43423 ⎘
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material; Selection of non-metallic compositions, e.g. coatings, fluxes ; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents Polymers, e.g. resins
JOINING MATERIAL AND METHOD OF PRODUCING JOINED BODY
#2(METH)ACRYLATE-BASED RESIN, AND DRY FILM SOLDER RESIST COMPRISING SAME
#3FLUX AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
#4FLUX AND SOLDER PASTE
#5COPPER PARTICLE AND METHOD FOR PRODUCING SAME, PASTE COMPOSITION, SEMICONDUCTOR DEVICE, ELECTRICAL COMPONENT, AND ELECTRONIC COMPONENT
#6FLUX, SOLDER PASTE, AND METHOD FOR PRODUCING BONDED BODY
#7METHOD OF MANUFACTURING A SOLAR MODULE
#8Flux and solder paste comprising said flux
#9FLUX AND SOLDER PASTE COMPRISING SAID FLUX
#10SOLDER ALLOY, JOINED PART, JOINING MATERIAL, SOLDER PASTE, JOINED STRUCTURE, AND ELECTRONIC CONTROL DEVICE
#11LOW PRESSURE SINTERING POWDER
#12WATER-SOLUBLE FLUX AND SOLDER PASTE
#13FLUX, SUBSTRATE AND MANUFACTURING METHOD, AND DEVICE
#14FLUX AND SOLDER PASTE
#15COMPOSITE CONDUCTIVE PARTICLE AND METHOD FOR MANUFACTURING COMPOSITE CONDUCTIVE PARTICLE
#16Flux and solder paste
#17NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRODUCING CONNECTED STRUCTURE
#18Method and system for joining workpieces
#19BONDING SHEET
#20NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRODUCING CONNECTED STRUCTURE
#21TRANSIENT LIQUID PHASE BONDING OF SURFACE COATINGS AND METAL-COVERED MATERIALS
#22ADDITIVELY MANUFACTURED JOINED PARTS
#23Flux for resin-cored solder, resin-cored solder, and soldering method
#24SINTERING PASTE AND USE THEREOF FOR CONNECTING COMPONENTS
#25Stretchable interconnects for flexible electronic surfaces
#26Solder Material and Solder Material Production Method
#27Flux
#28SOLDER PASTE AND BONDED STRUCTURE
#29MICRONIZED FLUX FOR JET VALVE DISPENSER
#30Flux and solder paste
#31Flux and solder paste
#32Sinterable films and pastes and methods for use thereof
#33BOTTOM OHMIC SILVER PASTE FOR STRONTIUM TITANATE RING VARISTOR, PREPARATION METHOD AND USE THEREOF
#34MANUFACTURING INSULATED SPHERICAL WELD GOLD WIRE FOR INTEGRATED CIRCUIT DOUBLE-LAYER STACKED PACKAGE
#35COPPER SINTERING PASTE COMPOSITION AND METHOD OF PREPARING SAME
#36FLUX AND SOLDER PASTE
#37PASTE COMPOSITION AND SEMICONDUCTOR DEVICE
#38Flux resin composition, electronic component, method for manufacturing the electronic component, mounting structure, and method for manufacturing the mounting structure
#39LIGHT-ABSORBING EPOXY FILM AND MANUFACTURING METHOD THEREOF
#40Flux and solder paste
#41SOLDER COMPOSITION AND METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD
#42Flux and solder paste
#43FLUX AND SOLDER PASTE
#44METAL COMPOSITION, BONDING MATERIAL
#45Flux and solder paste
#46Flux, flux-cored solder using flux, flux-coated solder using flux and soldering method
#47Method for using soluble sacrificial materials in ultrasonic additive manufacturing
#48BONDING AND SEALING MATERIAL, AND LID FOR OPTICAL DEVICE PACKAGE
#49Solder composition and electronic substrate
#50Solder paste
#51HEAT-RESISTANT RELEASE SHEET AND THERMOCOMPRESSION BONDING METHOD
#52Wire for electric bonding
#53Flux and solder paste
#54Resin flux solder paste and mount structure
#55Stretchable interconnects for flexible electronic surfaces
#56Flux and solder paste
#57TRANSFER AND BONDING METHOD USING LASER
#58Low pressure sintering powder
#59Flux composition, solder paste, solder joint and solder joining method
#60Flux for solder paste and solder paste
#61MULTILAYERED METAL NANO AND MICRON PARTICLES
#62Brazing material, brazing member, heat exchanger, and producing method of brazing member
#63Transient liquid phase bonding of surface coatings and metal-covered materials
#64Method for manufacturing electronic device
#65Solder paste and mounting structure
#66Flux and solder paste
#67Resin composition and soldering flux
#68Resin composition for soldering, resin flux cored solder, flux coated solder, and liquid flux
#69Flux, and solder paste
#70SOLUBLE SACRIFICIAL MATERIALS FOR USE IN ULTRASONIC ADDITIVE MANUFACTURING
#71Stretchable interconnects for flexible electronic surfaces
#72Systems and methods for welding zinc-coated workpieces
#73Package on package structure and method for forming the same
#74SOLDER PASTE CONTAINING LEAD FREE SOLDER COMPOSITION WITH HIGH DUCTILITY AND SOLDERING FLUX
#75Flux and Solder Paste
#76Mixed composition coating material for brazing
#77Flux and solder paste
