ClassID:

42803

B23K3/06 - CPC Classification

Classification description:

Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods Solder feeding devices; Solder melting pans

Sub-classes:
Recent Application in this class:
#1
20240058908
2024-02-22

ASSEMBLY DEVICE OF SEAL

#2
20230415254
2023-12-28

Welding devices and welding, installation and debugging methods thereof

#3
20230017361
2023-01-19

SOLDER CUTTING DEVICE, SOLDER CUTTING UNIT, PART MOUNTING DEVICE, AND PRODUCTION SYSTEM

#4
20210144863
2021-05-13

Method for discharging fluid

#5
20210060678
2021-03-04

NOZZLE, SYSTEM AND METHOD

#6
20190389013
2019-12-26

Device for manufacturing plate solder and method for manufacturing plate solder

#7
20190091785
2019-03-28

Viscous fluid supply device

#8
20190054491
2019-02-21

Metering apparatus

#9
20180376600
2018-12-27

Fluid discharge device

#10
20180368660
2018-12-27

Method for connecting at least two components of an endoscope, component of an endoscope and endoscope

#11
20180350767
2018-12-06

BALL GRID ARRAY SOLDER ATTACHMENT

#12
20180301377
2018-10-18

METHOD FOR FILLING A WAFER VIA WITH SOLDER

#13
20180200817
2018-07-19

METHOD OF BRAZING AND BRAZED ARTICLE

#14
20180065201
2018-03-08

Solder processing device

#15
20180021803
2018-01-25

Fluid discharge device, fluid discharge method, and fluid application device

#16
20180015572
2018-01-18

Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint

#17
20170320155
2017-11-09

Method for forming solder deposits

#18
20170311453
2017-10-26

Soldering device

#19
20170197269
2017-07-13

Metal joined body and manufacturing method for metal joined body

#20
20170179069
2017-06-22

BALL GRID ARRAY SOLDER ATTACHMENT

#21
20170148678
2017-05-25

Method for filling a wafer via with solder

#22
20170066072
2017-03-09

Viscous fluid coating device

#23
20160338209
2016-11-17

Solder supply device including a nozzle with a piston and a demarcating member that demarcates an air chamber in which air is supplied to move the piston relative to a solder container

#24
20160297021
2016-10-13

Solder supply device including a solder cup and a nozzle section with a flange section that is elastically deformable

#25
20160287052
2016-10-06

Method for connecting at least two components of an endoscope, components of an endoscope and endoscope

#26
20160159073
2016-06-09

Slit-type scraper device

#27
20160107253
2016-04-21

REEL-TO-REEL MANUFACTURING PLANT FOR INTERLINKED CONTINUOUS AND DISCONTINUOUS PROCESSING STEPS

#28
20150334849
2015-11-19

Method of manufacturing semiconductor device, substrate processing apparatus and recording medium

#29
20150258773
2015-09-17

Paste supply apparatus and screen printing machine

#30
20140103098
2014-04-17

MASK FOR BUMPING SOLDER BALLS ON CIRCUIT BOARD AND SOLDER BALL BUMPING METHOD USING THE SAME

#31
20130277416
2013-10-24

REMOTE MELT JOINING METHODS AND REMOTE MELT JOINING SYSTEMS

#32
20130087539
2013-04-11

Method and Device for Forming Solder Deposits

#33
20120292377
2012-11-22

Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit board

#34
20110139495
2011-06-16

Circuit board including mask for controlling flow of solder

#35
20110067371
2011-03-24

Honeycomb body, method for producing a brazed honeycomb body and exhaust gas treatment component

#36
20100273022
2010-10-28

Dual additive soldering

#37
20090056977
2009-03-05

Production method of solder circuit board

#38
20080277456
2008-11-13

System and a method for controlling flow of solder

#39
20080029888
2008-02-07

Solder Interconnect Joints For A Semiconductor Package

#40
20080008898
2008-01-10

System, method, and apparatus for three-dimensional woven metal preform structural joint

#41
20070295785
2007-12-27

MICROWAVE BRAZING USING MIM PREFORMS

#42
20070284410
2007-12-13

MIM braze preforms

#43
20070068994
2007-03-29

Soldering apparatus

#44
20060243851
2006-11-02

Wire material payout device and wire solder

#45
20060054668
2006-03-16

Dual additive soldering

#46
20050082686
2005-04-21

Circuitized substrate for fixing solder beads on pads

#47
20050000421
2005-01-06

Device for wetting cable-ends

#48
14468180
2015-08-18

Disposable apparatus for aligning and dispensing solder columns in an array