Calamba City
Philippines
35
2026-02-26
23
2025-03-18
These are the the leading inventors for applications assigned to STMicroelectronics, Inc.:
STMicroelectronics, Inc. based in Calamba City, PH has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
LEADFRAME WITH VARYING THICKNESSES AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
#2 | 2025-11-06BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN
#3 | 2025-06-05LEAD STABILIZATION IN SEMICONDUCTOR PACKAGES
#4 | 2025-06-05LEAD STABILIZATION IN SEMICONDUCTOR PACKAGES
#5 | 2024-05-30 ✅ Patent 12,255,076 granted on 2025-03-18Method for manufacturing leadless semiconductor package with wettable flanks
#6 | 2024-05-16 ✅ Patent 12,224,251 granted on 2025-02-11Semiconductor device having cavities at an interface of an encapsulant and a die pad or leads
#7 | 2024-04-18 ✅ Patent 12,421,108 granted on 2025-09-23CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM (MEMS)
#8 | 2024-04-04POWER LEADFRAME PACKAGE WITH REDUCED SOLDER VOIDS
#9 | 2023-12-28LEADFRAME WITH PAD ANCHORING MEMBERS AND METHOD OF FORMING THE SAME
#10 | 2023-12-21THIN SUBSTRATE PACKAGE AND LEAD FRAME
#11 | 2023-08-31SEMICONDUCTOR PACKAGE WITH OVERLAPPING LEADS AND DIE PAD
#12 | 2023-08-10 ✅ Patent 12,170,240 granted on 2024-12-17Lead frame for improving adhesive fillets on semiconductor die corners
#13 | 2023-06-15 ✅ Patent 12,080,657 granted on 2024-09-03Die embedded in substrate with stress buffer
#14 | 2023-03-02 ✅ Patent 12,494,442 granted on 2025-12-09LEADFRAME WITH VARYING THICKNESSES AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
#15 | 2023-02-02LEADLESS SEMICONDUCTOR PACKAGE WITH DE-METALLIZED POROUS STRUCTURES AND METHOD FOR MANUFACTURING THE SAME
#16 | 2022-10-06 ✅ Patent 11,862,579 granted on 2024-01-02Semiconductor device having cavities at an interface of an encapsulant and a die pad or leads
#17 | 2022-09-15 ✅ Patent 12,211,772 granted on 2025-01-28Method of manufacturing semiconductor devices and corresponding semiconductor device
#18 | 2022-09-08 ✅ Patent 12,543,575 granted on 2026-02-03BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN
#19 | 2022-05-05SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC SHIELD
#20 | 2022-03-31 ✅ Patent 12,094,725 granted on 2024-09-17Leadframe package with pre-applied filler material
#21 | 2022-03-17 ✅ Patent 11,948,868 granted on 2024-04-02Compact leadframe package
#22 | 2022-02-10 ✅ Patent 11,848,256 granted on 2023-12-19Semiconductor package having die pad with cooling fins
#23 | 2022-01-06 ✅ Patent 11,916,090 granted on 2024-02-27Tapeless leadframe package with exposed integrated circuit die
#24 | 2022-01-06 ✅ Patent 11,688,715 granted on 2023-06-27Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame
#25 | 2021-12-16SEMICONDUCTOR DEVICE PACKAGES HAVING CAP WITH INTEGRATED ELECTRICAL LEADS
#26 | 2021-11-04 ✅ Patent 11,610,851 granted on 2023-03-21Die embedded in substrate with stress buffer
#27 | 2021-10-07 ✅ Patent 11,929,259 granted on 2024-03-12Method for manufacturing leadless semiconductor package with wettable flanks
#28 | 2021-08-19 ✅ Patent 11,699,667 granted on 2023-07-11Leadframe with pad anchoring members and method of forming the same
#29 | 2021-06-17 ✅ Patent 11,552,007 granted on 2023-01-10Modified leadframe design with adhesive overflow recesses
#30 | 2018-07-12 ✅ Patent 11,004,776 granted on 2021-05-11Semiconductor device with frame having arms and related methods
#31 | 2015-12-03 ✅ Patent 9,947,636 granted on 2018-04-17Method for making semiconductor device with lead frame made from top and bottom components and related devices
#32 | 2015-12-03 ✅ Patent 9,490,146 granted on 2016-11-08Semiconductor device with encapsulated lead frame contact area and related methods
#33 | 2014-10-02 ✅ Patent 9,177,903 granted on 2015-11-03Enhanced flip-chip die architecture
#34 | 2012-07-05 ✅ Patent 8,426,254 granted on 2013-04-23Leadless semiconductor package with routable leads, and method of manufacture
#35 | 2012-07-05LEADLESS SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE
Also check out STMicroelectronics, Inc.'s (Calamba City, Philippines) applicant profile with 9 patent applications submitted.
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