Power-module substrate and manufacturing method thereof

Mounting carrier and method of mounting a mounting carrier on a connecting carrier

Surface-mount type electric connecting terminal, and electronic module unit and circuit board using the same

Method for connecting piezoelectric element and cable substrate, piezoelectric element having cable substrate, and inkjet head including piezoelectric element with cable substrate

Conductive connections, structures with such connections, and methods of manufacture

Conductive connections, structures with such connections, and methods of manufacture

Heat-bonding apparatus and method of manufacturing heat-bonded products

Metal cored solder decal structure and process

Reflowable circuit protection device

Capacitive probe fabricating from spray deposition

Portable equipment for monitoring and controlling the level of oxygen in reflow oven atmosphere

Layered solder material for bonding different species of electrodes and method of bonding the different species of electrodes in an electronic component

POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, METHOD OF PRODUCING POWER MODULE SUBSTRATE, PASTE FOR COPPER SHEET BONDING, AND METHOD OF PRODUCING BONDED BODY

Electronic component mounting system and electronic component mounting method

JOINING METHODS FOR BULK METALLIC GLASSES

Method for soldering a stator to a cooler, and stator comprising a solder connection to the stator support

Method and soldering device for selective soldering with at least one solder nozzle and another functional element which are moved synchronously by a movement device

Electrical devices with solder dam

Electronic component mounting system

Manufacturing method of power-module substrate

Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same

High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using same

Resistor and manufacturing method thereof

DEVICE AND METHOD FOR PRINTING A THIXOTROPIC MEDIUM ONTO A PCB

Soldering method using a low-temperature solder paste

Systems and Methods for a Surface-Mountable Stamped Antenna

Method and apparatus for improving selective soldering

Flip chip interconnection with reduced current density

Leadless chip carrier

Integrated transformer

LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES

Pane having an electrical connection element

Radio frequency semiconductor device package and method for manufacturing same, and radio frequency semiconductor device

Backlight unit and method of manufacturing the same

Solder alloy for die bonding

Flux cleaning method

METHOD FOR PRODUCING A DRIED PASTE LAYER, METHOD FOR PRODUCING A SINTERING CONNECTION, METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE AND CONTINUOUS INSTALLATION

Solderable conductive polymer thick film composition

One up, one down connection structure for piezoelectric device in tire patch

Reflow process and tool

Cold spray of stainless steel

Thermal processing apparatus

Pre-heater latch and seal mechanism for wave solder machine and related method

Electrical contacts, fusible members, and methods of attaching electrical contacts to substrates

Solder paste, joining method using the same and joined structure

Pane having an electrical connection element

Method for eutectic bonding of two carrier devices

Flux Composition and Techniques for Use Thereof

MASK FOR LOADING BALL, BALL LOADING APPARATUS AND METHOD FOR MANUFACTURING PRINTED WRING BOARD USING MASK

Method for forming interposers and stacked memory devices

Lead-free and antimony-free tin solder reliable at high temperatures

Method of soldering an electronic component with a high lateral accuracy

Dual solder layer for fluidic self assembly and electrical component substrate and method employing same

Carrier plate, device having the carrier plate and method for producing a carrier plate

Lead-free solder ball

High-temperature lead-free solder alloy

FORCED CONVECTION PRE-HEATER FOR WAVE SOLDER MACHINE AND RELATED METHOD

INTEGRATED CIRCUIT PACKAGE HAVING IMPROVED COPLANARITY

Screen printing apparatus, electronic component mounting system and screen printing method

Ceramic circuit substrate and its production method

Electronic component, arrangement and method

SELF-SECURING BRAZING PREFORM CLIP

DEVICES AND METHODS FOR CONNECTING BATTERY CELLS

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Anisotropic conductive adhesive

Method of soldering electronic part

COMBINATION OF A FLEXIBLE PRINTED CIRCUIT BOARD AND A RIGID PRINTED CIRCUIT BOARD AND METHOD OF MAKING THE SAME

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

Method for making support structure for probing device

Semiconductor processing boat design with pressure sensor

Method and assembly including a connection between metal layers and a fusible material

Methods for simultaneously brazing a ferrule and lead pins

Tool and method of reflow

METHOD FOR MECHANICALLY AND ELECTRICALLY JOINING ELECTRICAL CONDUCTORS

Ball grid array system

Double solder bumps on substrates for low temperature flip chip bonding

Flexible circuit board interconnection and methods

Solder alloy, solder paste, and electronic circuit board

Method for connecting a component to a support via soldering and component connectable with a support

