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Inventor profile of:

Ji Cui

City:

Aurora, Illinois

Country:

United States

Published Applications:

Last publication date:

2019-07-11

Top Assignees for applications by Ji Cui

The entities that hold a legal rights for patent applications filed by inventor Cui Ji:

NALCO COMPANY 6 Naperville, IL United States
Cabot Microelectronics Corporation 3 Aurora, IL United States
CMC Materials, Inc. 1 Aurora, IL United States
Luon Energy LLC 1 Savoy, IL United States

Recent patent applications by Cui Ji

Ji Cui from Aurora, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2019-07-11

US20190211228A1

Chemistry; metallurgy

TUNGSTEN BULK POLISHING METHOD WITH IMPROVED TOPOGRAPHY

#2 | 2019-04-04

US20190100677A1

Chemistry; metallurgy

Surface treated abrasive particles for tungsten buff applications

#3 | 2018-06-14

US20180166273A1

Electricity

Composition and method for removing residue from chemical-mechanical planarization substrate

#4 | 2017-03-09

US20170066944A1

Chemistry; metallurgy

METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE

#5 | 2017-01-19

US20170014969A1

Performing operations; transporting

Methods and compositions for processing dielectric substrate

#6 | 2014-04-17

US20140103250A1

Chemistry; metallurgy

COMPOSITION AND METHOD FOR POLISHING ALUMINUM SEMICONDUCTOR SUBSTRATES

#7 | 2013-12-26

US20130343970A1

Chemistry; metallurgy

REDUCING ALUMINOSILICATE SCALE IN THE BAYER PROCESS

#8 | 2013-08-29

US20130220479A1

Mechanical engineering

Natural gas adsorption devices

#9 | 2013-03-21

US20130072021A1

Chemistry; metallurgy

Composition and method for polishing aluminum semiconductor substrates

#10 | 2013-02-07

US20130032763A1

Chemistry; metallurgy

Di- and mono-alkoxysilane functionalized polymers and their application in the Bayer process

#11 | 2011-09-01

US20110212006A1

Chemistry; metallurgy

Reducing aluminosilicate scale in the bayer process

#12 | 2011-06-23

US20110149538A1

Electricity

Electronic Devices with Embedded Electromagnetic Materials and Process of Making the Same

#13 | 2011-03-31

US20110077185A1

Chemistry; metallurgy

Di- and mono-alkoxysilane functionalized polymers and their application in the Bayer process

#14 | 2011-03-31

US20110076209A1

Chemistry; metallurgy

Reducing aluminosilicate scale in the Bayer process

#15 | 2011-01-13

US20110006393A1

Electricity

Multilayer electronic devices for imbedded capacitor

#16 | 2010-10-07

US20100254866A1

Chemistry; metallurgy

Approach in controlling DSP scale in bayer process

#17 | 2009-06-11

US20090149359A1

Chemistry; metallurgy

FORMULATION OF A METAL WORKING FLUID

InventorID:

74573 ⎘