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Assignee profile:

Invensas LLC

City:

San Jose, California

Country:

United States

Published Applications:

18

Last publication date:

2023-05-18

Patent Grants:

18

Last grant date:

2024-07-16

Top Inventors for applications by Invensas LLC

These are the the leading inventors for applications assigned to Invensas LLC:

Recent patent applications by Invensas LLC

Invensas LLC based in San Jose, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2023-05-18 ✅ Patent 12,040,284 granted on 2024-07-16
US20230154862A1
Electricity

3D-interconnect with electromagnetic interference (“EMI”) shield and/or antenna

 #2 | 2023-02-23 ✅ Patent 11,810,867 granted on 2023-11-07
US20230059375A1
Electricity

Wire bond wires for interference shielding

 #3 | 2022-05-26 ✅ Patent 11,735,563 granted on 2023-08-22
US20220165703A1
Electricity

Package-on-package assembly with wire bond vias

 #4 | 2022-05-12 ✅ Patent 11,824,046 granted on 2023-11-21
US20220150184A1
Electricity

Symbiotic network on layers

 #5 | 2022-05-05 ✅ Patent 12,021,041 granted on 2024-06-25
US20220139846A1
Electricity

Region shielding within a package of a microelectronic device

 #6 | 2021-11-25 ✅ Patent 11,929,337 granted on 2024-03-12
US20210366857A1
Electricity

3D-interconnect

 #7 | 2021-11-11 ✅ Patent 11,804,469 granted on 2023-10-31
US20210351159A1
Electricity

Active bridging apparatus

 #8 | 2021-05-20 ✅ Patent 11,599,299 granted on 2023-03-07
US20210149586A1
Physics

3D memory circuit

 #9 | 2021-02-04 ✅ Patent 11,495,579 granted on 2022-11-08
US20210035954A1
Electricity

Capacitive coupling in a direct-bonded interface for microelectronic devices

 #10 | 2020-12-24 ✅ Patent 12,154,858 granted on 2024-11-26
US20200402913A1
Electricity

Connecting multiple chips using an interconnect device

 #11 | 2020-10-08 ✅ Patent 11,830,804 granted on 2023-11-28
US20200321275A1
Electricity

Over and under interconnects

 #12 | 2020-09-03 ✅ Patent 11,387,202 granted on 2022-07-12
US20200279821A1
Electricity

Nanowire bonding interconnect for fine-pitch microelectronics

 #13 | 2020-07-16 ✅ Patent 11,335,647 granted on 2022-05-17
US20200227360A1
Electricity

Wire bonding method and apparatus for electromagnetic interference shielding

 #14 | 2020-07-09 ✅ Patent 11,605,614 granted on 2023-03-14
US20200219852A1
Electricity

Correction die for wafer/die stack

 #15 | 2020-04-16 ✅ Patent 11,387,214 granted on 2022-07-12
US20200118973A1
Electricity

Multi-chip modules formed using wafer-level processing of a reconstituted wafer

 #16 | 2020-04-16 ✅ Patent 11,462,483 granted on 2022-10-04
US20200118939A1
Electricity

Wire bond wires for interference shielding

 #17 | 2019-10-31 ✅ Patent 11,398,258 granted on 2022-07-26
US20190333550A1
Physics

Multi-die module with low power operation

 #18 | 2019-02-28 ✅ Patent 11,369,020 granted on 2022-06-21
US20190069392A1
Electricity

Stacked transmission line

Also check out Invensas LLC's (San Jose, United States) applicant profile with 17 patent applications submitted.

AssigneeID:

359470 ⎘