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Assignee profile:

Advanced Semiconductor Engineering, Inc.

City:

Kao-Hsiung

Country:

Taiwan

Published Applications:

18

Last publication date:

2008-09-11

Patent Grants:

18

Last grant date:

2010-06-01

Top Inventors for applications by Advanced Semiconductor Engineering, Inc.

These are the the leading inventors for applications assigned to Advanced Semiconductor Engineering, Inc.:

Recent patent applications by Advanced Semiconductor Engineering, Inc.

Advanced Semiconductor Engineering, Inc. based in Kao-Hsiung, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2008-09-11 ✅ Patent 7,727,818 granted on 2010-06-01
US20080220566A1
Electricity

Substrate process for an embedded component

 #2 | 2008-07-10 ✅ Patent 7,829,961 granted on 2010-11-09
US20080164545A1
Electricity

MEMS microphone package and method thereof

 #3 | 2008-07-03 ✅ Patent 7,808,060 granted on 2010-10-05
US20080157238A1
Performing operations; transporting

MEMS microphone module and method thereof

 #4 | 2008-04-17 ✅ Patent 7,573,124 granted on 2009-08-11
US20080087987A1
Electricity

Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same

 #5 | 2008-01-03 ✅ Patent 7,538,421 granted on 2009-05-26
US20080001308A1
Electricity

Flip-chip package structure with stiffener

 #6 | 2007-12-20 ✅ Patent 7,932,591 granted on 2011-04-26
US20070291458A1
Electricity

Stacked semiconductor package having flexible circuit board therein

 #7 | 2007-08-30 ✅ Patent 7,701,056 granted on 2010-04-20
US20070200239A1
Electricity

Redistribution connecting structure of solder balls

 #8 | 2007-06-21 ✅ Patent 7,436,055 granted on 2008-10-14
US20070138615A1
Electricity

Packaging method of a plurality of chips stacked on each other and package structure thereof

 #9 | 2007-06-14 ✅ Patent 7,417,329 granted on 2008-08-26
US20070132093A1
Electricity

System-in-package structure

 #10 | 2007-04-19 ✅ Patent 7,541,273 granted on 2009-06-02
US20070087548A1
Electricity

Method for forming bumps

 #11 | 2007-04-19 ✅ Patent 7,402,510 granted on 2008-07-22
US20070087546A1
Electricity

Etchant and method for forming bumps

 #12 | 2007-04-12 ✅ Patent 7,256,480 granted on 2007-08-14
US20070080431A1
Electricity

Lead frame package structure with high density of lead pins arrangement

 #13 | 2007-02-08 ✅ Patent 7,410,886 granted on 2008-08-12
US20070031994A1
Electricity

Method for fabricating protective caps for protecting elements on a wafer surface

 #14 | 2006-10-05 ✅ Patent 7,279,789 granted on 2007-10-09
US20060220224A1
Electricity

Thermally enhanced three-dimensional package and method for manufacturing the same

 #15 | 2006-09-28 ✅ Patent 7,238,590 granted on 2007-07-03
US20060216859A1
Electricity

Package structure of semiconductor and wafer-level formation thereof

 #16 | 2006-08-08 ✅ Patent 7,087,462 granted on 2006-08-08
US11160070
-

Method for forming leadless semiconductor packages

 #17 | 2006-05-04 ✅ Patent 7,187,067 granted on 2007-03-06
US20060091515A1
Electricity

Sensor chip packaging structure

 #18 | 2006-04-20 ✅ Patent 7,221,052 granted on 2007-05-22
US20060081982A1
Electricity

Chip scale package with micro antenna and method for manufacturing the same
AssigneeID:

394223 ⎘