Soldering Apparatus and Soldering Method

Joint structure, joining method, wiring board and method for producing the same

Solder ball attachment jig and method for manufacturing semiconductor device using the same

Soldering method and system thereof

Solder applying apparatus

Thermal interface material for combined reflow

PROCESS FOR JOINING MATERIALS USING A METALLIC HEAT SOURCE WITHIN A CONTROLLED ATMOSPHERE

METHOD AND TOOL FOR REPOSITIONING SOLDER FILL HEAD

Bump bonding method

Semiconductor package having substrate ID code and its fabricating method

Flux for soldering and method for manufacturing an electronic device using the same

Self-assembly of elements using microfluidic traps

SOLDER BUMP, ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT

Soldering Method, Soldering Apparatus and Method for Manufacturing Semiconductor Device

Disk drive device

OC2 oriented connections 2

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE

MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS

MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS

PCB mounting method

Soldering Method, Semiconductor Module Manufacturing Method, and Soldering Apparatus

Fill head for full-field solder coverage with a rotatable member

Semiconductor structure with solder bumps

Bonding member bonding method and method for manufacturing image display apparatus

BODY HAVING A JUNCTION AND METHOD OF MANUFACTURING THE SAME

Conductive ball mounting method and surplus ball removing apparatus

Wave soldering apparatus

Plasma cutter having microprocessor control

Dispensing solder for mounting semiconductor chips

MULTILAYER WIRING BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE

Soldering tip, soldering iron, and soldering system

Manufacturing method for electronic devices

Soldering Method and Semiconductor Module Manufacturing Method

In-line package apparatuses and methods

High tin solder etching solution

Solder ball mounting device

Through-Via Laser Reflow Systems And Methods For Surface Mount Components

Surface Mount Array Connector Leads Planarization Using Solder Reflow Method

Selective soldering using fiber optic device

Method of forming micro metal bump

METHOD FOR BONDING AN ALUMINUM RIB TO A STEEL PIPE AND HEAT EXCHANGER HAVING A UNIT PRODUCED IN THIS WAY

METHOD FOR FORMING AND RELEASING INTERCONNECTS

Stable gold bump solder connections

SOLDERING METHOD AND APPARATUS FOR MOUNTING DEVICES ON PRINTED CIRCUIT BOARD

Filtered feedthrough assemblies for implantable devices and methods of manufacture

NOVEL CAPACITIVE ELEMENTS AND FILTERED FEEDTHROUGH ELEMENTS FOR IMPLANTABLE MEDICAL DEVICES

Method for forming interconnects

Techniques for forming solder bump interconnects

Selective rework apparatus for surface mount components

ELECTRICAL INTERCONNECT FORMING METHOD

High strength solder joint formation method for wafer level packages and flip applications

Production method of solder circuit board

METHOD FOR MOUNTING ELECTRONIC PARTS

METHOD OF WELDING ELECTRONIC COMPONENTS ON PCBS

Baffle device, hot air blower for solder treatment, and nozzle for same

METHOD FOR SOLDERING TWO COMPONENTS TOGETHER BY USING A SOLDER MATERIAL

Apparatus and method of mounting conductive ball

Solder bump forming method

Method and mask assembly for forming solder bodies on a substrate

Conductive ball mounting method

C4NP compliant solder fill head seals

Substrate joining member and three-dimensional structure using the same

Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method

Method for Soldering Interconnector to Photovoltaic Cell

Heater for select solder machine

METHOD FOR MAKING NANOSTRUCTURED SOLDERED OR BRAZED JOINTS WITH REACTIVE MULTILAYER FOILS

Sputter target and backing plate assembly

Electrical connector with solder retention means for assembly

Method for bonding electronic components finished with electroless NiXP for preventing brittle fracture

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Electronic Component Mounting System, Electronic Component Mounting Device, and Electronic Component Mounting Method

Method of joining electronic package capable of prevention for brittle fracture

Contact carriers (tiles) for populating larger substrates with spring contacts

Apparatus and method for connecting a component with a substrate

Method for manufacturing electric connections in wafer

Soldering structure and method using Zn

Fixing structure for printed circuit board of micro motor

Stacked module connector

Elliptic C4 with optimal orientation for enhanced reliability in electronic packages