#78Flux for resin flux cored solder, flux for flux coated solder, resin flux cored solder, and flux coated solder
#79Ruggedized solder mask material
#80Method of forming a leadless stack comprising multiple components
#81Solder composition
#82Electronic component structures with reduced microphonic noise
#83Braze for ceramic and ceramic matrix composite components
#84Solder alloy and resin flux cored solder
#85Ruggedized solder mask material
#86Engineered Polymer-Based Electronic Materials
#87Conductive paste and die bonding method
#88Package on package structure and method for forming the same
#89Flux
#90BONDING MATERIAL
#91Solder composition, electronic board, and bonding method
#92Joint manufacturing method
#93Thermal bonding sheet, thermal bonding sheet with dicing tape, bonded body production method, and power semiconductor device
#94Solder alloy for preventing Fe erosion, resin flux cored solder, wire solder, resin flux cored wire solder, flux coated solder, solder joint and soldering method
#95Sintering pastes with high metal loading for semiconductor die attach applications
#96Flux composition for solder applications
#97FLUX AND SOLDER PASTE
#98Method for producing soldered product
#99Particles, connecting material and connection structure
#100Conductive nodes
#101Particles, connecting material and connection structure
#102Particles, connecting material and connection structure
#103Flux with dibasic acid mixture
#104Joining material and joined body using same
#105Paste thermosetting resin composition, semiconductor component, semiconductor mounted article, method for manufacturing semiconductor component, and method for manufacturing semiconductor mounted article
#106CORED SOLDER WIRE WITH ROSIN FLUX AND THERMOSET MATERIAL
#107PROCESS FOR THE MANUFACTURE OF FLUX COMPOSITIONS
#108Leadless multi-layered ceramic capacitor stack
#109High performance organic, inorganic or hybrid seals
#110Carbon-coated metal-powder, conductive paste containing carbon-coated metal powder and multilayer electronic component using same, and method for manufacturing carbon-coated metal powder
#111Welding electrode wires having alkaline earth metals
#112Conductive polymer composite as plastic solder
#113Braze gel, brazing process, and brazing article
#114Engineered polymer-based electronic materials
#115Sinterable films and pastes and methods for use thereof
#116Flux composition containing carbon component, solder paste containing the same, and soldering method
#117LPS solder paste based low cost fine pitch pop interconnect solutions
#118Compression-bonded magnet with case and method for producing the same
#119Carbon-coated metal powder, conductive paste containing carbon-coated metal powder and multilayer electronic component using same, and method for manufacturing carbon-coated metal powder
#120Leadless stack comprising multiple components
#121Flux for Rapid Heating Method and Solder Paste for Rapid Heating Method
#122Process for making a boric acid free flux
#123Boric acid free flux
#124Package on package structure and method for forming the same
#125Water soluble flux with modified viscosity
#126Solder composition and electronic board
#127FLUX FOR SOLDERING, AND SOLDERING PASTE COMPOSITION INCLUDING SAME
#128Organic acid-or latent organic acid-functionalized polymer-coated metal powders for solder pastes
#129Controllably-Formed Brazing Structures And Related Compositions And Methods
#130Stretchable interconnects for flexible electronic surfaces
#131SUPERALLOY COMPOSITE PREFORMS AND APPLICATIONS THEREOF
#132Flux and solder paste
#133Flux-Coated Ball and Method of Manufacturing the Same
#134METAL COMPOSITION, BONDING MATERIAL
#135Method of printing solder paste
#136FLUX AND SOLDER PASTE
#137Engineered Residue Solder Paste Technology
#138Thermoelectric Conversion Element and Thermoelectric Conversion Module
#139FLUX
#140SOLDER PASTE AND SOLDERING FLUX, AND MOUNTED STRUCTURE USING SAME
#141Multilayered metal nano and micron particles
#142Flux formulations
#143Coated solder material and method for producing same
#144Printed circuit board with flux reservoir
#145Bonding material and bonding method using same
#146SUBSTRATE ON SUBSTRATE PACKAGE
#147Paste and process for forming a solderable polyimide-based polymer thick film conductor
#148Thermally decomposable polymer compositions for forming microelectronic assemblies
#149Low pressure sintering powder
#150Thermite welding
