Cu pillar cylindrical preform for semiconductor connection

Copper-titanium alloy foil having plated layer

Titanium copper foil having plated layer

Metal wiring bonding structure and production method therefor

SOLDER-COATED BALL AND METHOD FOR MANUFACTURING SAME

Method for producing a disk with an electrically conductive coating and a metal strip which is soldered onto the disk; and corresponding disk

Electrostatic chuck for clamping in high temperature semiconductor processing and method of making same

Method for manufacture of a multi-layer plate device

Systems of bonded substrates and methods for bonding substrates with bonding layers

Bonding material and bonding method using same

Solder paste

RF SHIELD WITH SELECTIVELY INTEGRATED SOLDER

Stencil frames

APPARATUS FOR ESPECIALLY THERMALLY JOINING MICRO-ELECTROMECHANICAL PARTS

Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices

BRAZING GAP SPACING APPARATUS AND METHOD

Metal plate for laser processing and method for producing stainless steel plate for laser processing

Device and method for recovering tin-lead solder from scrap

Attaching electronic components to interactive textiles

Process and device for low-temperature pressure sintering

Method of controlling bump height variation

Techniques and configurations to control movement and position of surface mounted electrical devices

Ceramic combo lid with selective and edge metallizations

PRODUCING METHOD OF POWER-MODULE SUBSTRATE

Method for producing glass substrate and glass sheet

Laser apparatus with capacitor disposed in vicinity of laser diode

Rotational removal of electronic chips and other components from printed wire boards using liquid heat media

Method for manufacturing a biological fluid sensor

SOLDERING JIG FOR DOUBLE-FACED COOLING POWER MODULE

Apparatus for manufacturing thermoelectric module

BONDING SYSTEM AND ASSOCIATED APPARATUS AND METHOD

CAPILLARY BLOCK

CAPILLARY BLOCK

Reliable transportation mechanism for micro solder balls

Directly integrated feedthrough to implantable medical device housing

DIRECTLY INTEGRATED FEEDTHROUGH FOR AN IMPLANTABLE MEDICAL DEVICE HOUSING USING A GOLD ALLOY

ULTRASONIC PROBE AND METHOD OF MANUFACTURING THE SAME

PANEL WITH RELEASABLE CORE

Low temperature high reliability alloy for solder hierarchy

Multi-strike process for bonding packages and the packages thereof

Method for making a seam-sealable non-magnetic lid and package

PV-MODULE AND METHOD FOR MAKING A SOLDER JOINT

Method for producing metal ball, joining material, and metal ball

Development of the advanced component in cavity technology

Ceramic circuit board and method for producing same

Warpage mitigation in printed circuit board assemblies

BALL GRID ARRAY SOLDER ATTACHMENT

Semiconductor package alignment frame for local reflow

Transdermal sensing probes and smart patch systems using same

NO CLEAN FLUX COMPOSITION AND METHODS FOR USE THEREOF

Galvanic pellicle removable attachment tool

METAL PATCH, METHOD FOR MANUFACTURING THE SAME AND BONDING METHOD BY USING THE SAME

Strain relief apparatus for solar modules

Method of installing a strain relief apparatus to a solar cell

CHIP CARRIER HAVING VARIABLY-SIZED PADS

LED tube lamp

Device for the separate application of bonding material deposits

Solder flux

Method of printing solder paste

Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly

Light emitting diode (LED) components including multiple LED dies that are attached to lead frames

Bonding apparatus and method of estimating position of landing point of bonding tool

Clamping device for soldering operations

Method of mounting electronic part, circuit substrate, and image forming apparatus

Methods of forming solar cells with fired multilayer film stacks

Fired multilayer stacks for use in integrated circuits and solar cells

Circuit card attachment for enhanced robustness of thermal performance

Method for filling a wafer via with solder

Print-on pastes for modifying material properties of metal particle layers

Sintering materials and attachment methods using same

Increasing solder hole-fill in a printed circuit board assembly

PROCESS OF FORMING SEMICONDUCTOR DEVICE

METAL PREPARATION FOR CONNECTING COMPONENTS

Nickel particle composition, bonding material, and bonding method in which said material is used

