47997 ⎘
Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
Sub-classes:Automated transfer and drying tool for process chamber
#2Cold fluid semiconductor device release during pick and place operations, and associated systems and methods
#3Dividing device for wafer
#4Automated transfer and drying tool for process chamber
#5Method of separating a back layer on a singulated semiconductor wafer attached to carrier substrate
#6Cold fluid semiconductor device release during pick and place operations, and associated systems and methods
#7Method of separating a back layer on a singulated semiconductor wafer attached to carrier substrates
#8Automated transfer and drying tool for process chamber
#9Cold fluid semiconductor device release during pick and place operations, and associated systems and methods
#10Method of singulating semiconductor wafer having a plurality of die and a back layer disposed along a major surface
#11Device and method for cleaving a crystalline sample
#12Method of singulating semiconductor wafer having back layer
#13Singulation apparatus and method
#14Method and device for separating a structure