MATERIAL CONCEPT, INC.

City:

Sendai

Country:

Japan

Published Applications:

Last publication date:

2024-04-11

Patent Grants:

Last grant date:

2025-12-02

Top Inventors for applications by MATERIAL CONCEPT, INC.

These are the the leading inventors for applications assigned to MATERIAL CONCEPT, INC.:

Junichi Koike 5 Sendai, Japan
Junichi KOIKE 4 Sendai-shi, Miyagi, Japan
Junichi KOIKE 1 Sendai-shi, Japan
Masaaki SAIGA 1 Sendai-shi, Japan

Tri Hai Hoang 1 Sendai, Japan
Junichi KOIKE 1 Miyagi, Japan
Yuji Sutou 1 Sendai-shi, Japan
Masaaki Saiga 1 Sendai, Japan

Tri Hai HOANG 1 Sendai-shi, Miyagi, Japan
Yuji Sutou 1 Sendai, Japan

Recent patent applications by MATERIAL CONCEPT, INC.

MATERIAL CONCEPT, INC. based in Sendai, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2024-04-11 ✅ Patent 12,485,478 granted on 2025-12-02

US20240116105A1

Performing operations; transporting

COPPER PASTE

#2 | 2023-02-23 ✅ Patent 12,356,542 granted on 2025-07-08

US20230056971A1

Electricity

WIRING BOARD AND METHOD FOR MANUFACTURING SAME

#3 | 2022-03-03 ✅ Patent 11,903,144 granted on 2024-02-13

US20220071024A1

Electricity

Electronic component and method for producing same

#4 | 2021-08-26 ✅ Patent 11,570,899 granted on 2023-01-31

US20210267066A1

Electricity

Circuit board and production method therefor, and electronic device and production method therefor

#5 | 2019-12-05 ✅ Patent 11,476,195 granted on 2022-10-18

US20190371733A1

Electricity

Wiring structure and semiconductor device

#6 | 2018-07-12 ✅ Patent 11,404,597 granted on 2022-08-02

US20180198017A1

Electricity

Solar cell and method of manufacturing the same

Also check out Material Concept, Inc.'s (Sendai, Japan) applicant profile with 6 patent applications submitted.

AssigneeID:

353953 ⎘