B28D5/0041 - CPC Classification Index

ClassID:

48001 ⎘

B28D5/0041 - CPC Classification

Classification description:

Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking

Sub-classes:

B28D5/0047 » {using fluid or gas pressure} 6

Recent Application in this class:

20250066169

2025-02-27

UPPER JACKING STRUCTURE, HALF-SLITTING MACHINE AND HALF-SLITTING METHOD

20210225672

2021-07-22

Cold fluid semiconductor device release during pick and place operations, and associated systems and methods

20190326142

2019-10-24

Cold fluid semiconductor device release during pick and place operations, and associated systems and methods

20190067053

2019-02-28

Cold fluid semiconductor device release during pick and place operations, and associated systems and methods

20170087744

2017-03-30

Device and method for cleaving

20150104931

2015-04-16

Apparatus, device and method for wafer dicing

20130119106

2013-05-16

Device and Method for Cleaving.

20120160227

2012-06-28

WAFER SPLITTING APPARATUS AND WAFER SPLITTING PROCESS

20100175834

2010-07-15

WAFER SPLITTING LAMINATE MECHANISM

#10

20070048972

2007-03-01

Method and apparatus for breaking semiconductor wafers