Heater for bonding apparatus and method of cooling the same

Semiconductor component with chip for the high-frequency range

Removal apparatuses for semiconductor chips

Solder-on-die using water-soluble resist system and method

Electronic component mounting system, electronic component mounting method, and electronic component mounting machine

SOLDERING NOZZLE FOR DELIVERING MOLTEN SOLDER TO THE UNDERSIDE OF A PCB, METHOD OF REDUCING THE RATE OF OCCURRENCE OF DEWETTING OF A SOLDER NOZZLE

Thermal compression bonding process cooling manifold

Method of manufacturing printed circuit board and printed circuit board

Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device

Methods of operating bonding machines for bonding semiconductor elements, and bonding machines

3D TSV assembly method for mass reflow

Direct integration of feedthrough to implantable medical device housing by sintering

Direct integration of feedthrough to implantable medical device housing with ultrasonic welding

Direct integration of feedthrough to implantable medical device housing using a gold alloy

ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD

ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING SYSTEM

ROTOR CORE ASSEMBLY FOR A RELUCTANCE MOTOR AND MANUFACTURING METHOD OF THE SAME

Disk having an electrical connection element

Electronic apparatus and method for fabricating the same

Method for joining ceramic bodies by means of an active hard solder, or braze, assembly having at least two ceramic bodies joined with one another, especially a pressure measuring cell

Surface mounting method utilizing active resin composition

SOLDERING A SEMICONDUCTOR DEVICE AND A SUBSTRATE BASED ON OSCILLATING FREQUENCIES

SURFACE MOUNTING QUARTZ CRYSTAL UNIT AND METHOD OF FABRICATING THE SAME

Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements

Aluminum coated copper bond wire and method of making the same

Lead free solder bumps

Solder joint material and method of manufacturing the same

Solder ball and electronic member

ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD

Through type furnace for substrates comprising a longitudinal slit

Solder alloy, solder paste, and electronic circuit board

Electrical device and method for producing same

Method For Minimizing Voids When Soldering Printed Circuit Boards And Soldering Device For Carrying Out Said Method

Reflow oven and methods of treating surfaces of the reflow oven

Screen printing machine, electronic component mounting system, and screen printing method

Apparatus and method of attaching solder ball and method of fabricating semiconductor package including solder ball

System and method for flux coat, reflow and clean

Method of forming a cermet-containing bushing for an implantable medical device having a connecting layer

Solder piece, chip solder and method of fabricating solder piece

Mechanism to attach a die to a substrate

METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, MOVING OBJECT, AND LID BODY

Manufacturing method of electronic device, electronic device, electronic apparatus, moving object, and lid body

Support unit and substrate treating device including the same

Semiconductor device package including bonding layer having AgSn

Conductive paste and die bonding method

Low temperature method for hermetically joining non-diffusing ceramic materials

Optical assembly including electrically conductive coupling member and related methods

Header assembly for a pressure sensor

Method of forming metal bonding layer and method of manufacturing semiconductor light emitting device using the same

Hard disk drive with feedthrough connector

Soldering apparatus and manufacturing method of soldered product

Chip joining by induction heating

Device implantable under skin

Solder alloy

Solder bump stretching method and device for performing the same

Solder preforms and solder alloy assembly methods

LED based illumination device with integrated output window

LOW-TEMPERATURE PACKAGING METHODOLOGY FOR ELECTRONIC DEVICES AND OTHER DEVICES

Reducing formation of oxide on solder

Ceramic pressure sensor and method for production thereof

Die attachment apparatus and method utilizing activated forming gas

Method for contacting at least two metal electrodes and arrangement

VCSEL packaging

Wavelength conversion member, light emitting device, and method of manufacturing light emitting device

Method and system for attaching flexible circuits to a mounting surface

Bump electrode, board which has bump electrodes, and method for manufacturing the board

Three-dimensional chip stack and method of forming the same

Ball mounting method and working machine for board

NON-UNIFORM HEATER FOR REDUCED TEMPERATURE GRADIENT DURING THERMAL COMPRESSION BONDING

INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Method for manufacturing terminal-strip-equipped electronic component and terminal-strip-equipped electronic component

