Electromagnetic coil assemblies including disparate wire splice connectors, disparate wire splice connectors, and associated methods

Flux composition and method of soldering

Polyamine, carboxylic acid flux composition and method of soldering

Curable amine, carboxylic acid flux composition and method of soldering

Curable flux composition and method of soldering

Solder piece, chip solder and method of fabricating solder piece

Welding jig and welding process for planar magnetic components

Feed-through assembly

SOLDERING METHOD AND SOLDERING APPARATUS

Method for Reliably Soldering Microwave Dielectric Ceramics with Metal

Soldering on thin glass sheets

Interconnection assemblies and methods for forming the interconnection assemblies in a battery module

SOLDER BONDED BODY, METHOD OF PRODUCING SOLDER BONDED BODY, ELEMENT, PHOTOVOLTAIC CELL, METHOD OF PRODUCING ELEMENT AND METHOD OF PRODUCING PHOTOVOLTAIC CELL

High temperature thermoelectrics

Grooved circuit board accommodating mixed-size components

Solder bump cleaning before reflow

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

Method for controlling beta-tin orientation in solder joints

Removal apparatuses for semiconductor chips

Microfeature workpieces having alloyed conductive structures, and associated methods

CAMERA MODULE AND METHOD FOR MAKING SAME

Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor device

Flux composition and techniques for use thereof

Process for manufacturing a device comprising brazes produced from metal oxalate

MOUNTING METHOD, MOUNTING DEVICE AND MOUNTING JIG

Joint structures having organic preservative films

INTERNAL COMBUSTION ENGINE EXHAUST THERMOELECTRIC GENERATOR AND METHODS OF MAKING AND USING THE SAME

Method of Manufacturing a semiconductor module and device for the same

Low-stress TSV design using conductive particles

Solder alloys and arrangements

Injection molded solder process for forming solder bumps on substrates

Injection molded solder process for forming solder bumps on substrates

BUMP WITH NANOLAMINATED STRUCTURE, PACKAGE STRUCTURE OF THE SAME, AND METHOD OF PREPARING THE SAME

REDUCED STRESS GULL WING SOLDER JOINTS FOR PRINTED WIRING BOARD CONNECTIONS

Bonding material and bonding method using the same

Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit board

METHOD OF JOINING A CHIP ON A SUBSTRATE

ELECTRONIC DEVICE WITH OBLIQUELY CONNECTED COMPONENTS

Solder material for fastening an outer electrode on a piezoelectric component and piezoelectric component comprising a solder material

SOLDERING METHOD AND RELATED DEVICE FOR IMPROVED RESISTANCE TO BRITTLE FRACTURE

Method of reflowing using a compression box with a pressurizing plate

VACUUM PALLET REFLOW

SOLDERING ASSISTANCE DEVICE AND SOLDERING METHOD THEREOF

Method for conductively connecting a component on a transparent substrate

Process for mapping formic acid distribution

Corrugated Solder Pre-form and Method of Use

Circuits and methods using a non-gold corrosion inhibitor

ELECTRONIC COMPONENT, ELECTRONIC EQUIPMENT, AND SOLDERING PASTE

SOLDER PASTES FOR PROVIDING IMPACT RESISTANT, MECHANICALLY STABLE SOLDER JOINTS

Soldering method

Soldering device for forming electrical solder connections in a disk drive unit

LAND GRID ARRAY (LGA) CONTACT CONNECTOR MODIFICATION

MULTISTACK SOLDER WAFER FILLING

PROCESS AND APPARATUS FOR PROVIDING A SOLAR CELL WITH A SOLDER RIBBON

DEFECTIVE CONDUCTIVE SURFACE PAD REPAIR FOR MICROELECTRONIC CIRCUIT CARDS

SOLDERING METHOD, GYROSCOPE AND SOLDERED PART

Flux composition and techniques for use thereof

Flux composition and techniques for use thereof

Flip chip assembly method employing post-contact differential heating

Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor device

Reflow method for lead-free solder

Methods and systems involving soldering

Terminal assembly with regions of differing solderability

Method of full-field solder coverage by inverting a fill head and a mold

Method and soldering system of soldering a DIP component on a circuit board

CERMET-CONTAINING BUSHING FOR AN IMPLANTABLE MEDICAL DEVICE HAVING A CONNECTING LAYER

Method of gold removal from electronic components

Fixture to constrain laminate and method of assembly

METHOD FOR SOLDERING ELECTRONIC COMPONENTS TO A CIRCUIT BOARD BY MEANS OF HIGH-FREQUENCY SOLDERING

Printed wiring board, method of soldering quad flat package IC, and air conditioner