#151Electronic component structures with reduced microphonic noise
#152Lead-free solder alloy
#153FLUX AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#154Additive manufacturing of metal matrix composite feedstock
#155FLUX FOR SOLDERING AND SOLDER COMPOSITION
#156Braze for ceramic and ceramic matrix composite components
#157Connection structure of circuit member, connection method, and connection material
#158Compression-bonded magnet with case and method for producing the same
#159SUPERALLOY COMPOSITE PREFORMS AND APPLICATIONS THEREOF
#160Process For Flux Coating Braze Preforms And Discrete Parts
#161Method for joining structural material, joining sheet, and joint structure
#162Solder alloy, solder paste, and electronic circuit board
#163Solder alloy, solder composition, solder paste, and electronic circuit board
#164Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bond
#165HIGH-CONCENTRATION FLUX FOR BEING SPRAYED ON PREFORM
#166SOLDER TRANSFER SHEET
#167FLUX AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
#168Cleaning flux, cleaning solder paste, and solder joint
#169Flux for resin flux cored solder, flux for flux coated solder, resin flux cored solder and flux coated solder
#170Flux, solder paste and solder joint
#171Joining to aluminum
#172Transient liquid phase bonding of surface coatings metal-covered materials
#173HYBRID BRAZE TAPES AND HYBRID BRAZE TAPE METHODS
#174Package on package structure and method for forming the same
#175Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
#176SINTER PASTE WITH PARTIALLY OXIDIZED METAL PARTICLES
#177Leadless multi-layered ceramic capacitor stacks
#178SOLDER PASTE AND ELECTRONIC PART
#179Aqueous aluminum brazing composition
#180Grooved resin molded part
#181Light emitting device and method of producing the light emitting device
#182Flux and solder paste
#183Thermally decomposable polymer compositions incorporating thermally activated base generators
#184Thermally decomposable polymer compositions for forming microelectronic assemblies
#185Flux composition
#186METHODS AND COMPOSITIONS FOR FORMING SOLDER BUMPS ON A SUBSTRATE WITH RADIATION CURABLE OR THERMAL CURABLE SOLDER FLUX
#187Solderable conductive polymer thick film composition
#188Photocurable compositions
#189Brazing composition, heat exchanger tube, and heat exchanger
#190Solder paste, joining method using the same and joined structure
#191VOC Exempt Brazing Binder System
#192Conductive paste and die bonding method
#193Controllably-formed brazing structures and related compositions and methods
#194Flux, solder composition, and method for manufacturing electronic circuit mounted substrate
#195Braze alloy layered product
#196Soldering flux and solder paste composition
#197Brazing concept
#198BASE RESIN FOR SOLDERING FLUX, SOLDERING FLUX AND SOLDER PASTE
#199Plate heat exchanger
#200Flux and Solder Paste
#201Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor device
#202Coating concept
#203Method for joining metal parts
#204FLUX FOR RESIN CORED SOLDER AND RESIN CORED SOLDER
#205Plate heat exchanger
#206Brazing concept
#207Resin composition for solder bump formation, solder bump formation method, and member having solder bumps
#208Cream solder composition
#209Composition And Conductor Formed Therefrom
#210Flux composition for brazing
#211Composition and methods of forming solder bump and flip chip using the same
#212Composition and methods of forming solder bump and flip chip using the same
#213Gum rosin protective coating and methods of use
#214Temporary adhesive for component bonding
#215Boric acid free flux
#216Reflow film, solder bump formation method, solder joint formation method, and semiconductor device
#217Electronic device, bonding material, and method for producing electronic device
#218Di- or poly-functional electron deficient olefins coated metal powders for solder paste
#219Electronic component termination and assembly by means of transient liquid phase sintering metalurgical bonds
#220Toughened solder for downhole applications, methods of manufacture thereof and articles comprising the same
#221Multi-solder techniques and configurations for integrated circuit package assembly
#222Paste for joining components of electronic modules, system and method for applying the paste
#223Flux formulations
#224FLUX FOR SOLDERING AND SOLDER PASTE COMPOSITION
#225Photonic sintering of polymer thick film conductor compositions
