Garching
Germany
48
2021-12-23
45
2022-11-22
These are the the leading inventors for applications assigned to SUSS MICROTEC LITHOGRAPHY GMBH:
SUSS MICROTEC LITHOGRAPHY GMBH based in Garching, DE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Holding apparatus and method for holding a substrate
#2 | 2021-01-14 ✅ Patent 11,651,983 granted on 2023-05-16Apparatus, system, and method for handling aligned wafer pairs
#3 | 2019-12-05 ✅ Patent 11,148,258 granted on 2021-10-19Holding apparatus and method for holding a substrate
#4 | 2019-05-23 ✅ Patent 11,247,229 granted on 2022-02-15Method for coating a substrate with a lacquer and device for planarising a lacquer layer
#5 | 2018-05-17 ✅ Patent 11,075,102 granted on 2021-07-27Positioning device
#6 | 2018-04-19 ✅ Patent 10,319,615 granted on 2019-06-11Semiconductor bonding apparatus and related techniques
#7 | 2018-04-12 ✅ Patent 10,580,678 granted on 2020-03-03Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
#8 | 2018-01-18 ✅ Patent 10,241,415 granted on 2019-03-26Light source arrangement for a photolithography exposure system and photolithography exposure system
#9 | 2017-12-28 ✅ Patent 11,183,401 granted on 2021-11-23System and related techniques for handling aligned substrate pairs
#10 | 2017-12-28 ✅ Patent 10,596,592 granted on 2020-03-24Method for coating a substrate and also a coating system
#11 | 2016-12-22 ✅ Patent 10,101,672 granted on 2018-10-16Device for treating a disc-shaped substrate and support adapter
#12 | 2016-12-08 ✅ Patent 10,103,049 granted on 2018-10-16Method and apparatus for preventing the deformation of a substrate supported at its edge area
#13 | 2016-11-17 ✅ Patent 10,825,705 granted on 2020-11-03Apparatus, system, and method for handling aligned wafer pairs
#14 | 2016-11-17 ✅ Patent 9,640,418 granted on 2017-05-02Apparatus, system, and method for handling aligned wafer pairs
#15 | 2016-10-13 ✅ Patent 10,295,063 granted on 2019-05-21Wafer treating device and sealing ring for a wafer treating device
#16 | 2016-08-18Chuck for Suction and Holding a Wafer
#17 | 2016-05-26 ✅ Patent 10,825,701 granted on 2020-11-03Baking device for a wafer coated with a coating containing a solvent
#18 | 2016-03-31 ✅ Patent 10,232,405 granted on 2019-03-19Method for coating a substrate with a lacquer and device for planarising a lacquer layer
#19 | 2016-03-31 ✅ Patent 10,688,524 granted on 2020-06-23Method for coating a substrate and coating device
#20 | 2015-10-15 ✅ Patent 9,458,002 granted on 2016-10-04Bottle supply system and bottle cap adapter
#21 | 2015-09-10METHOD AND APPARATUS FOR TEMPORARY BONDING OF ULTRA THIN WAFERS
#22 | 2015-07-23SYSTEM AMD METHOD FOR SUBSTRATE HOLDING
#23 | 2015-04-16 ✅ Patent 9,472,437 granted on 2016-10-18Debonding temporarily bonded semiconductor wafers
#24 | 2015-03-26 ✅ Patent 9,281,229 granted on 2016-03-08Method for thermal-slide debonding of temporary bonded semiconductor wafers
#25 | 2014-10-30 ✅ Patent 9,859,141 granted on 2018-01-02Apparatus and method for aligning and centering wafers
#26 | 2014-10-30 ✅ Patent 9,837,295 granted on 2017-12-05Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
#27 | 2013-09-19 ✅ Patent 9,064,686 granted on 2015-06-23Method and apparatus for temporary bonding of ultra thin wafers
#28 | 2013-02-28 ✅ Patent 8,950,459 granted on 2015-02-10Debonding temporarily bonded semiconductor wafers
#29 | 2012-11-29 ✅ Patent 9,329,473 granted on 2016-05-03Method and device for active wedge error compensation between two objects that can be positioned substantially to parallel to each other
#30 | 2012-06-07 ✅ Patent 8,647,797 granted on 2014-02-11Methos and device for keeping mask dimensions constant
#31 | 2012-04-05 ✅ Patent 8,425,715 granted on 2013-04-23Apparatus for high throughput wafer bonding
#32 | 2012-02-16 ✅ Patent 8,343,300 granted on 2013-01-01Automated thermal slide debonder
#33 | 2011-12-01 ✅ Patent 8,574,398 granted on 2013-11-05Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers
#34 | 2011-10-20 ✅ Patent 8,551,291 granted on 2013-10-08Debonding equipment and methods for debonding temporary bonded wafers
#35 | 2011-10-20 ✅ Patent 8,366,873 granted on 2013-02-05Debonding equipment and methods for debonding temporary bonded wafers
#36 | 2011-08-18 ✅ Patent 9,159,595 granted on 2015-10-13Thin wafer carrier
#37 | 2011-06-23 ✅ Patent 8,343,300 granted on 2013-01-01Automated thermal slide debonder
#38 | 2011-01-20 ✅ Patent 8,181,688 granted on 2012-05-22Apparatus for temporary wafer bonding and debonding
#39 | 2011-01-20 ✅ Patent 8,919,412 granted on 2014-12-30Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers
#40 | 2010-10-21 ✅ Patent 8,764,026 granted on 2014-07-01Device for centering wafers
#41 | 2010-10-21 ✅ Patent 8,267,143 granted on 2012-09-18Apparatus for mechanically debonding temporary bonded semiconductor wafers
#42 | 2010-08-05 ✅ Patent 8,353,255 granted on 2013-01-15Device for coating a substrate
#43 | 2010-05-20 ✅ Patent 8,147,630 granted on 2012-04-03Method and apparatus for wafer bonding with enhanced wafer mating
#44 | 2009-10-08 ✅ Patent 8,139,219 granted on 2012-03-20Apparatus and method for semiconductor wafer alignment
#45 | 2009-01-01 ✅ Patent 7,950,347 granted on 2011-05-31Rotatable device for holding a substrate
#46 | 2007-12-27 ✅ Patent 7,948,034 granted on 2011-05-24Apparatus and method for semiconductor bonding
#47 | 2006-06-06 ✅ Patent 7,057,707 granted on 2006-06-06Method and device for adjusting an alignment microscope by means of a reflective alignment mask
#48 | 2005-11-22 ✅ Patent 6,966,560 granted on 2005-11-22Device for fixing thin and flexible substrates
Also check out SUSS MicroTec Lithography GmbH's (Garching, Germany) applicant profile with 37 patent applications submitted.
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