Nozzle for heating device, heating device, and nozzle for cooling device

Method of manufacturing semiconductor device

FLIP CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

ACTIVE RESIN COMPOSITION, SURFACE MOUNTING METHOD AND PRINTED WIRING BOARD

Ceramic circuit board and process for producing same

Solder paste, joining method using the same and joined structure

Semiconductor chip assembly and method for making same

Metal paste with oxidizing agents

Apparatus for thermal melting process and method of thermal melting process

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Wiring board and method of manufacturing the same

Bonding structure and bonding method of heat diffusion member, and cooling unit using the same

Techniques for forming solder bump interconnects

METHOD FOR FABRICATING OPTICAL SEMICONDUCTOR DEVICE

SEMICONDUCTOR SUBSTRATE AND METHOD THEREOF

GAS FEED DEVICE FOR A WAVE SOLDERING OR TINNING MACHINE

Thermal gradient reflow for forming columnar grain structures for solder bumps

Inert environment enclosure

Solder mold plates used in packaging process and method of manufacturing solder mold plates

LEAD-FREE HIGH TEMPERATURE COMPOUND

PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor device

Reducing formation of oxide on solder

ELECTRONIC-COMPONENT-MOUNTED WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

AUTOMATIC SOLDERING APPARATUS AND SOLDERING METHOD THEREOF

METHOD OF PROTECTING A PRINTED CIRCUIT BOARD AND RELATED APPARATUS

Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer

Methods of Soldering to High Efficiency Thin Film Solar Panels

Linear cell stringing

Composite electronic module and method of manufacturing composite electronic module

Semiconductor apparatus and the method of manufacturing the same

Fixture to constrain laminate and method of assembly

Method for Control of Solder Collapse in Stacked Microelectronic Structure

Package substrate unit and method for manufacturing package substrate unit

Soldering entities to a monolithic metallic sheet

Simulated wirebond semiconductor package

Quick-loading soldering apparatus

Automatic soldering system

Wiring substrate manufacturing method

SQUEEGEE MODULE

Flip chip bonder head for forming a uniform fillet

WIRING SUBSTRATE MANUFACTURING METHOD

Selective thermal conditioning components on a PCB

Soldering apparatus

Forming low stress joints using thermal compress bonding

PRE-SOLDER METHOD AND REWORK METHOD FOR MULTI-ROW QFN CHIP

Cream solder and method of soldering electronic part

ASSEMBLY, AND ASSOCIATED METHOD, FOR FORMING A SOLDER CONNECTION

Electrical feedthrough assembly

Submount for Electronic Die Attach with Controlled Voids and Methods of Attaching an Electronic Die to a Submount Including Engineered Voids

FLUX CLEANING APPARATUS

Mask frame apparatus for mounting solder balls

Compression box for reflow oven heating with a pressurizing plate

BATTERY MODULE AND METHODS FOR BONDING A CELL TERMINAL OF A BATTERY TO AN INTERCONNECT MEMBER

Solder bump formation on a circuit board using a transfer sheet

Battery Module

Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes

Sintering silver paste material and method for bonding semiconductor chip

Method for device packaging

Point flow soldering apparatus

MAGNETIC PARTICLE ATTACHMENT MATERIAL

Automatic soldering device and carrier device

Magnetic attachment structure

Device for removing adhered substances

Integrated transformer

METHOD AND DEVICE FOR INTRODUCING SOLDER ONTO A WORKPIECE

SYSTEM FOR DISPENSING SOFT SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS USING MULTIPLE SOLDER WIRES

Method for fixing a photovoltaic cell connector on a surface of a photovoltaic cell, photovoltaic cell connector forming die, device for fixing a photovoltaic cell connector on a surface of a photovoltaic cell

