44785 ⎘
Lapping machines or devices; Accessories; Lapping tools; Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
SUBSTRATE POLISHING HEAD FOR OPTICAL ENHANCEMENT ANALYSIS
#2MULTI-LAYER SUB PAD FOR CMP PROCESSES
#3CMP POLISHING PAD WITH PHASE CHANGING MATERIALS
#4CHEMICAL MECHANICAL POLISHING PADS, METHODS OF MANUFACTURING CHEMICAL MECHANICAL POLISHING PADS, AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE
#5CHEMICAL MECHANICAL PLANARIZATION TOOL
#6SEMICONDUCTOR DEVICE FABRICATION METHODS AND DEVICES FOR FORMING THE SAME
#7POLISHING MEDIA ASSEMBLY FOR FIBER OPTIC POLISHING MACHINE
#8Two Component Chemical Mechanical Polishing
#9POLISHING PAD, PREPARATION METHOD THEREOF AND PREPARATION METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
#10CHEMICAL MECHANICAL POLISHING (CMP) PAD AND MANUFACTURING METHOD THEREOF
#11POLISHING PAD AND PREPARATION METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
#12RECYCLED POLISHING PAD AND PREPARATION METHOD THEREOF
#13CHEMICAL MECHANICAL PLANARIZATION (CMP) PADS WITH INTEGRATED WEAR INDICATOR
#14MULTI-LAYER SUB PAD FOR CMP PROCESSES
#15CHEMICAL-MECHANICAL PLANARIZATION PAD AND METHODS OF USE
#16POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING
#17EDDY CURRENT MONITORING TO DETECT VIBRATION IN POLISHING
#18RUBBER MEMBRANE HAVING FIRST AND SECOND HARDNESS FOR USE IN A POLISHING HEAD
#19Two Component Chemical Mechanical Polishing
#20POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS
#21METHOD AND SYSTEM FOR ONLINE INSPECTION OF SURFACE CONDITION OF POLISHING PAD
#22CHEMICAL MECHANICAL POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS COMPRISING THE SAME
#23POLISHING ARTICLES FOR HYBRID BONDING APPLICATIONS
#24GROOVES FOR EDGE AND HOT SPOT COMPENSATION IN CHEMICAL MECHANICAL POLISHING
#25EDGE AND HOT SPOT COMPENSATION TECHNIQUES IN CHEMICAL MECHANICAL POLISHING
#26CHEMICAL MECHANICAL POLISHING EDGE CONTROL WITH PAD RECESSES
#27BUFFING TREATMENT MODULE INCLUDING BUFFING PAD
#28POLISHING PAD
#29LEVERAGED POROMERIC POLISHING PAD
#30MICROREPLICATED POLISHING PAD INCLUDING FLUORINATED POLYMER WINDOW
#31METHOD OF USING POLISHING PAD
#32SEMICONDUCTOR DEVICE FABRICATION METHODS AND DEVICES FOR FORMING THE SAME
#33CHEMICAL MECHANICAL POLISHING APPARATUS
#34POLISHING PAD AND WAFER NOTCH POLISHING METHOD
#35CHEMICAL MECHANICAL PLANARIZATION PADS WITH CONSTANT GROOVE VOLUME
#36POLISHING PAD AND POLISHING METHOD
#37CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF CONTROLLING THE SAME
#38ABRASIVE ARTICLES AND METHODS OF FORMING SAME
#39CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF REPLACING POLISHING PAD USING THE SAME
#40CHEMICAL MECHANICAL POLISHING PAD WITH FLUORINATED POLYMER AND MULTIMODAL GROOVE PATTERN
#41DUAL-LAYER CMP POLISHING SUBPAD
#42MICRO-LAYER CMP POLISHING SUBPAD
#43APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL
#44POLISHING PAD AND POLISHING METHOD
#45METHODS AND PRECURSOR FORMULATIONS FOR FORMING ADVANCED POLISHING PADS BY USE OF AN ADDITIVE MANUFACTURING PROCESS
#46POLISHING SYSTEM WITH PLATEN FOR SUBSTRATE EDGE CONTROL
#47Wafer edge asymmetry correction using groove in polishing pad
#48METHOD FOR MANUFACTURING A POLISHING SHEET AND A POLISHING PAD
#49ADVANCED POLISHING PADS AND RELATED POLISHING PAD MANUFACTURING METHODS
#50MONITORING THICKNESS IN FACE-UP POLISHING WITH ROLLER
#51POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PAD
#52Surface height measurement method using dummy disk
#53Polyurethanes, Polishing Articles and Polishing Systems Therefrom and Method of Use Thereof
#54Method of using polishing pad
#55COMPOSITE PAD FOR CHEMICAL MECHANICAL POLISHING
#56POROUS CHEMICAL MECHANICAL POLISHING PADS
#57CMP POLISHING PAD WITH PROTRUDING STRUCTURES HAVING ENGINEERED OPEN VOID SPACE
#58EDDY CURRENT MONITORING TO DETECT VIBRATION IN POLISHING
#59Polishing apparatus for smoothing diamonds