APPARATUS, METHODS, AND SYSTEMS FOR REMOVING COMPONENTS FROM A CIRCUIT BOARD

Engineered Residue Solder Paste Technology

Bump structure for yield improvement

Conductive paste

Methods and apparatuses for high temperature bonding controlled processing and bonded substrates formed therefrom

Generation of a Splice Between Superconductor Materials

Rework process and tool design for semiconductor package

CONTACT PROBE FOR A TESTING HEAD AND CORRESPONDING MANUFACTURING METHOD

SOLDER PASTE AND SOLDERING FLUX, AND MOUNTED STRUCTURE USING SAME

Bonding material and bonding method using same

Forming a solder joint between metal layers

System for pressing pre-tin shaping

Method for embedding a discrete electrical device in a printed circuit board

Wire splicing device, wire splicing method, and method for manufacturing splice structure

Wire splicing device, wire splicing method, and method for manufacturing splice structure

Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same

Header assembly for a pressure sensor

Die mounting system and die mounting method

Apparatus and method for attaching interconnector of solar cell panel

Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same

INTEGRATED CIRCUIT ALIGNMENT TOOL

Apparatus and method for attaching interconnector of solar cell panel

Metal cap assembly for optical communications

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

PREFORM STRUCTURE FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT, A METHOD FOR FORMING A PREFORM STRUCTURE FOR A SEMICONDUCTOR CHIP ARRANGEMENT, AND A METHOD FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT

Lead solder joint structure and manufacturing method thereof

Bonding material and bonding method using same

Jet nozzle and jet soldering apparatus

Soldering Device Minimizing Voids When Soldering Printed Circuit Boards

Direct integration of feedthrough to implantable medical device housing with ultrasonic welding

TRANSFERRING MEMBER AND PRESSURE APPLYING UNIT

BALL GRID ARRAY (BGA) APPARATUS AND METHODS

Pressure applying unit

Viscous fluid coating device

Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines

Electronic apparatus and method for fabricating the same

Bonded body, power module substrate, power module and method for producing bonded body

Selecting a substrate to be soldered to a carrier

Desoldering apparatus and method

Method of forming electrical connections with solder dispensing and reflow

LIQUID PHASE BONDING OF A SILICON OR SILICON CARBIDE COMPONENT TO ANOTHER SILICON OR SILICON CARBIDE COMPONENT

SUBSTRATE ON SUBSTRATE PACKAGE

Heating cartridge and heating tool with same

Apparatus and methods for creating environmentally protective coating for integrated circuit assemblies

Method for manufacturing thermal interface sheet

PROCESS FOR JOINING METALLIC AND CERAMIC STRUCTURES

Corrugated solder pre-form and method of use

Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal

Multi-layer plate device

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

Low pressure sintering powder

Piezoelectric pressure sensor and process of manufacturing same

Pressure sensor

Electronic component structures with reduced microphonic noise

Method of joining cooling component

Method and apparatus for forming interface between coaxial cable and connector

Solder bump stretching method for forming a solder bump joint in a device

Lead-free soldering method and soldered article

Systems of bonded substrates and methods for bonding substrates with bonding layers

Electronic apparatus and method for fabricating the same

REFLOW APPARATUS

Integrate rinse module in hybrid bonding platform

Imaging apparatus including an image sensor chip mount assembly

APPARATUS AND METHOD WITH SELF-ASSEMBLING METAL MICROCHANNELS

Ceramic pressure measuring cell and method for its manufacture

Lead-free solder alloy

Integrated Circuit With Sensor Printed In Situ

Semiconductor chip metal alloy thermal interface material

Semiconductor device and method for manufacturing the same

Semiconductor processing boat design with pressure sensor

METHOD FOR BRAZING ROTOR WINDINGS

Solder application stamp for applying solder on contact locations possessing small dimensions

Device comprising a connecting component and method for producing a connecting component

Attaching electronic components to interactive textiles

Stencil set and system for printing solder paste for printed circuit boards

Thermocompression bonders, methods of operating thermocompression bonders, and horizontal correction motions using lateral force measurement in thermocompression bonding

Techniques for joining one or more structures of an electronic device

Lead-free solder ball

Vacuum soldering apparatus and control method therefor

Device packaging facility and method, and device processing apparatus utilizing phthalate