Method of manufacturing an electronic component

Substrate having laser sintered underplate

Collimator bonding structure and method

Manufacturing method for electronic devices

Soldering apparatus

Debond interconnect structures

Soldering apparatus

Methods for forming cavity antennas

Methods for rework of a solder

SOLDERING FLUX AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME

Semiconductor device and method for manufacturing the same

Apparatus for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation

Method of manufacturing electronic device and electronic device

Flux-free chip to substrate joint serial linear thermal processor arrangement

METHOD OF PRODUCING ELECTRICAL COMPONENT, ELECTRICAL COMPONENT PRODUCTION DEVICE, AND PHOTOSENSITIVE RESIST

Method and apparatus for applying solder to a work piece

Lead-free solder alloy having reduced shrinkage cavities

Method of full-field solder coverage using a vacuum fill head

Solder alloy and semiconductor device

Electronic component unit and manufacturing method thereof

Method of providing electric current taker for support bar, and support bar

SOLDER, ELECTRONIC PART, AND METHOD OF FABRICATING ELECTRONIC PART

Electronic component mounting system and electronic component mounting method

Stable Gold Bump Solder Connections

Solder Ball Pin

Method and Electronic Assembly to Attach a Component to a Substrate

BONDING APPARATUS

REAL TIME MONITORING OF INDIUM BUMP REFLOW AND OXIDE REMOVAL ENABLING OPTIMIZATION OF INDIUM BUMP MORPHOLOGY

THIN WAFER DETECTORS WITH IMPROVED RADIATION DAMAGE AND CROSSTALK CHARACTERISTICS

Nanotube modified solder thermal intermediate structure, systems, and methods

APPARATUS FOR REPAIRING SEMICONDUCTOR MODULE

Automatic convey device

APPARATUS FOR FORMING SOLDER DAM

APPARATUS FOR FORMING SOLDER DAM AND METHOD OF FORMING SOLDER DAM

METHOD OF FORMING SOLDER DAM

Method for Soldering Contact Wires to Solar Cells

Methods of fabricating low melting point solder reinforced sealant and structures formed thereby

Substrate and substrate bonding device using the same

Clad solder thermal interface material

Methods for the fabrication of microelectronic device substrates by attaching two cores together during fabrication

CLAD SOLDER THERMAL INTERFACE MATERIAL

RESIDUAL OXYGEN MEASUREMENT AND CONTROL IN WAVE SOLDERING PROCESS

Method for inhibiting growth of nickel-copper-tin intermetallic layer in solder joints

Jig For Probe Connector

CONNECTING ELECTRICAL PARTS

Electronic component device with a Ni-Bi alloy sealing frame

SOLDER SUPPORTING LOCATION FOR SOLAR MODULES AND SEMICONDUCTOR DEVICE

Solder structure, method for forming the solder structure, and semiconductor module including the solder structure

Bonding material with exothermically reactive heterostructures

Injection molded solder method for forming solder bumps on substrates

Method for creating highly compliant thermal bonds that withstand relative motion of two surfaces during temperature changes using spacing structures

Mounting structure, and method of manufacturing mounting structure

Method for creating thermal bonds while minimizing heating of parts

Socket connector with contact terminal having waveform arrangement adjacent to tail portion perfecting solder joint

Joint structure, joining material, and method for producing joining material containing bismuth

Stable gold bump solder connections

MICRO-BALL REMOVAL METHOD AND REMOVAL DEVICE, AND MICRO-BALL COLLECTIVE MOUNTING METHOD AND COLLECTIVE MOUNTING APPARATUS

Reflow bonding method and method of manufacturing head suspension

Bumping Electronic Components Using Transfer Substrates

Solder bonding method and apparatus

Manufacturing method of solid-state image pickup device

Heat conducting apparatus and solder melting method therefor

Soldering equipment and soldering method for electronic components

MULTISTACK SOLDER WAFER FILLING

SYSTEM FOR REDUCING METALLIC WHISKER FORMATION

Power module substrate, power module, and method for manufacturing power module substrate

Reflow Air Management System and Method

Method of manufacturing electronic component lead using laser beam

Large area modular sensor array assembly and method for making the same

Method of attaching a solder ball and method of repairing a memory module

Self-aligned carrier assembly for optical device supporting wafer scale methods

Induction soldering of photovoltaic system components

APPARATUS AND METHOD FOR ELECTRONIC CIRCUIT MANUFACTURE

Ceramic electronic component and method for producing same

Mounting structure and motor

Elliptic C4 with optimal orientation for enhanced reliability in electronic packages

Quick-loading soldering apparatus

Method of joining a chip on a substrate

ENHANCED SOLDERABILITY USING A SUBSTANTIALLY PURE NICKEL LAYER DEPOSITED BY PHYSICAL VAPOR DEPOSITION

SOLDER JOINT STRUCTURE, AND JOINING METHOD OF THE SAME

Connection verification technique

Solder bonding structure and soldering flux

Joining of Electrical Generator Components

Jetting device and method at a jetting device

Inert environment enclosure

Method for connecting a component with a substrate

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Semiconductor chip thermal interface structures