Changing printing control parameters based on measured solder paste deposits in certain subareas of a printed circuit board

Electromagnetic field assisted self-assembly with formation of electrical contacts

Laser light source device and method for manufacturing laser light source device

SOLDERING EQUIPMENT FOR CONNECTING SOLAR CELLS

Sintered body made from silver fine particles

Vacuum carriers for substrate bonding

Method and apparatus for aligning a laser to a waveguide

Manufacturing method of radiator-integrated substrate and radiator-integrated substrate

Method of manufacturing laser diode unit utilizing submount bar

Lead-free solder alloy

Solder joint structure, power module, power module substrate with heat sink and method of manufacturing the same, and paste for forming solder base layer

Electronic part and method for forming joint structure of electronic part and joining object

Reflow treating unit and substrate treating apparatus

Power module substrate, power module substrate with heat sink, and power module

METHOD FOR CARRYING OUT SOLDER CONNECTIONS IN A TECHNOLOGICALLY OPTIMIZED MANNER

Resin composition for solder bump formation, solder bump formation method, and member having solder bumps

Micromechanical measuring element and method for producing a micromechanical measuring element

POWER MODULE SUBSTRATE, POWER MODULE, AND METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE

ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME

METHOD OF JOINING COMPONENTS USING METAL PASTE WITH OXIDIZING AGENTS

Interconnection assemblies and methods for forming the interconnection assemblies in a battery module

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same

Transient liquid phase bonding process for double sided power modules

MANUFACTURING METHOD FOR A SHIELD CONDUCTOR

Apparatus for thermal melting process and method of thermal melting process

Water removing method, optical fiber soldering method, and semiconductor laser module manufacturing method

WIRE BONDING METHOD FOR FLEXIBLE SUBSTRATES

Heat processing device

Joining method, joint structure and method for producing the same

BRAZING STRUCTURE, AND RELATED PROCESSES AND DEVICES

Temperature triggering ejector mechanism for lock pin soldering type component

JOINING BULK METALLIC GLASS SHEETS USING PRESSURIZED FLUID FORMING

Sensor unit, method of manufacturing the same, electronic apparatus, and moving object

Joining method, method for producing electronic device and electronic part

Solder paste

Manufacturing of a heat sink by wave soldering

Joint structure and semiconductor device storage package

Ceramic circuit board and process for producing same

Method and device for cooling soldered printed circuit boards

Microfeature workpieces having alloyed conductive structures, and associated methods

Method and apparatus for providing a ground and a heat transfer interface on a printed circuit board

Interconnect alloy material and methods

Integrate rinse module in hybrid bonding platform

Method for forming interposers and stacked memory devices

Reflow film, solder bump formation method, solder joint formation method, and semiconductor device

Laminated composite made up of an electronic substrate and a layer arrangement comprising a reaction solder

Bonding structure manufacturing method, heating and melting treatment method, and system therefor

Flip chip packaging method, and flux head manufacturing method applied to the same

LAYERED COMPOSITE OF A SUBSTRATE FILM AND OF A LAYER ASSEMBLY COMPRISING A SINTERABLE LAYER MADE OF AT LEAST ONE METAL POWDER AND A SOLDER LAYER

Method of manufacturing electronic component unit

Conveyor apparatus

Method of forming external terminals of a package and apparatus for performing the same

Joining method and semiconductor device manufacturing method

Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method

Electronic device and manufacturing method thereof

Metallized film-over-foam contacts

Low-stress TSV design using conductive particles

Solder assembly temperature monitoring process

Fixture to constrain laminate and method of assembly

Method for manufacture of a multi-layer plate device

Method for manufacturing semiconductor device, and semiconductor device

Electronic component termination and assembly by means of transient liquid phase sintering metalurgical bonds

Electronic part mounting substrate and method for producing same

Methods and structures for forming and improving solder joint thickness and planarity control features for solar cells

Surface treating composition for copper and copper alloy and utilization thereof

Flux spray machine

Solder joint structure and solder joining method

Active braze techniques on beta-alumina

Debond interconnect structures

Method for making an electrical circuit

Method of manufacturing electronic device, electronic apparatus, and mobile apparatus

