PATRICK GORUN

City:

BURLINGTON, Vermont

Country:

United States

Published Applications:

Last publication date:

2015-03-26

Top Assignees for applications by PATRICK GORUN

The entities that hold a legal rights for patent applications filed by inventor GORUN PATRICK:

PATRICK GORUN from BURLINGTON, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method for thermal-slide debonding of temporary bonded semiconductor wafers

Apparatus for temporary wafer bonding and debonding

Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers

Apparatus for mechanically debonding temporary bonded semiconductor wafers

Apparatus and method for semiconductor wafer bumping via injection molded solder

InventorID:

1107770 ⎘