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Assignee profile:

Advanced Interconnect Materials, LLC

City:

Miyagi

Country:

Japan

Published Applications:

Last publication date:

2014-03-13

Patent Grants:

Last grant date:

2015-09-01

Top Inventors for applications by Advanced Interconnect Materials, LLC

These are the the leading inventors for applications assigned to Advanced Interconnect Materials, LLC:

Junichi Koike 9 Sendai, Japan
Akihiro Shibatomi 5 Sendai, Japan
Hideaki KAWAKAMI 3 Chiba-shi, Japan
Junichi KOIKE 3 Sendai-shi, Japan

Hideaki Kawakami 3 Chiba, Japan
Pilsang Yun 2 Sendai, Japan
Junichi KOIKE 2 Miyagi, Japan
Pilsang Yun 2 Sendai-shi, Japan

Kouji Neishi 1 Sendai, Japan
Akihiro SHIBATOMI 1 Miyagi, Japan
Mayumi NAITO 1 Sendai-shi, Japan
Mayumi Naito 1 Sendai, Japan

Pilsang YUN 1 Sendai-shi, South Korea

Recent patent applications by Advanced Interconnect Materials, LLC

Advanced Interconnect Materials, LLC based in Miyagi, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2014-03-13 ✅ Patent 9,123,821 granted on 2015-09-01

US20140070207A1

Electricity

Electrode for oxide semiconductor, method of forming the same, and oxide semiconductor device provided with the electrode

#2 | 2013-07-04 ✅ Patent 8,895,978 granted on 2014-11-25

US20130168671A1

Electricity

Semiconductor device

#3 | 2013-05-09 ✅ Patent 8,866,140 granted on 2014-10-21

US20130112972A1

Electricity

Thin-film transistor

#4 | 2012-11-22 ✅ Patent 8,420,535 granted on 2013-04-16

US20120295438A1

Electricity

Copper interconnection, method for forming copper interconnection structure, and semiconductor device

#5 | 2012-01-26 ✅ Patent 9,082,821 granted on 2015-07-14

US20120021603A1

Electricity

Method for forming copper interconnection structures

#6 | 2011-03-10 ✅ Patent 8,531,033 granted on 2013-09-10

US20110057317A1

Electricity

Contact plug structure, semiconductor device, and method for forming contact plug

#7 | 2010-10-21 ✅ Patent 8,163,649 granted on 2012-04-24

US20100267228A1

Electricity

Copper interconnection structure, semiconductor device, and method for forming copper interconnection structure

#8 | 2010-06-24 ✅ Patent 8,169,079 granted on 2012-05-01

US20100155952A1

Electricity

Copper interconnection structures and semiconductor devices

#9 | 2010-03-18 ✅ Patent 8,258,626 granted on 2012-09-04

US20100065967A1

Electricity

Copper interconnection, method for forming copper interconnection structure, and semiconductor device

#10 | 2009-10-08 ✅ Patent 8,372,745 granted on 2013-02-12

US20090253260A1

Electricity

Semiconductor device, its manufacturing method, and sputtering target material for use in the method

#11 | 2009-08-27 ✅ Patent 8,188,599 granted on 2012-05-29

US20090212432A1

Chemistry; metallurgy

Semiconductor device, its manufacturing method, and sputtering target material for use in the method

AssigneeID:

451382 ⎘