#60Printing a chemical mechanical polishing pad
#61Chemical mechanical planarization tool
#62SLURRY RECYCLING FOR CHEMICAL MECHANICAL PLANARIZATION SYSTEM
#63POLISHING PAD, CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
#64POLISHING PADS AND SYSTEMS FOR AND METHODS OF USING SAME
#65POLISHING HEAD ASSEMBLY HAVING RECESS AND CAP
#66CMP POLISHING PAD WITH POLISHING ELEMENTS ON SUPPORTS
#67POLISHING PAD WITH WINDOW AND METHOD OF MANUFACTURING THE SAME
#68CHEMICAL PLANARIZATION
#69Chemical mechanical polishing pad and preparation thereof
#70POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
#71POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
#72Polishing pads for high temperature processing
#73ELASTIC MEMBRANE AND METHOD OF MANUFACTURING ELASTIC MEMBRANE
#74POLISHING PAD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
#75POLISHING PAD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
#76Integrated abrasive polishing pads and manufacturing methods
#77CHEMICAL-MECHANICAL PLANARIZATION PAD AND METHODS OF USE
#78POLISHING HEAD ASSEMBLY HAVING RECESS AND CAP
#79POLISHING PAD WITH PROTRUDED POLISHING STRUCTURES, SYSTEM FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING THE SAME
#80CHEMICAL MECHANICAL POLISHING APPARATUS WITH POLISHING PAD INCLUDING DEBRIS DISCHARGE TUNNELS AND METHODS OF OPERATING THE SAME
#81Polishing pads with interconnected pores
#82Abrasive composition and method of manufacturing same
#83POLISHING PAD, MANUFACTURING METHOD THEREOF, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
#84SLURRY RECYCLING FOR CHEMICAL MECHANICAL POLISHING SYSTEM
#85Polishing head, chemical-mechanical polishing system and method for polishing substrate
#86POLISHING PAD, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
#87Polishing Article, Polishing System and Method of Polishing
#88POLISHING PAD AND METHOD FOR MANUFACTURING SAME
#89CONTROLLED PROFILE POLISHING PLATEN
#90Chemical mechanical polishing using time share control
#91CHEMICAL MECHANICAL PLANARIZATION TOOLS, AND RELATED PADS FOR CHEMICAL MECHANICAL PLANARIZATION TOOLS
#92Polishing pad, method for manufacturing polishing pad, and polishing method
#93Formulations for chemical mechanical polishing pads with high planarization efficiency and CMP pads made therewith
#94PITCH LAYER PAD FOR SMOOTHING OPTICAL SURFACES
#95POLISHING PAD, MANUFACTURING METHOD THEREOF, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
#96CMP polishing pad with window having transparency at low wavelengths and material useful in such window
#97GRINDING WHEEL
#98Polishing pad, process for preparing the same, and process for preparing a semiconductor device using the same
#99Polishing pad, method for producing the same and method of fabricating semiconductor device using the same
#100CHEMICAL MECHANICAL POLISHING PAD HAVING PATTERN SUBSTRATE
#101Printing a chemical mechanical polishing pad
#102POLISHING PAD HAVING PATTERN STRUCTURE FORMED ON POLISHING SURFACE, POLISHING DEVICE INCLUDING SAME, AND METHOD FOR MANUFACTURING POLISHING PAD
#103Polishing pad and method of fabricating semiconductor device using the same
#104POLISHING PAD AND POLISHING METHOD
#105Polishing pad, polishing apparatus and a method for polishing silicon wafer
#106Substrate transporter and substrate processing apparatus including substrate transporter
#107Correction of fabricated shapes in additive manufacturing
#108Apparatus and method for CMP temperature control
#109Advanced polishing pads and related polishing pad manufacturing methods
#110Substrate processing apparatus, polishing head, and substrate processing method
#111POLISHING PAD AND POLISHING METHOD USING SAME
#112POLISHING PAD WITH WINDOW AND MANUFACTURING METHODS THEREOF
#113OFFSET PORE POROMERIC POLISHING PAD
#114CMP polishing pad with polishing elements on supports
#115CMP POLISHING PAD WITH PROTRUDING STRUCTURES HAVING ENGINEERED OPEN VOID SPACE