Conductive connections, structures with such connections, and methods of manufacture

Heat dissipation substrate and method for producing heat dissipation substrate

Method and apparatus for forming interface between coaxial cable and connector

Fixture to constrain laminate and method of assembly

Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same

Silver alloying post-chip join

Visual inspection apparatus and visual inspection method

METHOD FOR MOUNTING A COMPONENT ON A SUBSTRATE

Connection structure of circuit member, connection method, and connection material

Device implantable under skin

In-vehicle electronic module

Ni ball, Ni nuclear ball, solder joint, foam solder and solder paste

Increasing solder hole-fill in a printed circuit board assembly

Method for manufacturing a biological fluid sensor

Bonding apparatus

Soldering apparatus with automatic aligning function

Flux recovery device and soldering device

Electronic component mounting device

Three-dimensional chip stack and method of forming the same

Window clamp

Spring clips for mounting optics structures on an associated circuit board, and assemblies including the spring clips

CARBON-COATED-METAL POWDER, ELECTROCONDUCTIVE PASTE CONTAINING CARBON-COATED-METAL POWDER, LAYERED ELECTRONIC COMPONENT IN WHICH SAID PASTE IS USED, AND METHOD FOR MANUFACTURING CARBON-COATED-METAL POWDER

Manufacturing a product using a soldering process

Method for manufacturing a biological fluid sensor

Support entering into the fabrication of an electronic device, corresponding memory card connector, memory card read terminal and manufacturing method

Substrate manufactured from sheet metal and resin, motor provided with substrate, and soldering method therefor

Semiconductor package, electronic device, and solder mounting method

Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bond

Substrate unit, timepiece, and substrate bonding method

Flux recovery device and soldering device

Electronic apparatus and method for fabricating the same

Steering-column switch unit for operating at least one electrical consumer, which is operated by an electric load current, motor vehicle and method for producing a steering-column switch unit

Method for producing a connecting medium on an assembly partner, method for producing a material-fit connection between an assembly partner and a metal layer, and a system for carrying out the methods

Intelligent soldering cartridge for automatic soldering connection validation

Arc welding/brazing process for low-heat input copper joining

Thermal compression bonding process cooling manifold

Device for feeding a stream of hot gas

Semiconductor device and method for manufacturing the same

SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE

Titanium-copper alloy having plating layer

Ball grid array rework

Multilayer component comprising an external contact and method for producing a multilayer component comprising an external contact

Semiconductor module with reinforcing board

High temperature resistant silicon joint for the joining of ceramics

Nozzle for connecting or disconnecting solder joints between head bonding pads in a hard disk drive, and laser soldering or reflowing tool with the same

Device for soldering electrical or electronic components

Method of manufacturing a ceramic metallization for ceramic metal transition

Method for making a high temperature resistant silicon alloy joint for the joining of ceramics and devices using same

Electrical devices and methods for manufacturing same

Method of producing bonded body and method of producing power module substrate

Desoldering tool and control system

Methods for joining ceramic and metallic structures

Bonding method using bonding material

Alignment of three dimensional integrated circuit components

Steam reflow apparatus and steam reflow method

Oven-style nozzle for reworking operations involving bottom-side terminated components or other components

Method for producing a heating cable and heating cable produced according to this method

Method for connecting piezoelectric element and cable substrate, piezoelectric element having cable substrate, and inkjet head including piezoelectric element with cable substrate

Method of producing low alpha-ray emitting bismuth, and low alpha-ray emitting bismuth

Superconducting wire material having laminated structure and manufacturing method therefor

Methods of fabricating low melting point solder reinforced sealant and structures formed thereby

Reflow treating unit and substrate treating apparatus

Reflow treating unit and substrate treating apparatus

Method of bonding with silver paste

Flip-chip bonder with induction coils and a heating element

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF, AND WIRED CIRCUIT BOARD ASSEMBLY AND PRODUCING METHOD THEREOF

Debond interconnect structures

Circuit carrier, method for producing a circuit carrier, method for producing a circuit arrangement, method for operating a circuit arrangement and method for producing a semiconductor module

Capacitive, ceramic pressure-measuring cell and method for the production thereof

