Rajesh Katkar

ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES

INTEGRATED TEMPERATURE CONTROL SYSTEM FOR SUBASSEMBLIES

MICROLED VERTICAL REDUNDANCY TO COVER FOR DEFECTIVE PIXELS IN DISPLAYS AND METHODS RELATED THERETO

OPTICAL INTERCONNECTIONS FOR SEMICONDUCTOR DEVICES

ENCAPSULATED HYBRID BONDED STRUCTURES

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

IMAGE SENSOR DEVICE

BONDED OPTICAL DEVICES

BACKSIDE POWER DELIVERY ATTACHMENT

METAL PADS OVER TSV

OPTICAL EMITTER STRUCTURES WITH INTEGRATED DISTRIBUTED BRAGG REFLECTORS

FOLDED HIGH-BANDWIDTH MEMORY SYSTEMS

SEMICONDUCTOR ELEMENTS WITH HYBRID BONDING LAYERS

DIRECT-BONDED OPTOELECTRONIC INTERCONNECT FOR HIGH-DENSITY INTEGRATED PHOTONICS

DIRECT-BONDED OPTOELECTRONIC DEVICES

Symbiotic Network On Layers

EFFICIENT ASSEMBLY FOR LED DISPLAYS

CONNECTING ELEMENT FOR SEMICONDUCTOR DEVICES

STRUCTURES AND METHODS FOR THERMAL DISSIPATION IN DIES

METHODS AND SYSTEMS FOR HYBRID BONDING LARGE SUBSTRATES

HYBRID BONDED MEMORY AND LOGIC DEVICES

NORMAL EMITTING STACKED MONOCHROMATIC WAFERS FOR COLOR PIXEL DISPLAYS AND METHODS RELATED THERETO

STACKED MONOCHROMATIC WAFERS WITH EDGE EMITTED LEDS FOR COLOR PIXEL DISPLAYS AND METHODS RELATED THERETO

EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME

INTERPOSER FOR SEMICONDUCTOR DEVICES

PAD-LESS HYBRID BONDING

METHODS AND APPARATUS FOR COOLING DIE STACKS

STACKING OF OPTICAL STRUCTURES USING CONDUCTIVE MATERIALS AND REFLECTORS

BONDING USING TRANSPARENT CONDUCTIVE MATERIALS AND TRANSPARENT DIELECTRIC MATERIALS

SEALED BONDED STRUCTURES AND METHODS FOR FORMING THE SAME

SEAL FOR MICROELECTRONIC ASSEMBLY

HEAT PIPE COOLING

STACKED INTERCONNECT STRUCTURES AND METHODS OF FORMING THE SAME

MANIFOLD DESIGNS FOR EMBEDDED LIQUID COOLING IN A PACKAGE

INLET AND OUTLET LOCATIONS AND STANDARDIZATION

LIQUID AND AIR COMBO COOLING FOR MULTI-CHIP MODULES

LIQUID COOLING TO CPU/MCM BOND AND PACKAGE PROCESS FLOW

THERMAL IMPROVEMENT SYSTEMS FOR ELECTRONIC DEVICES AND METHODS OF FORMING THE SAME

PASSIVE OPTICAL ELEMENTS FOR COVERING FOR DEFECTIVE PIXELS IN DISPLAYS AND METHODS RELATED THERETO

DIFFUSION BARRIER FOR INTERCONNECTS

DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROVED YIELD IN MICROELECTRONICS

ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES

TSV AS PAD

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND METHODS OF MANUFACTURING THE SAME

INTEGRATED MULTI-LEVEL COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME

MOLDED DIRECT BONDED AND INTERCONNECTED STACK

INTEGRATED COOLING ASSEMBLIES INCLUDING BACKSIDE POWER/GROUND DELIVERY AND METHODS OF MANUFACTURING THE SAME

DIRECT-BONDED LAMINATION FOR IMPROVED IMAGE CLARITY IN OPTICAL DEVICES

APPARATUS FOR NON-VOLATILE RANDOM ACCESS MEMORY STACKS

PROTECTIVE SEMICONDUCTOR ELEMENTS FOR BONDED STRUCTURES

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOLING SYSTEMS

DISPLAY DEVICES USING RECONSTITUTED SUBSTRATES AND METHODS OF FORMING THE SAME

TRANSFER OF MULTIPLE SMALL ELEMENTS TO A CARRIER

EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME

STRONG BONDING STRUCTURES AND METHODS OF FORMING THE SAME

SEE-THROUGH LED DISPLAYS AND METHODS RELATED THERETO

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

QUANTUM DOT IMAGE SENSOR DEVICES AND METHODS OF MANUFACTURING THE SAME

QUANTUM DOT IMAGE SENSOR DEVICES AND METHODS OF MANUFACTURING THE SAME

STACKED QUANTUM DOT SENSORS AND METHODS OF FORMING THE SAME

HIGH EFFICIENCY QUANTUM DOT IMAGE SENSORS AND METHODS OF FORMING THE SAME

THROUGH SUBSTRATE VIA STRUCTURES AND PROCESSES

DIRECT-BONDED LED ARRAYS AND DRIVER CIRCUITS

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME

LOW TEMPERATURE BONDED STRUCTURES

METHODS AND STRUCTURES EMPLOYING METAL OXIDE FOR DIRECT METAL BONDING

HEAVILY DOPED SEMICONDUCTOR DEVICES FOR POWER DISTRIBUTION

BONDED OPTICAL DEVICES

DIRECT-BONDED OPTOELECTRONIC DEVICES

INTEGRATED CIRCUITS WITH CAPACITORS

METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING

CHIPLET-TO-CHIPLET PROTOCOL SWITCH

EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK

EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK

DIRECTLY BONDED OPTICAL COMPONENTS

Diffusion barrier for interconnects

Manifold designs for embedded liquid cooling in a package

DIRECT GANG BONDING METHODS AND STRUCTURES

Integrated cooling assemblies including signal redistribution and methods of manufacturing the same

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND METHODS OF MANUFACTURING THE SAME

OVER AND UNDER INTERCONNECTS

FINE PITCH BVA USING RECONSTITUTED WAFER WITH AREA ARRAY ACCESSIBLE FOR TESTING

STACKED OPTICAL WAVEGUIDES

INTERPOSER FOR BACKSIDE POWER DELIVERY NETWORK

Integrated cooling assembly including coolant channel on the backside semiconductor device

EMBEDDED COOLING SYSTEMS FOR DEVICE PACKAGES AND METHODS OF COOLING PACKAGED DEVICES

SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES

Image sensor device

ACTIVE BRIDGING APPARATUS

Symbiotic network on layers

STRUCTURES FOR BONDING ELEMENTS INCLUDING CONDUCTIVE INTERFACE FEATURES

Molded direct bonded and interconnected stack

Direct bonded stack structures for increased reliability and improved yield in microelectronics

MULTI-METAL CONTACT STRUCTURE

INTEGRATED SYSTEMS FOR COOLING HIGH POWERED DEVICES AND METHODS OF MANUFACTURING THE SAME

METAL PADS OVER TSV

DIRECTLY BONDED STRUCTURE WITH FRAME STRUCTURE

BACKSIDE POWER DELIVERY NETWORK

IMAGE SENSOR DEVICE