Kyoungki-do
South Korea
38
2018-04-19
The entities that hold a legal rights for patent applications filed by inventor Chi HeeJo:
HeeJo Chi from Kyoungki-do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor device and method of forming interposer with opening to contain semiconductor die
#2 | 2017-10-26Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
#3 | 2017-08-31Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package
#4 | 2016-11-10Methods of forming conductive and insulating layers
#5 | 2016-08-11Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package
#6 | 2016-06-09Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form
#7 | 2015-10-01Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring
#8 | 2015-09-24Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package
#9 | 2015-05-07Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#10 | 2015-04-02Semiconductor device and method of making an embedded wafer level ball grid array (EWLB) package on package (POP) device with a slotted metal carrier interposer
#11 | 2015-01-01Methods of forming conductive and insulating layers
#12 | 2015-01-01Methods of Forming Conductive Materials on Contact Pads
#13 | 2015-01-01Methods of forming conductive jumper traces
#14 | 2014-12-18Semiconductor Device and Method of Making an Embedded Wafer Level Ball Grid Array (EWLB) Package on Package (POP) Device With a Slotted Metal Carrier Interposer
#15 | 2014-12-11Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die
#16 | 2014-10-02Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding
#17 | 2014-06-26Semiconductor device and method of making bumpless flipchip interconnect structures
#18 | 2014-06-26Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form
#19 | 2014-06-26Semiconductor device and method of simultaneous molding and thermalcompression bonding
#20 | 2013-11-14Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die
#21 | 2013-11-14Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP
#22 | 2013-09-26Semiconductor device and method of forming conductive layer over metal substrate for electrical interconnect of semiconductor die
#23 | 2013-05-02Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe
#24 | 2013-04-25Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#25 | 2013-04-11Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die
#26 | 2013-01-03Semiconductor Device and Method of Using Leadframe Bodies to Form Openings Through Encapsulant for Vertical Interconnect of Semiconductor Die
#27 | 2012-11-22Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer
#28 | 2012-10-16Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die
#29 | 2012-07-05Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP
#30 | 2012-06-21Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint
#31 | 2012-06-21Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint
#32 | 2012-05-17Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#33 | 2011-12-01Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe
#34 | 2011-11-17Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die
#35 | 2011-08-04Method of forming thin profile WLCSP with vertical interconnect over package footprint
#36 | 2011-03-24Semiconductor device and method of forming interposer with opening to contain semiconductor die
#37 | 2011-03-24Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP
#38 | 2011-03-03Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant
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