Method of manufacturing an electronic component and an electronic device

Probe card assembly and kit

Termination bonding

Bumping electronic components using transfer substrates

SYSTEM AND METHOD FOR SOLDER BONDING

Light emitting device and method of fabricating light emitting device

Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece

PRINTED CIRCUIT BOARD CAPABLE OF VOID CONTROL DURING SURFACE MOUNTING PROCESS

Mounting method for semiconductor parts on circuit substrate

Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same

CIRCUIT CARRIER BOARD/SOLDER PALLETT

Thin wafer detectors with improved radiation damage and crosstalk characteristics

Wire and solder bond forming methods

Wire and solder bond forming methods

Electronic device and method of fabricating the same

PROCESS FOR JOINING MATERIALS USING A METALLIC HEAT SOURCE WITHIN A CONTROLLED ATMOSPHERE

Solder ball mounting method and solder ball mounting apparatus

Solder printing process to reduce void formation in a microvia

Bipolar Battery Electrode Structure and Sealed Bipolar Battery Assembly

Flux composition for solder, solder paste, and method of soldering

Lead-free solder alloy

Resonator, ultrasonic head, and ultrasonic bonder using the same

Resonator, ultrasonic head, and ultrasonic bonder using the same

Interface materials and methods of production and use thereof

Surface mount attachment of components

Reliability enhancement process

Method for producing an electronic device

Diffusion soldered semiconductor device

METHODS FOR PLACING SUBSTRATES IN CONTACT WITH MOLTEN SOLDER

Method of Joining Using Reactive Multilayer Foils With Enhanced Control of Molten Joining Materials

Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component

INTEGRATED CIRCUIT CHIP FORMED ON SUBSTRATE

Assembly and method of assembling by soldering an object and a support

REFLOW FURNACE

Method of soldering component to substrate and electronic device made by the same

Selective rework process and apparatus for surface mount components

Universal mold for injection molding of solder

Process for fabricating a semiconductor package

Method and arrangement for forming a microelectronic package

Microelectronic package and method of forming same

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip

Method for diffusion soldering

WAVE SOLDER APPARATUS

Electronic component and substrate unit

Solder composition and method of bump formation therewith

Heater, reflow apparatus, and solder bump forming method and apparatus

Connection verification technique

HEAT FIXTURE FOR WIRE BONDING

Process for attaching components with near-zero standoff to printed circuit boards

ELECTRICAL CIRCUIT APPARATUS

Novel connecting piece of electrically conducting material preferably a cable terminal and a mehtod of producing the same

Bonding a non-metal body to a metal surface using inductive heating

Solder paste

Method of making a circuitized substrate having a plurality of solder connection sites thereon

SELECTIVE SOLDER DEPOSITION BY SELF-ASSEMBLY OF NANO-SIZED SOLDER PARTICLES, AND METHODS OF ASSEMBLING SOLDERED PACKAGES

Contact carriers (tiles) for populating larger substrates with spring contacts

Method for fine tuning circuit and controlling impedance with laser process

Soldering device and method for forming electrical solder connections in a disk drive unit

Method of controlling solder deposition on heat spreader used for semiconductor package

Solder and method for applying same

Microfeature workpieces having alloyed conductive structures, and associated methods

ELECTRIC FIELD ASSISTED SOLDER BONDING

Bulk metallic glass solder material

Electrical circuit apparatus and method for assembling same

STANDOFF STRUCTURES FOR SURFACE MOUNT COMPONENTS

Contact Structures Comprising A Core Structure And An Overcoat

Method of soldering or brazing articles having surfaces that are difficult to bond

Probe card assembly and kit

Heating apparatus

Supply plate for an electrochemical system

Soldering method & its applied circuit board

Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles

Forming solder balls on substrates

Heating element movement bonding method for semiconductor components

Structure and method for connecting flexible printed circuit board to inkjet print head

Method and resistive bridge circuit for the detection of solder-joint failures in a digital electronic package

Wave solder nozzle

Cream solder printing metal mask with positioning function and its positioning method

