Unimicron Technology Corp.

City:

Country:

Taiwan

Published Applications:

Last publication date:

2010-11-18

Patent Grants:

Last grant date:

2012-05-22

Top Inventors for applications by Unimicron Technology Corp.

These are the the leading inventors for applications assigned to Unimicron Technology Corp.:

Chao-Meng Cheng 1 Sinfong Township, Taiwan
Chao-Meng Cheng 1 Sinfong Township, Hsinchu County, Taiwan
Mao-Hua Yeh 1 Hsinchu, Taiwan
Hsien-Shou Wang 1 Hsinchu, Taiwan

Bo-Wei CHEN 1 Hsinchu, Taiwan
Bo-Wei Chen 1 Hsin-feng, Taiwan
Wang-Hsiang Tsai 1 Hsinchu, Taiwan
Lin-Yin Wong 1 Hsinchu, Taiwan

Shih-Ping Hsu 1 Hsinchu, Taiwan
Hsien-Shou Wang 1 Hsin-feng, Taiwan
Wang-Hsiang Tsai 1 Hsin-feng, Taiwan
Lin-Yin Wong 1 Hsin-feng, Taiwan

Jen-Hung Chiang 1 Sinfong Township, Taiwan
Jen-Hung Chiang 1 Sinfong Township, Hsinchu County, Taiwan
Mao-Hua Yeh 1 Hsin-feng, Taiwan
Chih-Kui Yang 1 Hsinchu, Taiwan

Shih-Ping Hsu 1 Hsin-feng, Taiwan
Chung-Cheng Lien 1 Hsinchu, Taiwan

Recent patent applications by Unimicron Technology Corp.

Unimicron Technology Corp. based in , TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2010-11-18 ✅ Patent 8,181,342 granted on 2012-05-22

US20100288549A1

Electricity

Method for manufacturing a coreless packaging substrate

#2 | 2008-10-09 ✅ Patent 7,968,991 granted on 2011-06-28

US20080246135A1

Electricity

Stacked package module and board having exposed ends

#3 | 2008-09-04 ✅ Patent 8,256,106 granted on 2012-09-04

US20080210460A1

Electricity

Method for fabricating circuit board structure with capacitors embedded therein

#4 | 2008-03-27 ✅ Patent 7,820,233 granted on 2010-10-26

US20080075836A1

Electricity

Method for fabricating a flip chip substrate structure

AssigneeID:

432657 ⎘