#116Chemical mechanical polishing pad and chemical mechanical polishing apparatus including the same
#117Polishing pad, semiconductor fabricating device and fabricating method of semiconductor device
#118METHOD AND POLISHING APPARATUS FOR MACHINING A PLATE-SHAPED COMPONENT, AND PLATE-SHAPED COMPONENT, IN PARTICULAR ELECTROSTATIC HOLDING APPARATUS OR IMMERSION WAFER PANEL
#119Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
#120POLISHING PAD, PREPARATION METHOD THEREOF, AND PREPARATION METHOD OF SEMICONDUCTOR DEVICE USING SAME
#121Wafer edge asymmetry correction using groove in polishing pad
#122Polishing head for use in chemical mechanical polishing and CMP apparatus having the same
#123POLISHING PAD, PREPARATION METHOD THEREOF, AND PREPARATION METHOD OF SEMICONDUCTOR DEVICE USING SAME
#124Composition for polishing pad and polishing pad
#125Polishing pad, process for preparing the same, and process for preparing a semiconductor device using the same
#126Polishing pads produced by an additive manufacturing process
#127Retaining ring for use in chemical mechanical polishing and CMP apparatus having the same
#128Printing a chemical mechanical polishing pad
#129Method of using polishing pad
#130POLISHING PAD
#131Chemical mechanical planarization tool
#132CMP polishing pad with lobed protruding structures
#133BIASED PULSE CMP GROOVE PATTERN
#134Chemical mechanical planarization pads with constant groove volume
#135Polishing pad for wafer polishing apparatus and manufacturing method therefor
#136Chemical mechanical planarization pads via vat-based production
#137Polishing pad, manufacturing method of polishing pad and polishing method
#138Abrasive articles with precisely shaped features and method of making thereof
#139Controlling chemical mechanical polishing pad stiffness by adjusting wetting in the backing layer
#140Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
#141Polishing system, polishing pad, and related methods
#142POLYMERIC FOAM LAYER AND METHODS OF MAKING THE SAME
#143POLISHING PADS FORMED USING AN ADDITIVE MANUFACTURING PROCESS AND METHODS RELATED THERETO
#144Polishing pad and method for manufacturing same
#145Composition for polishing pad, polishing pad and preparation method thereof
#146Composition for a polishing pad, polishing pad, and process for preparing the same
#147Polishing system with platen for substrate edge control
#148Method for machining a workpiece in the production of an optical element
#149Surface projection polishing pad
#150Substrate processing apparatus
#151Microreplicated polishing surface with enhanced co-planarity
#152CMP pad construction with composite material properties using additive manufacturing processes
#153Correction of fabricated shapes in additive manufacturing
#154Techniques for combining CMP process tracking data with 3D printed CMP consumables
#155Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
#156POLISHING HEAD AND POLISHING CARRIER APPARATUS HAVING THE SAME
#157NON-CONTACT ROTARY UNION
#158Slurry recycling for chemical mechanical polishing system
#159Polishing pad
#160Apparatus and method of forming a polishing article that has a desired zeta potential
#161Polishing layer and polishing method
#162Chemical mechanical polishing apparatus
#163ABRASIVE PAD
#164Apparatus and methods for chemical mechanical polishing
#165Polishing-pad laminated structure, polishing-pad positioning instrument, and method of attaching a polishing pad to a polishing table
#166Polishing pad with improved fluidity of slurry and process for preparing same
#167Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same
#168GELLING REDUCTION TOOL FOR GROOVING CHEMICAL MECHANICAL PLANARIZATION POLISHING PADS
#169PAD CONDITIONER WITH SPACER AND WAFER PLANARIZATION SYSTEM
#170Hydrophilic and zeta potential tunable chemical mechanical polishing pads