Method for manufacturing semiconductor device

Assembly method by reactive brazing and vacuum cartridge assembled according to this method

SYSTEM AND METHOD FOR VAPOR PHASE REFLOW OF A CONDUCTIVE COATING

Joint structure and electronic component

Lead-free solder alloy

Manufacturing method for electronic devices

Method for manufacturing power module substrate, power module substrate, and power module

GAS FEED DEVICE FOR A WAVE SOLDERING OR TINNING MACHINE

CHIP PACKAGING METHOD

ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Controlled Application of Solder Blocks to Establish Solder Connections

Solder ball printing apparatus

Method and apparatus for an improved filled via

METAL PASTES AND USE THEREOF IN THE PRODUCTION OF POSITIVE ELECTRODES ON P-TYPE SILICON SURFACES

Terminal assembly with regions of differing solderability

JOINT WITH FIRST AND SECOND MEMBERS WITH A JOINING LAYER LOCATED THEREBETWEEN CONTAINING SN METAL AND ANOTHER METALLIC MATERIAL; METHODS FOR FORMING THE SAME

Enhanced Connector Cradle Having a Cooling Shell for Preferential Cooling of Wafers

Pb-free solder-connected structure and electronic device

Hermetic electrical ports in liquid crystal polymer packages

Sputter target and backing plate assembly

Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device

Reflow apparatus, reflow method, and package apparatus

SYSTEM AND METHOD FOR SOLDER BONDING

Apparatus and method of coating flux

Solder ball mounting method and apparatus

Coil and semiconductor apparatus having the same

Injection molded solder method for forming solder bumps on substrates

Printed wiring board having a stiffener

THERMOELECTRIC MODULE PACKAGE AND MANUFACTURING METHOD THEREFOR

Electronic Device and Manufacturing Method for Electronic Device

Bonding apparatus and bonding method

Apparatus for interconnecting connection pads of a head-gimbal assembly and manufacturing method for the head-gimbal assembly

Bonding apparatus and bonding method

Selective solder stop

Microcavity structure and process

Semiconductor Chip Package System Vertical Interconnect

Paste dispenser for applying paste containing fillers using nozzle with pin and application method using the same

Assembly techniques for electronic devices having compact housing

Method and apparatus for forming planar alloy deposits on a substrate

Wide wave apparatus for soldering an electronic assembly

Methods of fabricating robust integrated heat spreader designs and structures formed thereby

Method for making vacuum airtight container

TIN ALLOY SOLDER COMPOSITION

Method and device for contacting, positioning and impinging a solder ball formation with laser energy

Minute ball array apparatus

CIRCUIT BOARD CARRIER/SOLDER PALLET

INDUCTIVE SOLDERING DEVICE

Auxiliary welding apparatus

BULK METALLIC GLASS SOLDER MATERIAL

Method of manufacturing a substrate, substrate, device provided with a substrate, and determining method

Method and apparatus for forming planar alloy deposits on a substrate

INSPECTING APPARATUS

Reflow furnace

Reflow furnace and heater for blowing hot air

SPUTTER TARGET ASSEMBLY HAVING A LOW-TEMPERATURE HIGH-STRENGTH BOND

Soldering method and soldering apparatus

Process for welding electrical connectors and welding device thereof

Wave soldering tank

Solder standoffs for injection molding of solder

Heating furnace and heating method employed by heating furnace

Method and apparatus for laser soldering

ATTACHING A LEAD-FREE COMPONENT TO A PRINTED CIRCUIT BOARD UNDER LEAD-BASED ASSEMBLY CONDITIONS

Techniques for arranging solder balls and forming bumps

Techniques for arranging solder balls and forming bumps

Method of bonding semiconductor devices utilizing solder balls

Bonding method for through-silicon-via based 3D wafer stacking

Method for inhibiting electromigration-induced phase segregation in solder joints

Replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bath

Circuit board conveying and soldering apparatus

Techniques for arranging solder balls and forming bumps

Infrared emitter with flexible Circuit board

Soldering Container and Production Method of Semiconductor Device

Solder mold plates used in packaging process and method of manufacturing solder mold plates

Method and apparatus for beam soldering