Patents-Review.com
ClassID:

47995 ⎘

B28D5/0005 - CPC Classification

Classification description:

Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing

Sub-classes:
Recent Application in this class:
#1
20250083358
2025-03-13

DIVIDING METHOD

 #2
20240203804
2024-06-20

ENGINEERED SEMICONDUCTOR SUBSTRATE

 #3
20230307286
2023-09-28

Method for Producing a Layer of Solid Material

 #4
20210233814
2021-07-29

Wafer processing method including crushed layer and wafer processing apparatus

 #5
20210225694
2021-07-22

Method for producing a layer of solid material

 #6
20210213643
2021-07-15

Method for forming a crack in an edge region of a donor substrate

 #7
20210078155
2021-03-18

Hammer

 #8
20200361120
2020-11-19

METHOD OF SEGMENTING SUBSTRATE WITH METAL FILM

 #9
20200251389
2020-08-06

UV laser slicing of β-GaOby micro-crack generation and propagation

 #10
20200185267
2020-06-11

Wafer production method

 #11
20200111710
2020-04-09

Wafer processing method

 #12
20200027739
2020-01-23

LED wafer processing method

 #13
20190242829
2019-08-08

System and method of cleaving of buried defects

 #14
20190237359
2019-08-01

Combined wafer production method with laser treatment and temperature-induced stresses

 #15
20190218131
2019-07-18

Method for guiding a crack in the peripheral region of a donor substrate

 #16
20190206745
2019-07-04

Methods for separating bonded wafer structures

 #17
20180370073
2018-12-27

Method for forming a crack in the edge region of a donor substrate, using an inclined laser beam

 #18
20180229396
2018-08-16

Wafer processing method

 #19
20180211889
2018-07-26

Cleave systems, mountable cleave monitoring systems, and methods for separating bonded wafer structures

 #20
20180185957
2018-07-05

Method for guiding a crack in the peripheral region of a donor substrate

 #21
20160339603
2016-11-24

METHOD FOR SPLITTING CIRCLES

 #22
20160254232
2016-09-01

Combined wafer production method with laser treatment and temperature-induced stresses

 #23
20160074960
2016-03-17

SiC ingot slicing method

 #24
20160035599
2016-02-04

Method of forming a semiconductor die cutting tool

 #25
20130319391
2013-12-05

RECOVERY OF SILICON VALUE FROM KERF SILICON WASTE

 #26
20120298710
2012-11-29

SUBSTRATE-SPLITTING DEVICE WITH DETECTION OF OBSTACLES

 #27
20120061356
2012-03-15

LASER MACHINING DEVICE AND LASER MACHINING METHOD

 #28
20110318877
2011-12-29

Dicing methods

 #29
20110155706
2011-06-30

Processing method for a workpiece, dividing method for a workpiece, and laser processing apparatus

 #30
20100184272
2010-07-22

Semiconductor die singulation method

 #31
20100133659
2010-06-03

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT CHIP

 #32
20090311948
2009-12-17

METHOD FOR PRODUCING SEMICONDUCTOR WAFER

 #33
20090042366
2009-02-12

Semiconductor die singulation method

 #34
20060138189
2006-06-29

Apparatus and method for splitting substrates