#171Polishing head, chemical-mechanical polishing system and method for polishing substrate
#172PRINTED CHEMICAL MECHANICAL POLISHING PAD
#173Gimbal for CMP tool conditioning disk having flexible metal diaphragm
#174POLISHING PAD, SEMICONDUCTOR FABRICATING DEVICE AND FABRICATING METHOD OF SEMICONDUCTOR DEVICE
#175Polishing body and manufacturing method therefor
#176Piezo-electric end-pointing for 3D printed CMP pads
#177Polishing pad with pad wear indicator
#178Polishing pad for chemical mechanical planarization
#179POROUS CHEMICAL MECHANICAL POLISHING PADS
#180Dual-surface polishing device and dual-surface polishing method
#181Polishing head for face-up type polishing apparatus, polishing apparatus including the polishing head, and polishing method using the polishing apparatus
#182Split-window CMP polishing pad and preparation method thereof
#183WAFER POLISHING PAD AND METHOD OF WAFER POLISHING USING THE SAME
#184System, control method and apparatus for chemical mechanical polishing
#185CMP composite groove polishing pad
#186Polishing pad, method for manufacturing polishing pad, and polishing method
#187Method of controlling a temperature of a chemical mechanical polishing process, temperature control, and CMP apparatus including the temperature control
#188Flanged optical endpoint detection windows and CMP polishing pads containing them
#189Method and system for monitoring polishing pad
#190Polishing method and polishing pad
#191Wafer polishing pad and using method thereof
#192Polishing pad with window and manufacturing methods thereof
#193Polishing pad having arc-shaped configuration
#194Abrasive delivery polishing pads and manufacturing methods thereof
#195Integrated abrasive polishing pads and manufacturing methods
#196Abrasive article having a non-uniform distribution of openings
#197Biased pulse CMP groove pattern
#198Controlled residence CMP polishing method
#199Uniform CMP polishing method
#200Trapezoidal CMP groove pattern
#201High-rate CMP polishing method
#202Chemical mechanical polishing pads having offset circumferential grooves for improved removal rate and polishing uniformity
#203Electrostatic chuck optimized for refurbishment
#204Printing a chemical mechanical polishing pad
#205Polishing pad having grooves on bottom surface of top layer
#206Polishing pads and systems and methods of making and using the same
#207GELLING REDUCTION TOOL FOR GROOVING CHEMICAL MECHANICAL PLANARIZATION POLISHING PADS
#208Polishing apparatus
#209Thin plastic polishing article for CMP applications
#210Polishing pad and polishing method
#211Polishing pad and polishing method
#212CMP pad construction with composite material properties using additive manufacturing processes
#213Polishing pad and method of using
#214Polishing pads and systems for and methods of using same
#215Method for deterministic finishing of a chuck surface
#216CHEMICAL MECHANICAL POLISHING PADS HAVING A CONSISTENT PAD SURFACE MICROTEXTURE
#217Tiltable platform for additive manufacturing of a polishing pad
#218Two step curing of polishing pad material in additive manufacturing
#219Lapping device
#220Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
#221Method for manufacturing polishing head, polishing head, and polishing apparatus
#222Chemical mechanical polishing pad and method for manufacturing the same
#223Lapping pads and systems and methods of making and using the same
#224Advanced polishing system
#225Low-defect-porous polishing pad
#226Tapered poromeric polishing pad
#227Tapering method for poromeric polishing pad
#228Manufacturing method of polishing layer, and polishing method
#229Printing a chemical mechanical polishing pad
#230Polishing-layer molded body, and polishing pad
#231POLISHING PAD, POLISHING APPARATUS, AND METHOD FOR MAKING THE POLISHING PAD
#232Double-disc straight groove cylindrical-component surface grinding disc
#233Textured small pad for chemical mechanical polishing
