44775 ⎘
Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
PROCESSING METHOD OF CHUCK TABLE, MANUFACTURING METHOD OF PROCESSED CHUCK TABLE, PROCESSING METHOD OF WORKPIECE, MANUFACTURING METHOD OF PROCESSED WAFER, AND PROCESSING APPARATUS
#2CHEMICAL MECHANICAL POLISHING USING FLEXURE MOUNTED PAD
#3A GRINDING AND/OR POLISHING MACHINE AND A SPECIMEN HOLDER
#4CHEMICAL-MECHANICAL POLISHING SYSTEM WITH A POTENTIOSTAT AND PULSED-FORCE APPLIED TO A WORKPIECE
#5PROCESSING APPARATUS
#6ELECTRICAL CONNECTION FOR CHEMICAL MECHANICAL POLISHING CARRIER HEAD
#7FABRICATION OF A POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING
#8SUBSTRATE TREATING APPARATUS
#9CHEMICAL MECHANICAL POLISHING EDGE CONTROL WITH PAD RECESSES
#10TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING
#11MACHINE FOR FINISHING A WORK PIECE, AND HAVING A HIGHLY CONTROLLABLE TREATMENT TOOL
#12CHEMICAL MECHANICAL POLISHING APPARATUS AND A METHOD OF POLISHING A SUBSTRATE USING THE SAME
#13METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT STRUCTURE
#14CHEMICAL-MECHANICAL POLISHING SYSTEM WITH A POTENTIOSTAT AND PULSED-FORCE APPLIED TO A WORKPIECE
#15CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS AND METHOD OF CONTROLLING THEREOF
#16CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
#17Substrate processing apparatus and substrate processing method
#18POLISHING HEAD, POLISHING APPARATUS, AND ELASTIC BODY
#19APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL
#20SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#21SEMICONDUCTOR SUBSTRATE GRINDING APPARATUS AND SEMICONDUCTOR SUBSTRATE GRINDING METHOD USING THE SAME
#22Fabrication of a polishing pad for chemical mechanical polishing
#23PLANE POLISHING MACHINE
#24POLISHING APPARATUS FOR SUBSTRATE AND POLISHING METHOD FOR SUBSTRATE USING THE SAME
#25Chemical-mechanical polishing apparatus
#26Machine for finishing a work piece, and having a highly controllable treatment tool
#27POLISHING FIXING DEVICE AND POLISHING APPARATUS
#28Methods for chemical mechanical polishing and forming interconnect structure
#29Asymmetry correction via variable relative velocity of a wafer
#30POLISHING PAD, MANUFACTURING METHOD THEREOF, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
#31MULTIPLE POLISHING HEADS WITH CROSS-ZONE PRESSURE ELEMENT DISTRIBUTIONS FOR CMP
#32Chemical-mechanical polishing system with a potentiostat and pulsed-force applied to a workpiece
#33Polishing apparatus
#34Polishing solution, polishing apparatus, and polishing method
#35Textured glass-based articles with multiple haze levels and processes of producing the same
#36CMP MACHINE WITH IMPROVED THROUGHPUT AND PROCESS FLEXIBILITY
#37NOVEL AUTOMATED POLISHING SYSTEMS AND METHODS RELATING THERETO
#38Apparatus and method for CMP temperature control
#39Substrate processing apparatus and substrate processing method
#40Methods for chemical mechanical polishing and forming interconnect structure
#41Chemical-mechanical polishing apparatus
#42Apparatus for polishing and method of polishing
#43Elastic membrane, substrate holding device, and polishing apparatus
#44Polishing head, wafer polishing apparatus using the same, and wafer polishing method using the same
#45Chemical-mechanical polishing system with a potentiostat and pulsed-force applied to a workpiece
#46Polishing apparatus and polishing method
#47Chemical mechanical polishing apparatus and method
#48Chemical mechanical polishing apparatus and method
#49Semiconductor device, method, and tool of manufacture
#50System and Method of Chemical Mechanical Polishing
#51POLISHING APPARATUS AND POLISHING METHOD
#52Polyurethane polishing pad and composition for manufacturing the same
#53Machine for finishing a work piece, and having a highly controllable treatment tool
#54Chemical mechanical polishing apparatus having scraping fixture
#55System and method of chemical mechanical polishing
#56Apparatus for polishing and method for polishing
#57Fabrication of a polishing pad for chemical mechanical polishing
#58Polishing apparatus
#59Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
#60Substrate processing apparatus and substrate processing method
#61Substrate holding device and substrate processing apparatus including the same
#62Temperature control of chemical mechanical polishing
#63Polishing apparatus
#64Non-transitory computer-readable storage medium storing a program of stretching operation of elastic membrane, method of stretching operation of elastic membrane, and polishing apparatus
#65POLISHING APPARATUS
#66Chemical-mechanical planarization system
