Tokyo
Japan
27
2024-03-07
25
2025-03-25
These are the the leading inventors for applications assigned to Tadatomo Suga:
Tadatomo Suga based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Bonding system and bonding method
#2 | 2024-03-07 ✅ Patent 12,388,045 granted on 2025-08-12BONDING SYSTEM AND BONDING METHOD
#3 | 2024-02-29BONDING METHOD, BONDER, AND BONDING SYSTEM
#4 | 2024-01-11 ✅ Patent 12,409,644 granted on 2025-09-09SUBSTRATE BONDING METHOD AND SUBSTRATE BONDING SYSTEM
#5 | 2023-05-04 ✅ Patent 11,837,444 granted on 2023-12-05Substrate joining method, substrate joining system and method for controlling hydrophilic treatment device
#6 | 2022-10-20 ✅ Patent 12,275,670 granted on 2025-04-15Method for joining transparent substrates
#7 | 2021-08-26BONDING SYSTEM AND BONDING METHOD
#8 | 2014-09-18 ✅ Patent 8,915,418 granted on 2014-12-23Electronic component bonding method
#9 | 2014-02-20 ✅ Patent 9,601,350 granted on 2017-03-21Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly
#10 | 2014-02-06 ✅ Patent 10,166,749 granted on 2019-01-01Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly
#11 | 2012-05-03 ✅ Patent 8,651,363 granted on 2014-02-18Joining method and device produced by this method and joining unit
#12 | 2010-10-07 ✅ Patent 8,091,764 granted on 2012-01-10Joining method and device produced by this method and joining unit
#13 | 2008-10-16 ✅ Patent 7,776,735 granted on 2010-08-17Semiconductor device and process for manufacturing the same
#14 | 2008-10-09 ✅ Patent 7,784,670 granted on 2010-08-31Joining method and device produced by this method and joining unit
#15 | 2008-07-24 ✅ Patent 7,688,088 granted on 2010-03-30Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object
#16 | 2007-10-04 ✅ Patent 7,319,339 granted on 2008-01-15Inspection apparatus to break the oxide of an electrode by fritting phenomenon
#17 | 2007-06-07 ✅ Patent 7,550,366 granted on 2009-06-23Method for bonding substrates and device for bonding substrates
#18 | 2007-02-27 ✅ Patent 7,183,190 granted on 2007-02-27Semiconductor device and fabrication method therefor
#19 | 2006-09-05 ✅ Patent 7,100,279 granted on 2006-09-05Method of mounting an electronic part
#20 | 2006-08-31 ✅ Patent 7,304,489 granted on 2007-12-04Inspection method and inspection apparatus
#21 | 2006-07-18 ✅ Patent 7,078,811 granted on 2006-07-18Semiconductor device and method for fabricating the device
#22 | 2006-06-13 ✅ Patent 7,061,259 granted on 2006-06-13Inspection method and inspection apparatus
#23 | 2006-04-27 ✅ Patent 7,591,293 granted on 2009-09-22Device for bonding a metal on a surface of a substrate
#24 | 2005-12-13 ✅ Patent 6,975,489 granted on 2005-12-13Circuit structure and semiconductor integrated circuit
#25 | 2005-08-30 ✅ Patent 6,935,553 granted on 2005-08-30Reflow soldering method
#26 | 2005-08-11 ✅ Patent 7,686,912 granted on 2010-03-30Method for bonding substrates and method for irradiating particle beam to be utilized therefor
#27 | 2005-08-04 ✅ Patent 7,217,631 granted on 2007-05-15Semiconductor device and method for fabricating the device
Also check out Tadatomo Suga's (Tokyo, Japan) applicant profile with 13 patent applications submitted.
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