#234Local area polishing system and polishing pad assemblies for a polishing system
#235Debris-removal groove for CMP polishing pad
#236Cylindrical-component grinding device, and workpiece advancing apparatus and grinding method thereof
#237Correction of fabricated shapes in additive manufacturing
#238POLISHING PAD
#239Polishing tool and polishing method for member having curved surface shape
#240Electrostatic chuck optimized for refurbishment
#241Advanced polishing system
#242POLISHING SOLUTIONS AND METHODS OF USING SAME
#243Polishing layer analyzer and method
#244Polishing pad having polishing surface with continuous protrusions
#245Porous chemical mechanical polishing pads
#246Polishing pads and systems and methods of making and using the same
#247Polishing pads and systems and methods of making and using the same
#248Polishing pad
#249Polishing pad, method for manufacturing polishing pad, and polishing method
#250Polishing pad and method for manufacturing the same
#251Apparatus and method of forming a polishing pads by use of an additive manufacturing process
#252Techniques for combining CMP process tracking data with 3D printed CMP consumables
#253Apparatus for forming a polishing article that has a desired zeta potential
#254Advanced polishing pads having compositional gradients by use of an additive manufacturing process
#255Polishing apparatus
#256ABRASIVE PAD AND GLASS SUBSTRATE ABRADING METHOD
#257Interrupted structured abrasive article and methods of polishing a workpiece
#258CMP POLISHING PAD WITH COLUMNAR STRUCTURE AND METHODS RELATED THERETO
#259Buffing pad and methods of making and using the same
#260ABRASIVE MATERIAL HAVING A STRUCTURED SURFACE
#261Polishing layer of polishing pad and method of forming the same and polishing method
#262Chemical mechanical polishing pad composite polishing layer formulation
#263Composite polishing layer chemical mechanical polishing pad
#264Apparatus for printing a chemical mechanical polishing pad
#265POLISHING APPARATUS
#266Grinding tool and method of manufacturing the same
#267Polishing pad window
#268Customized polishing pads for CMP and methods of fabrication and use thereof
#269Multi-layered polishing pads
#270Polishing sheet, polishing tool and polishing method
#271Composite ceramic abrasive polishing solution
#272Low density polishing pad
#273Flexible abrasive for polishing surfaces
#274Advanced polishing pad materials and formulations
#275Polishing pads produced by an additive manufacturing process
#276UNIFORM POLISHING WITH FIXED ABRASIVE PAD
#277Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
#278CMP pad construction with composite material properties using additive manufacturing processes
#279Printed chemical mechanical polishing pad
#280PERMEATED GROOVING IN CMP POLISHING PADS
#281CHEMICAL MECHANICAL POLISHING PAD WITH INTERNAL CHANNELS
#282Polishing pad and method for making the same
#283Wafer polishing apparatus
#284POLISHING PAD WITH CONCENTRIC OR APPROXIMATELY CONCENTRIC POLYGON GROOVE PATTERN
#285Grooved CMP pads
#286Polishing pad configuration and chemical mechanical polishing system
#287Polishing pad configuration and polishing pad support
#288Method to provide an abrasive product surface and abrasive products thereof
#289Method to provide an abrasive product surface and abrasive products thereof
#290Method to provide an abrasive product and abrasive products thereof
#291Polishing pad having porogens with liquid filler
#292POLISHING PAD PRODUCTION METHOD
#293CIRCULAR POLISHING PAD
#294SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE
#295Conditioning of grooving in polishing pads
#296METHOD FOR PRODUCING LAYERED POLISHING PADS
#297Polishing apparatus
#298Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith
#299Apparatus for printing a chemical mechanical polishing pad
#300POLISHING PAD WITH FOUNDATION LAYER AND POLISHING SURFACE LAYER