#67Polishing device, polishing method, and record medium
#68Silicon wafer single-side polishing method
#69Substrate polishing apparatus and method
#70Wafer polishing method and apparatus
#71CMP MACHINE WITH IMPROVED THROUGHPUT AND PROCESS FLEXIBILITY
#72Elastic membrane, substrate holding device, and polishing apparatus
#73Polishing apparatus and polishing method
#74Semiconductor device, method, and tool of manufacture
#75Polishing method and polishing apparatus
#76Method for conditioning polishing pad and polishing apparatus
#77Polishing method, polishing apparatus, and substrate processing system
#78Heat exchanger for regulating surface temperature of a polishing pad, polishing apparatus, polishing method, and medium storing computer program
#79SUBSTRATE POLISHER AND POLISHING METHOD
#80Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
#81Method and apparatus for within-wafer profile localized tuning
#82Polishing apparatus with a waste liquid receiver
#83Work polishing method and work polishing apparatus
#84Film thickness measuring method, film thickness measuring apparatus, polishing method, and polishing apparatus
#85Machine for finishing a work piece, and having a highly controllable treatment tool
#86Specimen mover and a method of placing specimens in a specimen mover
#87Polishing apparatus
#88Method of processing thin layer
#89Film thickness measuring device, polishing apparatus, film thickness measuring method and polishing method
#90Apparatus and method for polishing a surface of a substrate
#91Substrate processing apparatus
#92Chemical mechanical polishing apparatus
#93POLISHING APPARATUS
#94SUBSTRATE WITH AMORPHOUS, COVALENTLY-BONDED LAYER AND METHOD OF MAKING THE SAME
#95Substrate Processing Apparatus and Substrate Processing System
#96Polishing head, polishing apparatus and polishing method
#97Single side polishing apparatus for wafer
#98Method of polishing SiC substrate
#99Configurable pressure design for multizone chemical mechanical planarization polishing head
#100Polishing apparatus
#101Apparatus and method for chemical mechanical polishing process control
#102Polishing apparatus having end point detecting apparatus detecting polishing end point on basis of current and sliding friction
#103Polishing apparatus
#104Polishing apparatus and retainer ring configuration
#105Method for processing semiconductor wafer
#106Rotary joint and polishing apparatus
#107Substrate holding apparatus and polishing apparatus
#108Retainer ring, polish apparatus, and polish method
#109Substrate holder, polishing apparatus, polishing method, and retaining ring
#110Substrate processing apparatus
#111Methods and apparatus for post-chemical mechanical planarization substrate cleaning
#112Method of polishing one side of wafer and single side polishing apparatus for wafer
#113Method and apparatus for wafer backgrinding and edge trimming on one machine
#114Methods and apparatus for pre-chemical mechanical planarization buffing module
#115SAPPHIRE MATERIAL AND PRODUCTION METHOD THEREOF
#116CHEMICAL MECHANICAL PLANARIZATION SITE ISOLATION REACTOR
#117Floating abrading platen configuration
#118SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND POLISHING APPARATUS
#119Methods for real-time error detection in CMP processing
#120Fabrication method of semiconductor device and chemical mechanical polishing apparatus
#121Chemical mechanical polishing system
#122Wafer pads for fixed-spindle floating-platen lapping
#123METHOD AND APPARATUS FOR REFURBISHING GAS DISTRIBUTION PLATE SURFACES
#124Apparatus and method for target thickness and surface profile uniformity control of multi-head chemical mechanical polishing process
#125Feedback control of polishing using optical detection of clearance
#126Polishing apparatus
#127Semiconductor device manufacturing method
#128TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING
#129Pivot-balanced floating platen lapping machine
#130Workpiece spindles supported floating abrasive platen
#131GLASS SUBSTRATE POLISHING METHOD, PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE AND RADIO TIMEPIECE
#132Fixed-spindle and floating-platen abrasive system using spherical mounts
#133Fixed-spindle floating-platen workpiece loader apparatus
#134Three-point fixed-spindle floating-platen abrasive system
#135Three-point spindle-supported floating abrasive platen
#136Optical disk restoration method and apparatus
#137Polishing apparatus
#138Chemical mechanical polishing apparatus and chemical mechanical polishing method thereof
#139Substrate polishing apparatus