Transient liquid phase sinter pastes and application and processing methods relating thereto

LASER APPARATUS WITH CAPACITOR DISPOSED IN VICINITY OF LASER DIODE

SILVER-COMPOSITE SINTERING PASTES FOR LOW-TEMPERATURE SINTERING-BONDING

Solder ball jet nozzle having improved reliability

REACTIVE POWDER, BONDING MATERIAL USING REACTIVE POWDER, BONDED BODY BONDED WITH BONDING MATERIAL AND METHOD FOR PRODUCING BONDED BODY

Conveyor device for printed circuit boards

Mounting layer for cooling structure

Method for Soldering a Circuit Carrier to a Carrier Plate

REEL-TO-REEL MANUFACTURING PLANT FOR INTERLINKED CONTINUOUS AND DISCONTINUOUS PROCESSING STEPS

Wire splicing device, wire splicing method, and method for manufacturing splice structure

Bonding material and bonding method using the same

Apparatus for manufacturing semiconductor device and the semiconductor device

Bonding method for thin film diamond providing low vapor pressure at high temperature

Techniques and configurations to control movement and position of surface mounted electrical devices

Electronic component mounting system, electronic component mounting method, and electronic component mounting machine

Manufacturing of a heat sink by wave soldering

Cable connector assembly with cable wires made of heat-resisting material

Apparatus and method for manufacturing semiconductor device

Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement

Leadless multi-layered ceramic capacitor stacks

Forming a solder joint between metal layers

Hermetically sealed electronic device using solder bonding

Applying apparatus

Voiding control using solid solder preforms embedded in solder paste

Metallized particle interconnect with solder components

Metallized particle interconnect with solder components

Apparatus and method for producing (metal plate)-(ceramic board) laminated assembly, and apparatus and method for producing power-module substrate

Wave soldering nozzle system and method of wave soldering

Encapsulation process enabling hotbar soldering without direct PCB support

Method for producing a module

Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method

Increasing solder hole-fill in a printed circuit board assembly

Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part

Flip chip bonder and method of correcting flatness and deformation amount of bonding stage

Solder application method and apparatus

Feedthrough

Method of manufacturing electronic device

Semiconductor device and manufacturing method of semiconductor device

Solder alloy and joint thereof

Soldering iron with automatic soldering connection validation

Apparatus for cleaning an electronic circuit board

Solder pads, methods, and systems for circuitry components

Soldering system

Increasing the Efficiency of Solar Cells By Transfer of Solder

Apparatus for adsorbing solder ball and method of attaching solder ball using the same

Method for manufacturing power module substrate

Solder assembly temperature monitoring process

Device for thermal management of surface mount devices during reflow soldering

Semiconductor chip assembly and method for making same

METHODS OF ATTACHING ELECTRONIC COMPONENTS

Methods of operating bonding machines for bonding semiconductor elements, and bonding machines

Method and device for producing and filling containers

Manufacturing method of power-module substrate

Gas-blowing-hole array structure and soldering apparatus

METALLIZED FILM-OVER-FOAM CONTACTS

Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assembly

Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements

Pre-heater latch and seal mechanism for wave solder machine and related method

Heat-bonding apparatus and method of manufacturing heat-bonded products

Circuit interconnect system and method

Semiconductor chip assembly and method for manufacturing the same

Light emitting device and method of producing the light emitting device

ELECTRONIC DEVICE AND METHOD FOR PRODUCING SAME

Soldering jig and method

Electronic component mounting system and electronic component mounting method

Metastable gas heating

METHOD OF ELECTROPLATING COBALT ALLOY TO WIRING SURFACE

Gas-intake-port array structure and soldering apparatus

Vacuum pallet reflow

Chamber for conductors of electric machines

Device for interconnecting photovoltaic cells having contacts on their back side, and module comprising such a device

Method of making a ceramic combo lid with selective and edge metallizations

Method of manufacturing semiconductor device, substrate processing apparatus and recording medium

Wiring substrate for bonding using solder having a low melting point and method for manufacturing same

Semiconductor module bonding wire connection method

Pick-and-place tool for packaging process

Wafer level packages having non-wettable solder collars and methods for the fabrication thereof