SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERING MACHINE

SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERING MACHINE

SOLDER SUPPLY UNIT, SOLDER PIECE MANUFACTURING DEVICE, PART MOUNTING DEVICE, AND PRODUCTION SYSTEM

BRAZING SYSTEM AND BRAZING METHOD

BRAZING METHOD AND METAL FILM FORMING TOOL FOR BRAZING

Solder supply unit, solder piece manufacturing device, part mounting device, and production system

Logic switching device and method of manufacturing the same

Stencil device and method for stencil printing of brazing material onto a heat exchanger plate and use thereof

Soldering systems having a nozzle exchange unit including a nitrogen inlet and hood

Systems and methods for bonding a downhole tool to a borehole tubular

Apparatus for attaching semiconductor parts

LIQUID AGENT SUPPLY DEVICE AND LIQUID AGENT SUPPLY METHOD

Ultrasonic-assisted solder transfer

Screen printing machine

SOLDERING ASSEMBLY, METHOD AND USE

Microwave heating method, microwave heating apparatus, and chemical reaction method

Soldering device for soldering with laser beam and robot apparatus provided with soldering device

Continuous solder transfer to substrates

METHOD FOR JOINING DIFFERENT TYPE OF METALS AND LASER WELDING DEVICE

Robot apparatus for soldering

Logic switching device and method of manufacturing the same

Attaching an SMD to an insulating layer with a solder joint in a cavity formed in an insulating layer

APPARATUS AND METHOD FOR AUTOMATED SOLDERING PROCESS

Logic switching device and method of manufacturing the same

Welding system

Cold-spray braze material deposition

Braze for ceramic and ceramic matrix composite components

Soldering apparatus, computer-readable medium, and soldering method

Soldering apparatus

METHODS AND APPARATUSES FOR DISPENSING SOLDER

SOLDERING METHOD, SOLDERING APPARATUS, AND METHOD FOR MAINTAINING SOLDER WETTING OF JET NOZZLE

Metal cored solder decal structure and process

Solder fill into high aspect through holes

Method for forming solder deposits

Solder fill into high aspect through holes

Sintering materials and attachment methods using same

Modular soldering unit

Braze for ceramic and ceramic matrix composite components

Solder supply device including a solder cup and a nozzle section with a flange section that is elastically deformable

Device for soldering electrical or electronic components

Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method

MOLTEN METAL DISCHARGING DEVICE AND METHOD FOR DISCHARGING MOLTEN METAL

Metal cored solder decal structure and process

BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATMENT METHOD, AND SYSTEM THEREFOR

Method and soldering device for selective soldering with at least one solder nozzle and another functional element which are moved synchronously by a movement device

Method and apparatus for improving selective soldering

Electronic component mounting system and electronic component mounting method

Materials and Process Using a Three Dimensional Printer to Fabricate Sintered Powder Metal Components

Die attachment apparatus and method utilizing activated forming gas

Solder ball mounter

Device for assembling a chip on a substrate by providing a solder-forming mass

Fill head interface with combination vacuum pressure chamber

High-speed transportation mechanism for micro solder balls

Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method

SUBSTRATE PROCESSING DEVICE AND METHOD OF MANUFACTURING THE SAME

Metal cored solder decal structure and process

Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method

Manufacturing method of solder transfer substrate, solder precoating method, and solder transfer substrate

Systems and methods for high aspect ratio flip-chip interconnects

SOLDER POT

Soldering entities to a monolithic metallic sheet

SQUEEGEE MODULE

Device for removing adhered substances

Device for ejecting droplets of a fluid having a high temperature

Method and apparatus for applying solder to a work piece

Jetting device and method at a jetting device

Method for assembling a chip on a substrate

TIN ALLOY SOLDER COMPOSITION

CIRCUIT BOARD CARRIER/SOLDER PALLET

Method of manufacturing a substrate, substrate, device provided with a substrate, and determining method

Method of forming micro metal bump

METHOD FOR ATTACHMENT OF SOLDER POWDER TO ELECTRONIC CIRCUIT BOARD AND SOLDERED ELECTRONIC CIRCUIT BOARD

C4NP compliant solder fill head seals

Conductive bonding material fill techniques

Hard-Soldering Method and Device

Compliant mold fill head with integrated cavity venting and solder cooling

Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece

METHOD OF APPLYING BRAZE FILLER METAL POWDERS TO SUBSTRATES FOR SURFACE CLEANING AND PROTECTION

Method for the production of a soldered joint

CIRCUIT CARRIER BOARD/SOLDER PALLETT

Method and device for applying a solder to a substrate

Conductive bonding material fill techniques

Cold gas-dynamic spraying method for joining ceramic and metallic articles

HIGH VELOCITY METALLIC POWDER SPRAY FASTENING

System and method for advanced solder bumping using a disposable mask

Method and apparatus for applying viscous medium onto a substrate

Brazed joining with electrical deposition

Method for connecting a hollow profile to a two-dimensionally contacting component

Feed devices and methods for injection molded solder systems

PCB solder masking process

Circuit board carrier/solder pallet

Method of jetting viscous medium

Method of manufacturing an electronic component and apparatus for carrying out the method

Micro-C-4 semiconductor die and method for depositing connection sites thereon

Reinforced solder bump structure and method for forming a reinforced solder bump

Method of retaining a solder mass on an article

Apparatus and method for printing micro metal structures

Apparatus and method for printing micro metal structures

Jetting device and method at a jetting device

Feed devices and methods for injection molded solder systems

Method of applying a pattern of particles to a substrate

Rapid surface cooling of solder droplets by flash evaporation

Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece

Process of manufacturing a solder-fill for applying to semiconductor package

Solder-fill application for mounting semiconductor chip on PCB

Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device

Circuit board transferring apparatus and method and solder ball mounting method

Method and device for applying material to a workpiece

Method of mounting electronic part and flux-fill

Dispensing system and method

Cold gas blast jet for micro-electronic solder repair