Corrugated solder pre-form and method of use

Double solder bumps on substrates for low temperature flip chip bonding

Systems and methods for enhancing performance of a microphone

JOINT STRUCTURE OF PACKAGE MEMBERS, METHOD FOR JOINING SAME, AND PACKAGE

Connection verification technique

Increasing the efficiency of solar cells by transfer of solder

Innovative multi-purpose dipping plate

Electrically conductive compositions comprising non-eutectic solder alloys

Metal cored solder decal structure and process

Hot bar soldering

Vacuum reflow voiding rework system

Solar cell pad dressing

Method for manufacturing electronic component device with a Ni—Bi alloy sealing frame

BRAZING METHOD

Bump structure for yield improvement

Hotbar device and methods for assembling electrical contacts to ensure co-planarity

Method for fabricating solder columns for a column grid array package

Solder transfer substrate, manufacturing method of solder transfer substrate, and solder transfer method

Leadless multi-layered ceramic capacitor stacks

Solder alloy

Bonding material and bonding body, and bonding method

Electric connecting structure comprising preferred oriented CuSngrains and method for fabricating the same

Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part

Clad material for insulating substrates

Flip chip assembly apparatus employing a warpage-suppressor assembly

Electronic component mounting device

SYSTEM IN PACKAGE MODULE ASSEMBLY

APPARATUS AND METHOD OF INTERCONNECTING A PLURALITY OF SOLAR CELLS

Method for thin die-to-wafer bonding

Wire Holding Device

Apparatus and method of manufacturing laser diode unit utilizing submount bar

Making stacked pancake motors using patterned adhesives

Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method

Shaped electrical conductor

Reflow soldering apparatus and method

Junction material, manufacturing method thereof, and manufacturing method of junction structure

Reflow oven and methods of treating surfaces of the reflow oven

Apparatus and method for forming electrical solder connections in a disk drive unit

Method and arrangement for attaching a chip to a printed conductive surface

SYSTEM, METHOD, AND COMPUTER PROGRAM PRODUCT FOR CONTROLLING WARPING OF A SUBSTRATE

Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components

Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure body

Solder paste transfer process

Brazing method and brazed structure

Magnetic attachment structure

Mechanisms for controlling bump height variation

Solder bump joint in a device including lamellar structures

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE SINTERED BOND

Interposer Having Conductive Posts

Light-Emitting Diode Area Light Module and Method for Packaging the Same

Hermetically sealed electronic device using solder bonding

ELECTROMAGNETIC FIELD ASSISTED SELF-ASSEMBLY WITH FORMATION OF ELECTRICAL CONTACTS

Transfer substrate for forming metal wiring and method for forming metal wiring using said transfer substrate

Innovative braze and brazing process for hermetic sealing between ceramic and metal components in a high-temperature oxidizing or reducing atmosphere

Solder paste transfer process

Method for gold removal from electronic components

Manufacturing method of solder transfer substrate, solder precoating method, and solder transfer substrate

Multi-layer plate device

Method for making a solder joint

Hotbar device and methods for assembling electrical contacts to ensure co-planarity

LASER-BEAM DEVICE, LASER-SOLDERING TOOL AND METHOD, FOR LASER-SOLDERING CONNECTION PADS OF A HEAD-STACK ASSEMBLY FOR A HARD-DISK DRIVE

Method for electrically connecting a pair of circuit boards using a pair of board connectors and an interconnector

METHOD FOR SUPPRESSING KIRKENDALL VOIDS FORMATION AT THE INTERFACE BETWEEN SOLDER AND COPPER PAD

Integrated Reflow and Cleaning Process and Apparatus for Performing the Same

Plate and shaft device

Joining method and semiconductor device manufacturing method

CARRIER FOR CIRCUIT BOARD

ELECTRICAL SOLDERING IRON HEAD

Ball grid array to pin grid array conversion

Sn—Sb—Ni ternary compound and method for forming the same

Bi—Sn based high-temperature solder alloy

SOLDER SPATTERING SUPPRESSED REFLOW METHOD

Reflow soldering system

SEMICONDUCTOR DEVICE

SOLDER BONDING PROCESS FORMING A SEMICONDUCTOR CHIP IN MULTIPLE STAGES ON A 3-DIMENSIONAL STACKED ASSEMBLY

Patterning method for component boards

CONDUCTIVE BONDING MATERIAL, CONDUCTOR BONDING METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD

Electronic component, electronic module, and method for manufacturing the same