ClassID:

43423

B23K35/3613 - page 2 - CPC Classification

Classification description:

Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material; Selection of non-metallic compositions, e.g. coatings, fluxes ; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents Polymers, e.g. resins

Recent Application in this class:
#301
20080048009
2008-02-28

Paste for soldering and soldering method using the same

#302
20080044670
2008-02-21

Interface materials and methods of production and use thereof

#303
20080029582
2008-02-07

Positive hold tube weld stud assembly

#304
20080023108
2008-01-31

METHOD OF FLUXING USING A FLUXING COMPOSITION CONTAINING COMPOUNDS WITH AN AROMATIC RING AND NO IMINO GROUP

#305
20070284722
2007-12-13

Semiconductor device package utilizing proud interconnect material

#306
20070277909
2007-12-06

Solder Paste and Electronic Device Using Same

#307
20070251602
2007-11-01

Brazing material with continuous length layer of elastomer containing a flux

#308
20070245852
2007-10-25

Solder paste and electronic device

#309
20070221712
2007-09-27

Thermosetting flux and solder paste

#310
20070216023
2007-09-20

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

#311
20070193994
2007-08-23

Cellulose coated stick electrode

#312
20070187462
2007-08-16

METHOD OF MANUFACTURING A BRAZED ASSEMBLY

#313
20070186997
2007-08-16

Flux for soldering, soldering method, and printed circuit board

#314
20070158386
2007-07-12

Method for brazing strips of aluminium alloy

#315
20070107214
2007-05-17

Soldering method

#316
20070099023
2007-05-03

Aluminium alloy strip for brazing

#317
20070093586
2007-04-26

Wide-gap filler material

#318
20070090160
2007-04-26

Electronic Part Manufacturing Method

#319
20070069000
2007-03-29

Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby

#320
20070056464
2007-03-15

Solution and process for improving the solderability of a metal surface

#321
20060289607
2006-12-28

Composite solder transfer moldplate structure and method of making same

#322
20060272747
2006-12-07

Fluxing compositions

#323
20060247350
2006-11-02

Wide-gap filler material

#324
20060231162
2006-10-19

Fluxing agent

#325
20060180245
2006-08-17

Lead-free solder paste

#326
20060151580
2006-07-13

Coating compositions for solder spheres, powders and preforms, methods of production and uses thereof

#327
20060128834
2006-06-15

Microelectronic devices having underfill materials with improved fluxing agents

#328
20060113355
2006-06-01

Method of forming a flux layer on an aluminum plate member

#329
20060102691
2006-05-18

Aqueous aluminum brazing composition, aluminum material coated with the brazing composition, brazing method using the aluminum material, and automotive heat exchanger manufactured by using the brazing method

#330
20060073344
2006-04-06

Underfill of resin and sulfonic acid-releasing thermally cleavable compound

#331
20060043597
2006-03-02

Solder composition, connecting process with soldering, and connection structure with soldering

#332
20060043543
2006-03-02

Solder composition, connecting process with soldering, and connection structure with soldering

#333
20060043157
2006-03-02

Flux for soldering, soldering method, and printed circuit board

#334
20050218517
2005-10-06

Semiconductor flip-chip package and method for the fabrication thereof

#335
20050218195
2005-10-06

Underfill fluxing curative

#336
20050121784
2005-06-09

Semiconductor device package utilizing proud interconnect material

#337
20050121500
2005-06-09

Method for producing a soldered joint between a substrate and a contact element of a fuel cell unit

#338
20050116208
2005-06-02

Paste composition for brazing and brazing method using the same

#339
20050067468
2005-03-31

Fluxes for flip chip assembly using water soluble polymers

#340
20050067189
2005-03-31

Soldering method and solder joint member

#341
20050056687
2005-03-17

Thermosetting flux and solder paste

#342
20050039824
2005-02-24

Solder composition

#343
20050029667
2005-02-10

Multi-functional solder and articles made therewith, such as microelectronic components

#344
20050029334
2005-02-10

Multi-functional solder and articles made therewith, such as microelectronic components

#345
20050028887
2005-02-10

Multi-functional solder and articles made therewith, such as microelectronic components