Chung-Cheng Lien

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2012-11-22

Top Assignees for applications by Chung-Cheng Lien

The entities that hold a legal rights for patent applications filed by inventor Lien Chung-Cheng:

Chung-Cheng Lien from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Circuit board structure with capacitors embedded therein

PACKAGING SUBSTRATE HAVING CHIP EMBEDDED THEREIN AND MANUFACTURING METHOD THEREOF

Chip package module

Package structure and stacked package module using the same

Method for fabricating circuit board structure with capacitors embedded therein

Carrier plate structure havign a chip embedded therein and the manufacturing method of the same

Plate structure having chip embedded therein and the manufacturing method of the same

Carrier structure for semiconductor chip and method for manufacturing the same

InventorID:

3871103 ⎘