Bo-Wei CHEN

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2014-03-27

Top Assignees for applications by Bo-Wei CHEN

The entities that hold a legal rights for patent applications filed by inventor CHEN Bo-Wei:

Bo-Wei CHEN from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Dynamic comparator with equalization function

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

Method for fabricating a flip chip substrate structure

Flip chip substrate structure and the method for manufacturing the same

Method to manufacture a coreless packaging substrate

Method to manufacture a coreless packaging substrate

Coreless package substrate with conductive structures

InventorID:

701056 ⎘