#226Leadless multi-layered ceramic capacitor stacks
#227FLUX
#228FLUX
#229Rare-earth bond magnet manufacturing method
#230Package on package structures and methods for forming the same
#231Polymer thick film solder alloy/metal conductor compositions
#232Sealable material and method of forming a dielectric weld
#233Composition and methods of forming solder bump and flip chip using the same
#234Lead-free solder paste
#235CONDUCTIVE BONDING MATERIAL, CONDUCTOR BONDING METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
#236Solder paste composition, a solder paste and a soldering flux
#237FLUX COMPOSITION, PROCESS FOR PRODUCING ELECTRICALLY CONNECTED STRUCTURES, ELECTRICALLY CONNECTED STRUCTURE, AND SEMICONDUCTOR DEVICE
#238Bonding material, bonded portion and circuit board
#239Thermally decomposable polymer compositions incorporating thermally activated base generators
#240SOLDER INK AND ELECTRONIC DEVICE PACKAGE USING SAME
#241SOLDER PASTE
#242FLUX FOR SOLDER PASTE, AND SOLDER PASTE
#243WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR
#244WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR
#245ELECTRONIC COMPONENT, ELECTRONIC EQUIPMENT, AND SOLDERING PASTE
#246METHOD TO PRODUCE AN ELECTRODE WITH A LOW LEVEL OF HYDROGEN AND LOW ABSORPTION OF MOISTURE
#247Solder paste, joining method using the same and joined structure
#248SOLDER ADHESIVE AND A PRODUCTION METHOD FOR THE SAME, AND AN ELECTRONIC DEVICE COMPRISING THE SAME
#249WIRING SUBSTRATE MANUFACTURING METHOD
#250Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes
#251Polymer composition for microelectronic assembly
#252Sacrificial polymer compositions including polycarbonates having repeat units derived from stereospecific polycyclic 2,3-diol monomers
#253Aluminium alloy strip for brazing
#254Flux and solder material and method of making same
#255Water immiscible rosin mildly activated flux
#256Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes
#257Components joining method and components joining structure
#258WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR
#259Thermally decomposable polymer coated metal powders
#260FILLING COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE
#261Method of manufacturing electronic device and electronic device
#262Flux composition and soldering paste composition
#263Flux and solder material and method of making same
#264Method and solder for form-fitted joining of two surfaces
#265Brazing Material Containing A Flux
#266Solution and process for improving the solderability of a metal surface
#267Solder bonding structure and soldering flux
#268Sealable material and method of forming a dielectric weld
#269SOLDERING FLUX AND SOLDER PASTE COMPOSITION
#270SOLDERING FLUX, SOLDER PASTE COMPOSITION AND SOLDERING METHOD
#271Water immiscible rosin mildly activated flux
#272Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
#273WEAR PROTECTION SHEETS, PROCESSES FOR PRODUCING THE SAME, AND USES THEREOF
#274Microwave brazing process and assemblies and materials therefor
#275Bonding material, bonded portion and circuit board
#276Solder flux
#277FLUX FORMULATIONS
#278Electronic Part Manufacturing Method
#279Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby
#280Coating method using plasma shock wave and method for manufacturing coated substance
#281Lead-free solder paste and its use
#282Composition and methods of forming solder bump and flip chip using the same
#283Lead-free solder composition including microcapsules
#284Flux for lead-free solder and soldering method
#285Joint structure, joining method, wiring board and method for producing the same
#286Flux for soldering and method for manufacturing an electronic device using the same
#287Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same
#288Paste composition for aluminum brazing
#289Composition and method for controlling galvanic corrosion in printed circuit boards
#290Brazing material containing a flux
#291Components joining method and components joining structure
#292Welding wire and welding method
#293Water-soluble preflux and usage of the same
#294Flux for soldering and soldering process
#295Solder preform and a process for its manufacture
#296SOLDER FLUX COMPOSITION AND PROCESS OF USING SAME
#297Three-dimensional wafer stacking with vertical interconnects
#298Flux for Lead-Free Solder and Solder Paste
#299Soldering flux, solder paste, and flux cored solder
#300Soldering flux and solder paste composition