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Assignee profile:

CMC Materials, Inc.

City:

Aurora, Illinois

Country:

United States

Published Applications:

20

Last publication date:

2022-04-21

Patent Grants:

20

Last grant date:

2023-11-07

Top Inventors for applications by CMC Materials, Inc.

These are the the leading inventors for applications assigned to CMC Materials, Inc.:

Recent patent applications by CMC Materials, Inc.

CMC Materials, Inc. based in Aurora, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2022-04-21 ✅ Patent 11,807,710 granted on 2023-11-07
US20220119586A1
Chemistry; metallurgy

UV-curable resins used for chemical mechanical polishing pads

 #2 | 2022-03-24 ✅ Patent 11,802,220 granted on 2023-10-31
US20220089908A1
Chemistry; metallurgy

Silica-based slurry for selective polishing of carbon-based films

 #3 | 2022-02-03 ✅ Patent 11,629,271 granted on 2023-04-18
US20220033683A1
Chemistry; metallurgy

Titanium dioxide containing ruthenium chemical mechanical polishing slurry

 #4 | 2021-12-09 ✅ Patent 11,855,258 granted on 2023-12-26
US20210384553A1
Electricity

Secondary battery cell with solid polymer electrolyte

 #5 | 2021-12-09 ✅ Patent 11,637,317 granted on 2023-04-25
US20210384552A1
Electricity

Solid polymer electrolyte compositions and methods of preparing same

 #6 | 2021-09-30 ✅ Patent 11,725,116 granted on 2023-08-15
US20210301178A1
Chemistry; metallurgy

CMP composition including a novel abrasive

 #7 | 2021-07-08 ✅ Patent 11,492,514 granted on 2022-11-08
US20210206920A1
Chemistry; metallurgy

Derivatized polyamino acids

 #8 | 2021-01-21 ✅ Patent 11,597,854 granted on 2023-03-07
US20210017421A1
Chemistry; metallurgy

Method to increase barrier film removal rate in bulk tungsten slurry

 #9 | 2021-01-14 ✅ Patent 11,845,156 granted on 2023-12-19
US20210008687A1
Performing operations; transporting

Polishing pad employing polyamine and cyclohexanedimethanol curatives

 #10 | 2020-11-12 ✅ Patent 11,845,157 granted on 2023-12-19
US20200353586A1
Performing operations; transporting

Chemical mechanical planarization pads via vat-based production

 #11 | 2020-07-16 ✅ Patent 11,384,253 granted on 2022-07-12
US20200224057A1
Chemistry; metallurgy

Dual additive composition for polishing memory hard disks exhibiting edge roll off

 #12 | 2020-06-18 ✅ Patent 10,920,107 granted on 2021-02-16
US20200190361A1
Chemistry; metallurgy

Self-stopping polishing composition and method for bulk oxide planarization

 #13 | 2020-06-04 ✅ Patent 10,988,635 granted on 2021-04-27
US20200172762A1
Chemistry; metallurgy

Composition and method for copper barrier CMP

 #14 | 2020-06-04 ✅ Patent 10,968,366 granted on 2021-04-06
US20200172760A1
Chemistry; metallurgy

Composition and method for metal CMP

 #15 | 2020-02-20 ✅ Patent 11,034,862 granted on 2021-06-15
US20200056069A1
Chemistry; metallurgy

Polishing composition and method utilizing abrasive particles treated with an aminosilane

 #16 | 2019-04-04 ✅ Patent 11,043,151 granted on 2021-06-22
US20190100677A1
Chemistry; metallurgy

Surface treated abrasive particles for tungsten buff applications

 #17 | 2018-10-18 ✅ Patent 10,968,377 granted on 2021-04-06
US20180298257A1
Chemistry; metallurgy

Chemical-mechanical processing slurry and methods for processing a nickel substrate surface

 #18 | 2018-05-24 ✅ Patent 11,440,158 granted on 2022-09-13
US20180141183A1
Performing operations; transporting

Coated compressive subpad for chemical mechanical polishing

 #19 | 2018-01-18 ✅ Patent 11,851,584 granted on 2023-12-26
US20180016469A1
Chemistry; metallurgy

Alternative oxidizing agents for cobalt CMP

 #20 | 2016-08-04 ✅ Patent 10,946,495 granted on 2021-03-16
US20160221145A1
Performing operations; transporting

Low density polishing pad

Also check out CMC Materials, Inc.'s (Aurora, United States) applicant profile with 8 patent applications submitted.

AssigneeID:

359333 ⎘