Metal containers for solder paste

Method for reducing stress between substrates of differing materials

Apparatus and method for filling a ball grid array template

Dynamic resource allocation platform and method for time related resources

Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation

Components with solder masks

Enhanced reliability semiconductor package

Low thermal resistance junction processing

Systems and methods for solder bonding

Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same

Micro-C-4 semiconductor die and method for depositing connection sites thereon

Pb-free solder-connected structure and electronic device

Resonator, ultrasonic head, and ultrasonic bonder using the same

Printed circuit board clamp

Printed circuit board having improved solder pad layout

Method of flip-chip bonding

Solder printing process to reduce void formation in a microvia

Apparatus and method for aligning solder pads during head gimbal assembly soldering

Bonding apparatus using conductive material

Apparatus and method for attaching a semiconductor die to a heat spreader

Methods for placing substrates in contact with molten solder

Heatslug to leadframe attachment

Method for removing a magnetic head slider

Apparatus and method for printing micro metal structures

Apparatus and method for printing micro metal structures

Brazing method for achieving a mechanical and electrical connection between two pieces

Solder paste and process

Method for manufacturing printed circuit board and printed circuit board with gas venting hole

Ball grid array solder joint reliability

Solder extraction tool and method

Semiconductor die attachment for high vacuum tubes

Lead-free solder ball

Surface mount attachment of components

Flip chip bonding tool and ball placement capillary

Chip bonding heater with differential heat transfer

Mounting substrate and mounting method of electronic part

Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip

Method of brazing and article made therefrom

PCB manufacturing system

Sn-ag based lead-free solder

Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same

Submount and semiconductor device

Brazing filler metal, assembly method for semiconductor device using same, and semiconductor device

Systems and methods for detecting defects in printed solder paste

Jetting device and method at a jetting device

Method of soldering electrical connection

Bumping electronic components using transfer substrates

Method and system for applying solder

Nanotube modified solder thermal intermediate structure, systems, and methods

Method and apparatus for thermally coupling a heat dissipation device to a microelectronic device

Method of controlling thermal waves in reactive multilayer joining and resulting product

Thermal interface material bonding

Method and apparatus for conductive ball bonding of components

Folded fin heat sink assembly

[METHOD OF FORMING BOND MICROSTRUCTURE]

Solder joint structure and method for soldering electronic components

Replacement cover for electromagnetic shielding system

Via heat sink material

Chip bonding heater with differential heat transfer

Apparatus and method for mounting electronic components

Bonding device for manufacturing liquid crystal display device

Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece

Method of joining using reactive multilayer foils with enhanced control of molten joining materials

Jet nozzle structure for soldering apparatus

Method for connecting connection members to board

Method for centering a sputter target onto a backing plate and the assembly thereof

Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic components

Nanostructured soldered or brazed joints made with reactive multilayer foils

Solder ball bonding method and bonding device

Diffusion solder position, and process for producing it

Thermoelectric modules and methods of manufacture

Probe card assembly

Multi-functional solder and articles made therewith, such as microelectronic components

Multi-functional solder and articles made therewith, such as microelectronic components

Multi-functional solder and articles made therewith, such as microelectronic components

Contact structures and methods for making same

Method of controlling solder deposition utilizing two fluxes and preform

Method of mounting electronic part and flux-fill

Compliant locating structure for a bond head assembly

Decorative light bulb and its production process

Method of using processing oven

Electronic assemblies having components with edge connectors

System and method for bonding a cable to a substrate using a die bonder

Squeegee blade holder with secondary blade mounting apparatus

Heat-shielding microcapsules for protecting temperature sensitive components

Methods of soldering and applications thereof

Zinc-cobalt barrier for interface in solder bond applications

Disposable, miniature internal optical ignition source

Cold gas blast jet for micro-electronic solder repair

Systems and methods for reconfigurable micro-optic assemblies

Injection molded solder bumping

Liquid metal flip chip devices

Disposable, miniature internal optical ignition source for ammunition application

Multi-strike process for bonding

Wire bonding method and chip structure

Method of forming an electrical connection to an electronic module

Thermal carrier

Laser-ignited reactive HAMR bonding

Head gimbal assembly carrier with adjustable protective bar

Pastes for thermal, electrical and mechanical bonding

Hot-press method

Hard disk drive sealed in helium using a secondary container

Hot bar soldering

Vacuum reflow voiding rework system

Vacuum reflow voiding rework system