B23K3/0646 - CPC Classification Index

ClassID:

42809 ⎘

B23K3/0646 - CPC Classification

Classification description:

Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods; Solder feeding devices; Solder melting pans Solder baths

Sub-classes:

B23K3/0653 » {with wave generating means, e.g. nozzles, jets, fountains} 115
B23K3/0661 » {Oscillating baths} 3
B23K3/0669 » {with dipping means} 16
B23K3/0692 » {with intermediary means for bringing solder on workpiece, e.g. rollers} 9

Recent Application in this class:

20220016724

2022-01-20

Soldering systems having a nozzle exchange unit including a nitrogen inlet and hood

20180185946

2018-07-05

Estimation device

20170148678

2017-05-25

Method for filling a wafer via with solder

20170072492

2017-03-16

Jet nozzle and jet soldering apparatus

20150298233

2015-10-22

Method and soldering device for selective soldering with at least one solder nozzle and another functional element which are moved synchronously by a movement device