent 12,362,322 granted on 2025-07-15
US20240429201A1
Electricity

METHOD OF MAKING A FAN-OUT SEMICONDUCTOR ASSEMBLY WITH AN INTERMEDIATE CARRIER

 #7 | 2024-12-19 ✅ Patent 12,424,527 granted on 2025-09-23
US20240421052A1
Electricity

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRAME PACKAGES

 #8 | 2024-12-19 ✅ Patent 12,300,561 granted on 2025-05-13
US20240421017A1
Electricity

Fully molded structure with multi-height components comprising backside conductive material and method for making the same

 #9 | 2024-07-04 ✅ Patent 12,334,396 granted on 2025-06-17
US20240222193A1
Electricity

UNIT SPECIFIC VARIABLE OR ADAPTIVE METAL FILL AND SYSTEM AND METHOD FOR THE SAME

 #10 | 2024-06-27 ✅ Patent 12,500,197 granted on 2025-12-16
US20240213202A1
Electricity

ENCAPSULANT-DEFINED LAND GRID ARRAY (LGA) PACKAGE AND METHOD FOR MAKING THE SAME

 #11 | 2024-06-27 ✅ Patent 12,205,881 granted on 2025-01-21
US20240213135A1
Electricity

Semiconductor assembly comprising a 3D block and method of making the same

 #12 | 2024-05-23 ✅ Patent 12,519,053 granted on 2026-01-06
US20240170300A1
Electricity

METHOD FOR REDISTRIBUTION LAYER (RDL) REPAIR BY MITIGATING AT LEAST ONE DEFECT WITH A CUSTOM RDL

 #13 | 2023-12-21 ✅ Patent 12,170,261 granted on 2024-12-17
US20230411333A1
Electricity

Molded direct contact interconnect structure without capture pads and method for the same

 #14 | 2023-11-30 ✅ Patent 11,973,051 granted on 2024-04-30
US20230387060A1
Electricity

Molded direct contact interconnect structure without capture pads and method for the same

 #15 | 2023-11-30 ✅ Patent 12,062,550 granted on 2024-08-13
US20230386860A1
Electricity

Molded direct contact interconnect substrate and methods of making same

 #16 | 2023-11-23 ✅ Patent 12,438,065 granted on 2025-10-07
US20230378029A1
Electricity

FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV) VERTICAL INTERCONNECTS

 #17 | 2023-09-05 ✅ Patent 11,749,534 granted on 2023-09-05
US17957683
Electricity

Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same

 #18 | 2023-07-27 ✅ Patent 12,057,373 granted on 2024-08-06
US20230238304A1
Electricity

Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the same

 #19 | 2023-05-11 ✅ Patent 12,381,154 granted on 2025-08-05
US20230142384A1
Electricity

FULLY MOLDED BRIDGE INTERPOSER AND METHOD OF MAKING THE SAME

 #20 | 2023-03-16 ✅ Patent 11,887,862 granted on 2024-01-30
US20230085067A1
Electricity

Method for redistribution layer (RDL) repair by mitigating at least one defect with a custom RDL

 #21 | 2023-02-16 ✅ Patent 11,791,207 granted on 2023-10-17
US20230047504A1
Electricity

Unit specific variable or adaptive metal fill and system and method for the same

 #22 | 2023-01-05 ✅ Patent 11,728,248 granted on 2023-08-15
US20230005820A1
Electricity

Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects

 #23 | 2023-01-05 ✅ Patent 11,616,003 granted on 2023-03-28
US20230005819A1
Electricity

Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects

 #24 | 2022-08-04 ✅ Patent 11,664,321 granted on 2023-05-30
US20220246532A1
Electricity

Multi-step high aspect ratio vertical interconnect and method of making the same

 #25 | 2022-07-28 ✅ Patent 11,538,759 granted on 2022-12-27
US20220238445A1
Electricity

Fully molded bridge interposer and method of making the same

 #26 | 2022-06-02 ✅ Patent 11,444,051 granted on 2022-09-13
US20220173067A1
Electricity

Fully molded semiconductor structure with face mounted passives and method of making the same

 #27 | 2021-10-28 ✅ Patent 12,261,140 granted on 2025-03-25
US20210335744A1
Electricity

Stackable fully molded semiconductor structure with vertical interconnects

 #28 | 2020-12-24 ✅ Patent 11,056,453 granted on 2021-07-06
US20200402941A1
Electricity

Stackable fully molded semiconductor structure with vertical interconnects

Also check out Deca Technologies USA, Inc.'s (Tempe, United States) applicant profile with 43 patent applications submitted.

AssigneeID:

352433 ⎘