Singapore
11
2013-08-15
11
2014-07-29
These are the the leading inventors for applications assigned to STATS ChipPAC, Ltd.:
STATS ChipPAC, Ltd. based in , SG has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure
#2 | 2013-04-25 ✅ Patent 8,932,907 granted on 2015-01-13Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#3 | 2012-11-22 ✅ Patent 9,293,349 granted on 2016-03-22Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield
#4 | 2012-07-26 ✅ Patent 8,492,203 granted on 2013-07-23Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers
#5 | 2012-03-08 ✅ Patent 8,354,297 granted on 2013-01-15Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die
#6 | 2012-01-17 ✅ Patent 8,097,490 granted on 2012-01-17Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die
#7 | 2011-09-29 ✅ Patent 8,159,047 granted on 2012-04-17Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors
#8 | 2011-02-17 ✅ Patent 8,003,496 granted on 2011-08-23Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die
#9 | 2010-06-10 ✅ Patent 8,168,470 granted on 2012-05-01Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound
#10 | 2009-12-17 ✅ Patent 7,863,721 granted on 2011-01-04Method and apparatus for wafer level integration using tapered vias
#11 | 2009-03-26 ✅ Patent 7,701,040 granted on 2010-04-20Semiconductor package and method of reducing electromagnetic interference between devices
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